Hai Ren

464 total citations
14 papers, 342 citations indexed

About

Hai Ren is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Hai Ren has authored 14 papers receiving a total of 342 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Automotive Engineering. Recurrent topics in Hai Ren's work include Silicon Carbide Semiconductor Technologies (11 papers), Phase Change Materials Research (3 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). Hai Ren is often cited by papers focused on Silicon Carbide Semiconductor Technologies (11 papers), Phase Change Materials Research (3 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). Hai Ren collaborates with scholars based in China and United Kingdom. Hai Ren's co-authors include Li Ran, Wei Lai, Philip Mawby, Hui Li, Ran Yao, Zheng Zeng, Borong Hu, Olayiwola Alatise, Bing Gao and C. Bailey and has published in prestigious journals such as International Journal of Heat and Mass Transfer, IEEE Transactions on Industry Applications and IEEE Transactions on Electron Devices.

In The Last Decade

Hai Ren

14 papers receiving 332 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Hai Ren China	9	301	104	38	30	30	14	342
Borong Hu United Kingdom	9	338 1.1×	84 0.8×	30 0.8×	20 0.7×	22 0.7×	38	384
Asier Matallana Spain	7	272 0.9×	95 0.9×	25 0.7×	82 2.7×	25 0.8×	11	330
Mohd. Amir Eleffendi United Kingdom	6	347 1.2×	54 0.5×	38 1.0×	16 0.5×	22 0.7×	7	365
Max Poech Germany	7	589 2.0×	106 1.0×	42 1.1×	39 1.3×	16 0.5×	10	626
Joshua Major United States	12	227 0.8×	120 1.2×	16 0.4×	50 1.7×	63 2.1×	29	317
Reinhold Bayerer Germany	9	695 2.3×	96 0.9×	57 1.5×	62 2.1×	38 1.3×	17	728
Nick Baker Denmark	13	826 2.7×	85 0.8×	67 1.8×	37 1.2×	14 0.5×	28	856
M. Thoben Germany	13	520 1.7×	167 1.6×	20 0.5×	31 1.0×	40 1.3×	26	559
Kristian Bonderup Pedersen Denmark	14	470 1.6×	95 0.9×	31 0.8×	29 1.0×	27 0.9×	24	504
L. Meysenc France	9	518 1.7×	150 1.4×	104 2.7×	22 0.7×	28 0.9×	14	583

Countries citing papers authored by Hai Ren

Since Specialization

Citations

This map shows the geographic impact of Hai Ren's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hai Ren with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hai Ren more than expected).

Fields of papers citing papers by Hai Ren

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hai Ren. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hai Ren. The network helps show where Hai Ren may publish in the future.

Co-authorship network of co-authors of Hai Ren

This figure shows the co-authorship network connecting the top 25 collaborators of Hai Ren. A scholar is included among the top collaborators of Hai Ren based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hai Ren. Hai Ren is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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14 of 14 papers shown

Ren, Hai, Siniša Djurović, Li Ran, et al.. (2022). In Situ Contact Pressure Monitoring of Press Pack Power Module Using FBG Sensors. IEEE Transactions on Instrumentation and Measurement. 71. 1–11. 6 indexed citations

Ren, Hai, Li Ran, Xianming Liu, et al.. (2021). Quasi-Distributed Temperature Detection of Press-Pack IGBT Power Module Using FBG Sensing. IEEE Journal of Emerging and Selected Topics in Power Electronics. 10(5). 4981–4992. 16 indexed citations

Jiang, Huaping, et al.. (2021). A ᐃT _j Reduced Power Module With Inbuilt Phase Change Material for Reliability Enhancement. IEEE Transactions on Electron Devices. 68(9). 4557–4564. 14 indexed citations

Ren, Hai, Weihua Shao, Li Ran, et al.. (2021). A Phase Change Material Integrated Press Pack Power Module With Enhanced Overcurrent Capability for Grid Support—A Study on FRD. IEEE Transactions on Industry Applications. 57(4). 3956–3968. 20 indexed citations

Zhou, Lin, et al.. (2020). Study on thermal buffering effect of phase change material on press- pack IGBT. International Journal of Heat and Mass Transfer. 154. 119584–119584. 18 indexed citations

Fang, Xin, Huaping Jiang, Xiaoyong Wang, et al.. (2020). Reliability Enhancement of Power Modules by Restricting Junction Temperature Fluctuation through Increased Transient Thermal Capacity. 4024–4028. 5 indexed citations

Zhou, Lin, et al.. (2020). Study on Improving the Short-Time Overcurrent Capability of Press- pack IGBTs Using Phase Change Materials. 2173–2177. 4 indexed citations

Ren, Hai, Weihua Shao, Li Ran, et al.. (2019). Thermal Buffering Effect of Phase Change Material on Press-pack IGBT during Power Pulse. 4937–4943. 8 indexed citations

Li, Hui, Ran Yao, Wei Lai, Hai Ren, & Jingyuan Li. (2019). Modeling and Analysis on Overall Fatigue Failure Evolution of Press-Pack IGBT Device. IEEE Transactions on Electron Devices. 66(3). 1435–1443. 46 indexed citations

10.

Ren, Hai, Wei Lai, Ran Yao, et al.. (2018). Finite element model optimization and thermal network parameter extraction of press-pack IGBT. 2892–2899. 13 indexed citations

11.

Lai, Wei, Hui Li, Minyou Chen, et al.. (2018). Investigation on the Effects of Unbalanced Clamping Force on Multichip Press Pack IGBT Modules. IEEE Journal of Emerging and Selected Topics in Power Electronics. 7(4). 2314–2322. 43 indexed citations

12.

Hu, Borong, Zheng Zeng, Weihua Shao, et al.. (2017). Novel cooling technology to reduce thermal impedance and thermomechanical stress for SiC application. 3063–3067. 4 indexed citations

13.

Hu, Borong, Jose Ortiz Gonzalez, Li Ran, et al.. (2017). Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device. IEEE Transactions on Device and Materials Reliability. 17(4). 727–737. 142 indexed citations

14.

Gonzalez, Jose Ortiz, Li Ran, Olayiwola Alatise, et al.. (2016). Enabling high reliability power modules: A multidisciplinary task. Warwick Research Archive Portal (University of Warwick). 1–5. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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