Yungseon Eo
Impact in
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing
-
- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
- Electrostatic Discharge in Electronics
- 3D IC and TSV technologies
- VLSI and FPGA Design Techniques
- Photonic and Optical Devices
- Microwave and Dielectric Measurement Techniques
Papers in
-
- VLSI and Analog Circuit Testing 9
-
- Electromagnetic Compatibility and Noise Suppression 31
- Low-power high-performance VLSI design 15
- Electrostatic Discharge in Electronics 8
- Advancements in PLL and VCO Technologies 7
- Microwave and Dielectric Measurement Techniques 7
- Photonic and Optical Devices 6
- 3D IC and TSV technologies 6
- Co-authors
- W.R. EisenstadtJong‐In ShimTaehoon KimOh‐Kyong KwonHyewon KimDongchul KimDong-Hoon JangFrank Chung-Hoon Rhee
- Journals
- IEEE Transactions on Advanced Packaging (5 papers)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (4 papers)IEEE Transactions on Microwave Theory and Techniques (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (2 papers)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Yungseon Eo
39 papers receiving 317 citations
Peers
Comparison fields: 5 of 33
- Hardware and Architecture 40
- Electrical and Electronic Engineering 330
- Atomic and Molecular Physics, and Optics 36
- Surfaces, Coatings and Films 5
- Structural Biology 1
Countries citing papers authored by Yungseon Eo
This map shows the geographic impact of Yungseon Eo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yungseon Eo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yungseon Eo more than expected).
Fields of papers citing papers by Yungseon Eo
This network shows the impact of papers produced by Yungseon Eo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yungseon Eo. The network helps show where Yungseon Eo may publish in the future.
Co-authors
The 18 scholars most cited alongside Yungseon Eo, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2022 | 1 | |
| 3 | 2022 | 1 | |
| 4 | 2019 | 1 | |
| 5 | 2019 | 11 | |
| 6 | 2019 | 1 | |
| 7 | 2012 | 6 | |
| 8 | 2009 | 1 | |
| 9 | 2008 | 21 | |
| 10 | Traveling-wave-based Waveform Approximation Technique (TWA) for Efficient Signal Integrity Verification of Strongly Coupled VLSI Interconnect Lines | 2007 | 2 |
| 11 | 2007 | 1 | |
| 12 | Ohmic contacts of Pd/Zn/M(=Pd or Pt)/Au to p-type InP | 2005 | 1 |
| 13 | 2005 | 1 | |
| 14 | 2004 | 23 | |
| 15 | 2003 | 3 | |
| 16 | 2002 | 2 | |
| 17 | 2002 | 14 | |
| 18 | 2002 | 26 | |
| 19 | Non-uniform Multi-Layer IC Interconnect Transmission Line Characterization for Fast Signal Transient Simulation of High-Speed/High-Density VLSI Circuits (Special Issue on TCAD for Semiconductor Industries) | 1999 | 4 |
| 20 | 1995 | 5 |
About Yungseon Eo
Yungseon Eo is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Condensed Matter Physics and Biomedical Engineering, having authored 46 papers that have together received 349 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (31 papers), Low-power high-performance VLSI design (15 papers), VLSI and Analog Circuit Testing (9 papers), Electrostatic Discharge in Electronics (8 papers), Advancements in PLL and VCO Technologies (7 papers), Microwave and Dielectric Measurement Techniques (7 papers), Photonic and Optical Devices (6 papers) and 3D IC and TSV technologies (6 papers). The work is most often cited by research in Hardware and Architecture (40 citations), Electrical and Electronic Engineering (330 citations), Atomic and Molecular Physics, and Optics (36 citations), Surfaces, Coatings and Films (5 citations) and Structural Biology (1 citation). Yungseon Eo has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include W.R. Eisenstadt, Jong‐In Shim, Taehoon Kim, Oh‐Kyong Kwon, Hyewon Kim, Dongchul Kim, Dong-Hoon Jang, Dongchul Kim, Frank Chung-Hoon Rhee and Sangmoon Lee. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.