Immediate Impact
18 standout
Citing Papers
A review of lead-free solders for electronics applications
2017 Standout
Recovery of metals and nonmetals from electronic waste by physical and chemical recycling processes
2016 Standout
Works of Anthony Primavera being referenced
Effect of voids on the reliability of BGA/CSP solder joints
2003
Solder metallization interdiffusion in microelectronic interconnects
2000
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Anthony Primavera | 146 | 94 | 34 | 8 | 180 | |
| Hua Chai | 181 | 56 | 14 | 11 | 286 | |
| T. Dishongh | 95 | 44 | 52 | 10 | 149 | |
| S. Taib | 37 | 26 | 56 | 7 | 106 | |
| Mark Mihalic | 154 | 90 | 27 | 9 | 259 | |
| Paresh Limaye | 152 | 96 | 41 | 11 | 185 | |
| Scott McCann | 64 | 22 | 23 | 13 | 138 | |
| Hai Ren | 222 | 76 | 13 | 9 | 255 | |
| Ling Jiang | 81 | 157 | 55 | 15 | 283 | |
| Shuai Shao | 74 | 24 | 22 | 13 | 134 | |
| Charles Arvin | 120 | 264 | 26 | 12 | 288 |
All Works
Loading papers...