L.E. Felton
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Aerospace Engineering top 10%
- Materials Chemistry
- General Materials Science top 1%
- Co-authors
- Wenge YangRobert W. MesslerD. B. KnorrJ.A. SchwarzP. J. FicaloraDaeyong LeeMichael A. ZimmermanRafael Navarro
- Topics
- Electronic Packaging and Soldering Technologies (17 papers)3D IC and TSV technologies (9 papers)Copper Interconnects and Reliability (5 papers)
- Partner nations
- United StatesGermany
In The Last Decade
L.E. Felton
22 papers receiving 743 citations
Peers
Comparison fields: 5 of 58
- Electrical and Electronic Engineering 674
- Mechanical Engineering 452
- Aerospace Engineering 122
- Materials Chemistry 87
- General Materials Science 69
Countries citing papers authored by L.E. Felton
This map shows the geographic impact of L.E. Felton's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.E. Felton with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.E. Felton more than expected).
Fields of papers citing papers by L.E. Felton
This network shows the impact of papers produced by L.E. Felton. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.E. Felton. The network helps show where L.E. Felton may publish in the future.
Co-authorship network of co-authors of L.E. Felton
This figure shows the co-authorship network connecting the top 25 collaborators of L.E. Felton. A scholar is included among the top collaborators of L.E. Felton based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.E. Felton. L.E. Felton is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 11 | |
| 2 | 3 | |
| 3 | 20 | |
| 4 | 12 | |
| 5 | 4 | |
| 6 | 4 | |
| 7 | 58 | |
| 8 | 137 | |
| 9 | 247 | |
| 10 | 111 | |
| 11 | 69 | |
| 12 | 30 | |
| 13 | 8 | |
| 14 | 1 | |
| 15 | 6 | |
| 16 | 5 | |
| 17 | 9 | |
| 18 | 24 | |
| 19 | 2 | |
| 20 | 2 |
About L.E. Felton
L.E. Felton is a scholar working on General Materials Science, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 22 papers that have together received 779 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (9 papers) and Copper Interconnects and Reliability (5 papers). The work is most often cited by research in General Materials Science (69 citations), Mechanical Engineering (452 citations) and Electrical and Electronic Engineering (674 citations). L.E. Felton has collaborated with scholars based in United States and Germany. Frequent co-authors include Wenge Yang, Robert W. Messler, D. B. Knorr, J.A. Schwarz, P. J. Ficalora, Daeyong Lee, Michael A. Zimmerman, Rafael Navarro, L. F. Coffin and Krishna Rajan. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and International Journal of Pharmaceutics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.