Yung-Cheng Lee

3.1k total citations
68 papers, 2.5k citations indexed

About

Yung-Cheng Lee is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Computational Mechanics. According to data from OpenAlex, Yung-Cheng Lee has authored 68 papers receiving a total of 2.5k indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 10 papers in Computational Mechanics. Recurrent topics in Yung-Cheng Lee's work include Heat Transfer and Boiling Studies (11 papers), Heat Transfer and Optimization (10 papers) and Semiconductor Lasers and Optical Devices (10 papers). Yung-Cheng Lee is often cited by papers focused on Heat Transfer and Boiling Studies (11 papers), Heat Transfer and Optimization (10 papers) and Semiconductor Lasers and Optical Devices (10 papers). Yung-Cheng Lee collaborates with scholars based in United States, Taiwan and China. Yung-Cheng Lee's co-authors include Ronggui Yang, Rongfu Wen, Xuehu Ma, Shanshan Xu, Steven M. George, Miao Tian, Chen Li, А. И. Абдулагатов, Wei Wang and Li‐Anne Liew and has published in prestigious journals such as Nano Letters, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Yung-Cheng Lee

65 papers receiving 2.5k citations

Peers

Yung-Cheng Lee
Comparison fields: 5 of 90
  • Electrical and Electronic Engineering 1.1k
  • Mechanical Engineering 928
  • Computational Mechanics 701
  • Surfaces, Coatings and Films 569
  • Materials Chemistry 448
Replace Xinghui Li with:
Xinghui Li China
Suresh V. Garimella United States
Hao Yi China
Tanmoy Maitra India
Yang Bai China
Gregory Nellis United States
Zhigang Fan China
Weiwei Deng China
Fengwen Wang Denmark
Jeff Punch Ireland
Xinghui Li China View profile →
Citations per field, relative to Yung-Cheng Lee
Yung-Cheng Lee · 1×
Citations per year, relative to Yung-Cheng Lee
Yung-Cheng Lee · 1×

Countries citing papers authored by Yung-Cheng Lee

Since Specialization
Citations

This map shows the geographic impact of Yung-Cheng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yung-Cheng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yung-Cheng Lee more than expected).

Fields of papers citing papers by Yung-Cheng Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yung-Cheng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yung-Cheng Lee. The network helps show where Yung-Cheng Lee may publish in the future.

Co-authorship network of co-authors of Yung-Cheng Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Yung-Cheng Lee. A scholar is included among the top collaborators of Yung-Cheng Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yung-Cheng Lee. Yung-Cheng Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
# Work Indexed citations
1 159
2 232
3 6
4
A heuristic approach for the sport equipment allocation and member recruiting management
2
5 65
6 19
7 1
8 4
9 47
10
Cryptanalysis and Improvement of the Robust User Authentication Scheme for Wireless Sensor Networks
4
11 8
12 6
13 6
14 9
15 2
16
Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
2
17 4
18 3
19 43
20
Modeling Work in Thermal Plasma Processing
24

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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