Standout Papers

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and sys... 2001 2026 2009 2017 470
  1. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration (2001)
    Kaustav Banerjee, S.J. Souri et al. Proceedings of the IEEE

Immediate Impact

3 by Nobel laureates 41 from Science/Nature 77 standout
Sub-graph 1 of 22

Citing Papers

Three-dimensional integration of two-dimensional field-effect transistors
2024 StandoutNature
Monolithic three-dimensional tier-by-tier integration via van der Waals lamination
2024 StandoutNature
4 intermediate papers

Works of S.J. Souri being referenced

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
2001 Standout
3-D ICs: Motivation, performance analysis, and technology
2000

Author Peers

Author Last Decade Papers Cites
S.J. Souri 735 38 4 129 128 8 800
Anna W. Topol 596 46 5 104 106 13 676
K. Bernstein 914 30 2 76 114 9 978
Arif Rahman 526 21 2 47 75 15 673
Paul Andry 768 70 5 157 70 21 868
C.S. Patel 854 58 5 55 206 15 912
E. Sprogis 702 74 23 66 48 11 761
John Knickerbocker 845 75 5 99 57 25 970
Cornelia Tsang 659 61 4 53 44 12 711
R. Polastre 685 54 9 125 41 16 918
Gyouho Kim 702 32 18 57 74 21 798

All Works

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2026