Fuliang Wang

1.9k total citations
156 papers, 1.4k citations indexed

About

Fuliang Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Fuliang Wang has authored 156 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 114 papers in Electrical and Electronic Engineering, 34 papers in Mechanical Engineering and 28 papers in Biomedical Engineering. Recurrent topics in Fuliang Wang's work include Electronic Packaging and Soldering Technologies (65 papers), 3D IC and TSV technologies (47 papers) and Electrodeposition and Electroless Coatings (41 papers). Fuliang Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (65 papers), 3D IC and TSV technologies (47 papers) and Electrodeposition and Electroless Coatings (41 papers). Fuliang Wang collaborates with scholars based in China, Hong Kong and United Kingdom. Fuliang Wang's co-authors include Hu He, Wenhui Zhu, Mingqi Xiang, Yan Wang, Lei Han, Lei Han, Yun Chen, Junhui Li, Hongbin Xiao and Jue Zhong and has published in prestigious journals such as The Journal of Chemical Physics, SHILAP Revista de lepidopterología and Applied Physics Letters.

In The Last Decade

Fuliang Wang

149 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fuliang Wang China 19 975 302 295 226 127 156 1.4k
Yung-Cheng Lee United States 25 1.1k 1.1× 365 1.2× 928 3.1× 448 2.0× 93 0.7× 68 2.5k
Luc G. Fréchette Canada 25 859 0.9× 578 1.9× 1.1k 3.7× 329 1.5× 56 0.4× 156 2.3k
Hiroshi Iwai Japan 30 1.2k 1.3× 532 1.8× 422 1.4× 1.9k 8.6× 50 0.4× 144 2.9k
Heng Tang China 26 449 0.5× 305 1.0× 1.2k 4.1× 146 0.6× 169 1.3× 60 1.8k
Chunfeng Zhou Canada 17 371 0.4× 550 1.8× 183 0.6× 457 2.0× 36 0.3× 32 1.8k
Masato Tanaka Japan 19 415 0.4× 387 1.3× 294 1.0× 209 0.9× 132 1.0× 172 1.5k
Gregory Nellis United States 27 416 0.4× 598 2.0× 2.0k 6.8× 263 1.2× 113 0.9× 171 3.0k
J.L. Hudgins United States 29 3.0k 3.1× 93 0.3× 531 1.8× 231 1.0× 202 1.6× 145 3.4k
Dapeng Chen China 17 582 0.6× 257 0.9× 152 0.5× 191 0.8× 54 0.4× 110 1.2k
C. Y. Soong Taiwan 20 514 0.5× 687 2.3× 510 1.7× 184 0.8× 46 0.4× 58 1.5k

Countries citing papers authored by Fuliang Wang

Since Specialization
Citations

This map shows the geographic impact of Fuliang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fuliang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fuliang Wang more than expected).

Fields of papers citing papers by Fuliang Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fuliang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fuliang Wang. The network helps show where Fuliang Wang may publish in the future.

Co-authorship network of co-authors of Fuliang Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Fuliang Wang. A scholar is included among the top collaborators of Fuliang Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fuliang Wang. Fuliang Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Fuliang, et al.. (2025). Effects of geometric parameters and wettability on pattern collapse in nanoscale systems. The Journal of Chemical Physics. 163(19).
3.
Zhang, Chi, et al.. (2024). A novel plating bath device for reducing surface copper thickness and improving wafer-scale uniformity. Journal of Micromechanics and Microengineering. 34(5). 55004–55004. 4 indexed citations
4.
Wang, Fuliang, et al.. (2023). Cold sintering assisted processing of Mn-Zn ferrites. Journal of the European Ceramic Society. 43(14). 6145–6153. 9 indexed citations
5.
Xu, Jinlong, Guodong Zhang, Jing Lv, et al.. (2023). High-efficiency localized electrochemical deposition based on ultrafast laser surface modification. Surface and Coatings Technology. 471. 129923–129923. 5 indexed citations
6.
Tao, Shaohua, et al.. (2022). Direction-controllable dual-optical conveyors based on optical tweezers. Physica Scripta. 97(9). 95808–95808. 4 indexed citations
7.
Wang, Feng, Fuliang Wang, Ximei Liu, & Jinzhi Liu. (2019). Experimental study of current density in copper filling process within deep through-silicon vias with high aspect ratio. Journal of Micromechanics and Microengineering. 29(12). 125013–125013. 8 indexed citations
8.
Wang, Feng, Fuliang Wang, & Ximei Liu. (2019). The key role of suppressor diffusion in defect-free filling of the through-silicon-via with high depth. Journal of Micromechanics and Microengineering. 29(5). 55005–55005. 14 indexed citations
9.
Wang, Fuliang, et al.. (2019). Study on the effect of CNT on the improved mechanical performance of flexible Ag NPs/CNT based electronics. AIP Advances. 9(4). 3 indexed citations
10.
Wang, Fuliang, et al.. (2019). Effect of cetyl-trimethyl-ammonium-bromide (CTAB) and bis (3-sulfopropyl) disulfide (SPS) on the through-silicon-via (TSV) copper filling. Microelectronic Engineering. 217. 111109–111109. 12 indexed citations
11.
Wang, Fuliang, Kang Zhou, Qinglong Zhang, et al.. (2019). Effect of molecular weight and concentration of polyethylene glycol on through‑silicon via filling by copper. Microelectronic Engineering. 215. 111003–111003. 19 indexed citations
12.
Wang, Fuliang, et al.. (2018). Stress-dislocation interaction mechanism in low-temperature thermo-compression sintering of Ag NPs. AIP Advances. 8(4). 13 indexed citations
14.
Wang, Fuliang, et al.. (2017). Ultrasonic-Assisted Sintering of Silver Nanoparticles for Flexible Electronics. The Journal of Physical Chemistry C. 121(51). 28515–28519. 27 indexed citations
15.
Wang, Fenjuan, et al.. (2014). An outbreak of adult measles by nosocomial transmission in a high vaccination coverage community. International Journal of Infectious Diseases. 26. 67–70. 8 indexed citations
16.
Wang, Fuliang. (2010). COMPUTER AIDED MOLECULAR DESIGN FOR THE HIGH SELECTIVITY COLLECTORS OF CHALCOPYRITE AND PYRITE. Nonferrous Metals. 1 indexed citations
17.
Wang, Fuliang. (2010). Numerical simulation and verification of aerodynamic noise from side window region of minivan. Journal of Jilin University. 1 indexed citations
18.
Wang, Fuliang. (2009). APPLICATION OF MOLECULAR MECHANICS IN STUDYING ON FLOTATION REAGENTS INTERACTING WITH MINERALS. 2 indexed citations
19.
Wang, Fuliang. (2005). Effect of ultrasonic power on the heavy aluminum wedge bonding strength. Chinese Journal of Mechanical Engineering. 18(4). 515–515. 2 indexed citations
20.
Wang, Fuliang. (2004). Present Development of Thermosonic Flip-chip Bonding Process.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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