Fengjiang Wang
Impact in
- General Materials Science top 1%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 2%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in ⓘ
-
- Electronic Packaging and Soldering Technologies 51
- 3D IC and TSV technologies 41
-
- Advanced Welding Techniques Analysis 20
- Intermetallics and Advanced Alloy Properties 19
- Aluminum Alloys Composites Properties 9
- Co-authors
- Ying Huang (7 shared papers)Lawrence M. Sayre (7 shared papers)Zhijie Zhang (2 shared papers)Luting Liu (6 shared papers)Xin Ma (4 shared papers)Yiyu Qian (5 shared papers)Chao Yan (4 shared papers)James R. Hauske (2 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (14 papers)Bioorganic & Medicinal Chemistry Letters (4 papers)Journal of Alloys and Compounds (4 papers)Journal of Electronic Materials (4 papers)Materials (3 papers)
- Partner nations
- ChinaUnited StatesAustralia
In The Last Decade
Fengjiang Wang
92 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 87
- General Materials Science 100
- Mechanical Engineering 960
- Electrical and Electronic Engineering 1.1k
- Aerospace Engineering 176
- Mechanics of Materials 150
Countries citing papers authored by Fengjiang Wang
This map shows the geographic impact of Fengjiang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengjiang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengjiang Wang more than expected).
Fields of papers citing papers by Fengjiang Wang
This network shows the impact of papers produced by Fengjiang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengjiang Wang. The network helps show where Fengjiang Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Fengjiang Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 101 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 158 | |
| 2 | 2003 | 96 | |
| 3 | 2017 | 82 | |
| 4 | 2021 | 68 | |
| 5 | 2006 | 60 | |
| 6 | 2022 | 57 | |
| 7 | 2016 | 54 | |
| 8 | 2006 | 47 | |
| 9 | 2006 | 46 | |
| 10 | 1992 | 44 | |
| 11 | 2008 | 42 | |
| 12 | 2012 | 39 | |
| 13 | 2017 | 37 | |
| 14 | 2016 | 36 | |
| 15 | 1997 | 35 | |
| 16 | 2018 | 35 | |
| 17 | 1997 | 34 | |
| 18 | 1989 | 30 | |
| 19 | 2018 | 27 | |
| 20 | 1991 | 26 |
About Fengjiang Wang
Fengjiang Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Organic Chemistry and Materials Chemistry, having authored 101 papers that have together received 1.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (51 papers), 3D IC and TSV technologies (41 papers), Advanced Welding Techniques Analysis (20 papers), Intermetallics and Advanced Alloy Properties (19 papers), Aluminum Alloys Composites Properties (9 papers), Neuroscience and Neuropharmacology Research (8 papers), Copper Interconnects and Reliability (7 papers) and Metal and Thin Film Mechanics (7 papers). The work is most often cited by research in General Materials Science (100 citations), Mechanical Engineering (960 citations), Electrical and Electronic Engineering (1.1k citations), Aerospace Engineering (176 citations) and Mechanics of Materials (150 citations). Fengjiang Wang has collaborated with scholars based in China, United States and Australia. Frequent co-authors include Ying Huang, Lawrence M. Sayre, Zhijie Zhang, Luting Liu, Xin Ma, Yiyu Qian, Chao Yan, James R. Hauske, Hong Chen and Xiaojing Wang. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Bioorganic & Medicinal Chemistry Letters, Journal of Alloys and Compounds, Journal of Electronic Materials and Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.