IEEE Transactions on Components Packaging and Manufacturing Technology

3.3k papers and 34.1k indexed citations

About

The 3.3k papers published in IEEE Transactions on Components Packaging and Manufacturing Technology in the last decades have received a total of 34.1k indexed citations. Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology usually cover Electrical and Electronic Engineering (2.7k papers), Mechanical Engineering (753 papers) and Aerospace Engineering (464 papers) specifically the topics of 3D IC and TSV technologies (1.0k papers), Electronic Packaging and Soldering Technologies (934 papers) and Electromagnetic Compatibility and Noise Suppression (572 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology are John H. Lau, Kuan Yew Cheong, Madhavan Swaminathan, Vemal Raja Manikam, Muhannad S. Bakir, Rao Tummala, Ashraf Uz Zaman, Lei Zhu, Per-Simon Kildal and Guo‐Quan Lu.

In The Last Decade

IEEE Transactions on Components Packaging and Manufacturing Technology

3.0k papers receiving 33.1k citations

Fields of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Components Packaging and Manufacturing Technology.

Countries where authors publish in IEEE Transactions on Components Packaging and Manufacturing Technology

Since Specialization
Citations

This map shows the geographic impact of research published in IEEE Transactions on Components Packaging and Manufacturing Technology. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Components Packaging and Manufacturing Technology with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Components Packaging and Manufacturing Technology more than expected).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar’s output or impact.

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2026