IEEE Transactions on Electronics Packaging Manufacturing

449 papers and 8.1k indexed citations i.

About

The 449 papers published in IEEE Transactions on Electronics Packaging Manufacturing in the last decades have received a total of 8.1k indexed citations. Papers published in IEEE Transactions on Electronics Packaging Manufacturing usually cover Electrical and Electronic Engineering (325 papers), Mechanical Engineering (120 papers) and Industrial and Manufacturing Engineering (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (230 papers), 3D IC and TSV technologies (154 papers) and Manufacturing Process and Optimization (47 papers). The most active scholars publishing in IEEE Transactions on Electronics Packaging Manufacturing are Andrew Kusiak, G.T. Galyon, Wayne Johnson, J. R. Thompson, John L. Evans, Peter Jacobsen, Ampere A. Tseng, Guo‐Quan Lu, C.P. Wong and Michael Pecht.

In The Last Decade

Fields of papers published in IEEE Transactions on Electronics Packaging Manufacturing

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in IEEE Transactions on Electronics Packaging Manufacturing. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Electronics Packaging Manufacturing.

Countries where authors publish in IEEE Transactions on Electronics Packaging Manufacturing

Since Specialization
Citations

This map shows the geographic impact of research published in IEEE Transactions on Electronics Packaging Manufacturing. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Electronics Packaging Manufacturing with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Electronics Packaging Manufacturing more than expected).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar’s output or impact.

Explore journals with similar magnitude of impact

Rankless by CCL
2025