Fengjiang Wang

2.3k total citations
101 papers, 1.6k citations indexed

About

Fengjiang Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Fengjiang Wang has authored 101 papers receiving a total of 1.6k indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 52 papers in Mechanical Engineering and 13 papers in Mechanics of Materials. Recurrent topics in Fengjiang Wang's work include Electronic Packaging and Soldering Technologies (51 papers), 3D IC and TSV technologies (41 papers) and Advanced Welding Techniques Analysis (20 papers). Fengjiang Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (51 papers), 3D IC and TSV technologies (41 papers) and Advanced Welding Techniques Analysis (20 papers). Fengjiang Wang collaborates with scholars based in China, United States and Australia. Fengjiang Wang's co-authors include Ying Huang, Lawrence M. Sayre, Zhijie Zhang, Luting Liu, Yiyu Qian, Xin Ma, Chao Yan, James R. Hauske, Hong Chen and Xiaojing Wang and has published in prestigious journals such as Journal of the American Chemical Society, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Fengjiang Wang

92 papers receiving 1.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fengjiang Wang China 23 1.1k 960 176 168 150 101 1.6k
Kui Xu China 22 678 0.6× 87 0.1× 129 0.7× 162 1.0× 151 1.0× 59 1.7k
Xiaotong Jia China 21 532 0.5× 211 0.2× 59 0.3× 169 1.0× 80 0.5× 78 1.6k
Jingwen Wang China 17 216 0.2× 109 0.1× 186 1.1× 52 0.3× 56 0.4× 68 1.2k
Bingjie Zhao China 22 469 0.4× 169 0.2× 50 0.3× 243 1.4× 43 0.3× 88 1.5k
Qiufen Wang China 24 793 0.7× 140 0.1× 222 1.3× 162 1.0× 15 0.1× 94 1.6k
Gang Yu China 18 186 0.2× 181 0.2× 48 0.3× 45 0.3× 46 0.3× 105 991
Shinya Otsuka Japan 24 89 0.1× 383 0.4× 34 0.2× 1.1k 6.5× 19 0.1× 70 1.9k
Yanan Shi China 29 644 0.6× 148 0.2× 518 2.9× 237 1.4× 21 0.1× 94 2.6k
Naoya Satoh Japan 15 30 0.0× 273 0.3× 71 0.4× 89 0.5× 65 0.4× 37 792

Countries citing papers authored by Fengjiang Wang

Since Specialization
Citations

This map shows the geographic impact of Fengjiang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengjiang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengjiang Wang more than expected).

Fields of papers citing papers by Fengjiang Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fengjiang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengjiang Wang. The network helps show where Fengjiang Wang may publish in the future.

Co-authorship network of co-authors of Fengjiang Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Fengjiang Wang. A scholar is included among the top collaborators of Fengjiang Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fengjiang Wang. Fengjiang Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Han, Yan, et al.. (2025). Microstructure and reliability of Sn15Bi-xAg solder joints on Ni and Cu substrates during thermal cycling. Materials Today Communications. 44. 111916–111916. 2 indexed citations
2.
Li, Sijin, Xiaowei Wang, Mingqing Liao, et al.. (2025). Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review. Journal of Materials Research and Technology. 35. 5067–5083. 2 indexed citations
3.
Wang, Fengjiang, et al.. (2024). CHEABC-QCRP: A novel QoS-aware cluster routing protocol for industrial IoT. Simulation Modelling Practice and Theory. 134. 102951–102951. 1 indexed citations
4.
5.
Liao, Mingqing, et al.. (2024). Structural, mechanical and thermodynamic properties of Mg24RE5: A first-principles investigation. Vacuum. 228. 113511–113511. 3 indexed citations
6.
Liao, Mingqing, Fei Zhou, Fengjiang Wang, Bin Liu, & Chao Xu. (2023). Elastic and thermodynamic properties of B2-MgX intermetallics: A high throughput first-principles investigation. Vacuum. 218. 112646–112646. 6 indexed citations
7.
8.
Wang, Fengjiang, et al.. (2020). Effect of Different Ag Content on the Structural and Mechanical Properties of Sn15Bi Solder. ES Materials & Manufacturing. 5 indexed citations
9.
Wu, Mingfang, Fei Liu, Fengjiang Wang, & Yanxin Qiao. (2015). INTERFACIAL REACTION AND STRENGTHENING MECHANISM OF CERAMIC MATRIX COMPOSITE JOINTS USING LIQUID PHASE DIFFUSION BONDING WITH AUXILIARY PULSE CURRENT. Acta Metallurgica Sinica. 51(9). 1129–1135. 2 indexed citations
10.
Wang, Yanlai, et al.. (2014). Sn‐Biはんだの引張特性に及ぼすZn,Zn‐AlおよびZn‐添加の影響. Acta Metallurgica Sinica. 27(6). 1159–1164. 4 indexed citations
11.
Wu, Mingfang, et al.. (2014). PARTIALLY TRANSIENT LIQUID PHASE-DIFFUSION BONDING ON Ti(C, N)-Al2O3 CERAMIC MATRIX COMPOSITES USING Zr/Cu/Zr AS INTERLAYER. Acta Metallurgica Sinica. 50(5). 619–625. 2 indexed citations
12.
Wang, Fengjiang. (2011). Triaxial Compression Test on Multilayer Reinforced Tailing Fine Sand. Journal of Shanxi University. 1 indexed citations
13.
Wang, Fengjiang. (2011). Analysis on growth mechanism on interfacial interlayer on Fe/Al couple. Transactions of the China Welding Institution. 4 indexed citations
14.
Shao, Liming, Michael C. Hewitt, Fengjiang Wang, et al.. (2011). Discovery of N-methyl-1-(1-phenylcyclohexyl)methanamine, a novel triple serotonin, norepinephrine, and dopamine reuptake inhibitor. Bioorganic & Medicinal Chemistry Letters. 21(5). 1438–1441. 7 indexed citations
15.
Qian, Yiyu, et al.. (2009). Simulation on Thermal Integrity of the Fin/Tube Brazed Joint of Heat Exchangers. Journal of Material Science and Technology. 19. 71–72. 1 indexed citations
16.
Wang, Fengjiang, et al.. (2005). Measurement of Mechanical Properties of Sn--Ag--Cu Bulk Solder BGA Solder Joint Using Nanoindentation. Acta Metallurgica Sinica. 41(7). 775–779. 12 indexed citations
17.
Wang, Fengjiang. (2002). Discuss on stability of rock drain-dump on tailing foundation. Journal of Liaoning Technical University. 1 indexed citations
18.
Sayre, Lawrence M., Fengjiang Wang, Pramod K. Arora, et al.. (1991). Dopaminergic Neurotoxicity In Vivo and Inhibition of Mitochondrial Respiration In Vitro by Possible Endogenous Pyridinium‐Like Substances. Journal of Neurochemistry. 57(6). 2106–2115. 26 indexed citations
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Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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