Fuliang Wang
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
- Nanomaterials and Printing Technologies
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 65
- 3D IC and TSV technologies 47
- Electrodeposition and Electroless Coatings 41
- Nanomaterials and Printing Technologies 13
-
- Adhesion, Friction, and Surface Interactions 12
- Co-authors
- Hu HeWenhui ZhuMingqi XiangYan WangLei HanYun ChenJunhui LiHongbin Xiao
- Journals
- Microelectronic Engineering (12 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (10 papers)Journal of Micromechanics and Microengineering (8 papers)Journal of The Electrochemical Society (7 papers)IEEE Transactions on Semiconductor Manufacturing (6 papers)
- Partner nations
- ChinaHong KongUnited Kingdom
In The Last Decade
Fuliang Wang
149 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 86
- Electrical and Electronic Engineering 975
- Automotive Engineering 127
- Applied Mathematics 103
- Mechanical Engineering 295
- Biomedical Engineering 302
Countries citing papers authored by Fuliang Wang
This map shows the geographic impact of Fuliang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fuliang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fuliang Wang more than expected).
Fields of papers citing papers by Fuliang Wang
This network shows the impact of papers produced by Fuliang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fuliang Wang. The network helps show where Fuliang Wang may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Fuliang Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 4 | |
| 4 | 2023 | 9 | |
| 5 | 2023 | 5 | |
| 6 | 2022 | 4 | |
| 7 | 2019 | 8 | |
| 8 | 2019 | 14 | |
| 9 | 2019 | 3 | |
| 10 | 2019 | 12 | |
| 11 | 2019 | 19 | |
| 12 | 2018 | 13 | |
| 13 | 2018 | 0 | |
| 14 | 2017 | 27 | |
| 15 | 2014 | 8 | |
| 16 | COMPUTER AIDED MOLECULAR DESIGN FOR THE HIGH SELECTIVITY COLLECTORS OF CHALCOPYRITE AND PYRITE | 2010 | 1 |
| 17 | Numerical simulation and verification of aerodynamic noise from side window region of minivan | 2010 | 1 |
| 18 | APPLICATION OF MOLECULAR MECHANICS IN STUDYING ON FLOTATION REAGENTS INTERACTING WITH MINERALS | 2009 | 2 |
| 19 | 2005 | 2 | |
| 20 | Present Development of Thermosonic Flip-chip Bonding Process | 2004 | 0 |
About Fuliang Wang
Fuliang Wang is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Electrochemistry and Biomedical Engineering, having authored 156 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (65 papers), 3D IC and TSV technologies (47 papers), Electrodeposition and Electroless Coatings (41 papers), Nanomaterials and Printing Technologies (13 papers), Advanced Welding Techniques Analysis (13 papers), Anodic Oxide Films and Nanostructures (13 papers), Adhesion, Friction, and Surface Interactions (12 papers) and Semiconductor materials and interfaces (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (975 citations), Automotive Engineering (127 citations), Applied Mathematics (103 citations), Mechanical Engineering (295 citations) and Biomedical Engineering (302 citations). Fuliang Wang has collaborated with scholars based in China, Hong Kong and United Kingdom. Frequent co-authors include Hu He, Wenhui Zhu, Mingqi Xiang, Yan Wang, Lei Han, Lei Han, Yun Chen, Junhui Li, Hongbin Xiao and Jue Zhong. Their work appears in journals such as Microelectronic Engineering, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Micromechanics and Microengineering, Journal of The Electrochemical Society and IEEE Transactions on Semiconductor Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.