Horst Clauberg

1.4k total citations
42 papers, 1.1k citations indexed

About

Horst Clauberg is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Horst Clauberg has authored 42 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Horst Clauberg's work include Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (26 papers) and Advanced Chemical Physics Studies (6 papers). Horst Clauberg is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (26 papers) and Advanced Chemical Physics Studies (6 papers). Horst Clauberg collaborates with scholars based in United States, Germany and Japan. Horst Clauberg's co-authors include Peter Chen, Daniel Köhn, Bob Chylak, David W. Minsek, Ivy Qin, Hui Xu, Viola L. Acoff, Xu Zhang, C. Bradley Moore and C. E. Hoyle and has published in prestigious journals such as Journal of the American Chemical Society, Accounts of Chemical Research and Acta Materialia.

In The Last Decade

Horst Clauberg

41 papers receiving 1.0k citations

Peers

Countries citing papers authored by Horst Clauberg

Since Specialization

Citations

This map shows the geographic impact of Horst Clauberg's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Horst Clauberg with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Horst Clauberg more than expected).

Fields of papers citing papers by Horst Clauberg

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Horst Clauberg. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Horst Clauberg. The network helps show where Horst Clauberg may publish in the future.

Co-authorship network of co-authors of Horst Clauberg

This figure shows the co-authorship network connecting the top 25 collaborators of Horst Clauberg. A scholar is included among the top collaborators of Horst Clauberg based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Horst Clauberg. Horst Clauberg is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work	Indexed citations
1	Advances in Memory Die Stacking 2018 ·A. Marte, (unknown), Jie Wu, (unknown), Horst Clauberg, (unknown), Bob Chylak, (unknown), (unknown)	2
2	Numerical Simulations of Joint-to-Joint Temperature Variation During Thermo-Compression Bonding 2017 ·(unknown), Ali Reza Rezvani, Horst Clauberg, Ivy Qin, M. Mayer	2
3	Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding 2017 ·Microelectronics Reliability ·(unknown), (unknown), Ali Reza Rezvani, Horst Clauberg, M. Mayer	6
4	High throughput thermocompression bonding enabled with a flexible manufacturing platform 2016 ·(unknown), Horst Clauberg	2
5	New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study 2016 ·Scripta Materialia ·Hui Xu, Ivy Qin, Horst Clauberg, Bob Chylak, Viola L. Acoff	29
6	Thermocompression flip chip bonding optimization for pre-applied underfill 2015 ·Horst Clauberg, Ali Reza Rezvani, (unknown), (unknown), (unknown), (unknown), (unknown), Bob Chylak	7
7	Advanced thermocompression flip chip bonding 2014 ·Horst Clauberg, Ali Reza Rezvani, Evan Galipeau, (unknown), (unknown), (unknown), (unknown), Bob Chylak	1
8	High Productivity Thermo-Compression Flip Chip Bonding 2014 ·IMAPSource Proceedings ·(unknown), Horst Clauberg, Evan Galipeau, (unknown), (unknown), Bob Chylak	2
9	Ball Bond Process Optimization with Cu and Pd-Coated Cu Wire 2012 ·ECS Transactions ·Ivy Qin, Bob Chylak, Horst Clauberg, (unknown), (unknown)	5
10	Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing 2012 ·IMAPSource Proceedings ·(unknown), (unknown), (unknown), (unknown), (unknown), Ivy Qin, Cuong Huynh, Horst Clauberg, (unknown), Bob Chylak, Hui Xu, Viola L. Acoff	5
11	Characterization of a wire bonding process with the added challenges from palladium-coated copper wires 2012 ·(unknown), (unknown), (unknown), (unknown), Horst Clauberg, (unknown), Bob Chylak	4
12	Copper wire bond investigation on multiple surface finishes - enabling wire bond packages without gold 2011 ·European Microelectronics and Packaging Conference ·(unknown), Nigel D. White, Horst Clauberg	3
13	Copper high volume manufacturing R&D to production 2011 ·Bob Chylak, Horst Clauberg, (unknown), Ivy Qin, (unknown)	7
14	Nickel–palladium bond pads for copper wire bonding 2010 ·Microelectronics Reliability ·Horst Clauberg, (unknown), Bob Chylak	51
15	Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding 2009 ·ECS Transactions ·Bob Chylak, (unknown), Horst Clauberg, (unknown)	31
16	Vibrational Assignment and Anharmonic Resonance Analysis of the Dispersed Fluorescence and Stimulated Emission Pumping Spectra of DFCO (S0) up to 9000 cm−1 1997 ·Journal of Molecular Spectroscopy ·Jason C. Crane, Akio Kawai, Hakhyun Nam, Horst Clauberg, (unknown), (unknown), C. Bradley Moore	11
17	ChemInform Abstract: Mass and Photoelectron Spectroscopy of C3H2. δHf of Singlet Carbenes Deviate from Additivity by Their Singlet‐Triplet Gaps. 1992 ·ChemInform ·Horst Clauberg, David W. Minsek, (unknown)	1
18	Photoionization mass and photoelectron spectroscopy of radicals, carbenes, and biradicals 1992 ·Accounts of Chemical Research ·(unknown), Horst Clauberg, Daniel Köhn, David W. Minsek, Xu Zhang, Peter Chen	79
19	Mass and photoelectron spectroscopy of C3H2. .DELTA.Hf of singlet carbenes deviate from additivity by their singlet-triplet gaps 1992 ·Journal of the American Chemical Society ·Horst Clauberg, David W. Minsek, Peter Chen	104
20	Photoelectron spectrum of cyclopropenylidene and weak bonds in cyclopropenyl radical 1991 ·Journal of the American Chemical Society ·Horst Clauberg, Peter Chen	21

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact