Wei Sun Leong
Impact in
- Materials Chemistry top 5%
- 2D Materials and Applications
- Graphene research and applications
- MXene and MAX Phase Materials
- Biomaterials top 10%
- Advanced Cellulose Research Studies
Papers in
-
- 3D IC and TSV technologies 4
- Perovskite Materials and Applications 4
- Electronic Packaging and Soldering Technologies 4
- Advancements in Semiconductor Devices and Circuit Design 3
- Semiconductor materials and devices 3
-
- 2D Materials and Applications 13
- Graphene research and applications 8
- MXene and MAX Phase Materials 5
- Co-authors
- John T. L. Thong (5 shared papers)Jing Kong (10 shared papers)Haozhe Wang (8 shared papers)Pin‐Chun Shen (4 shared papers)Chang Tai Nai (1 shared paper)Su Ying Quek (3 shared papers)Khoong Hong Khoo (3 shared papers)Yida Li (3 shared papers)
- Journals
- ACS Nano (3 papers)ACS Applied Materials & Interfaces (3 papers)Microelectronics Reliability (2 papers)Advanced Functional Materials (2 papers)Nature Communications (2 papers)
- Partner nations
- United StatesSingaporeChina
In The Last Decade
Wei Sun Leong
29 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 88
- Materials Chemistry 946
- Biomaterials 147
- Electrical and Electronic Engineering 535
- Biomedical Engineering 360
- Electronic, Optical and Magnetic Materials 116
Countries citing papers authored by Wei Sun Leong
This map shows the geographic impact of Wei Sun Leong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wei Sun Leong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wei Sun Leong more than expected).
Fields of papers citing papers by Wei Sun Leong
This network shows the impact of papers produced by Wei Sun Leong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wei Sun Leong. The network helps show where Wei Sun Leong may publish in the future.
Co-authors
The 25 scholars most cited alongside Wei Sun Leong, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 249 | |
| 2 | 2014 | 185 | |
| 3 | 2021 | 131 | |
| 4 | 2015 | 109 | |
| 5 | 2014 | 107 | |
| 6 | 2018 | 97 | |
| 7 | 2020 | 87 | |
| 8 | 2018 | 75 | |
| 9 | 2018 | 52 | |
| 10 | 2017 | 51 | |
| 11 | 2019 | 44 | |
| 12 | 2017 | 43 | |
| 13 | 2018 | 40 | |
| 14 | 2018 | 29 | |
| 15 | 2017 | 27 | |
| 16 | 2020 | 21 | |
| 17 | 2015 | 20 | |
| 18 | 2016 | 16 | |
| 19 | 2002 | 12 | |
| 20 | 2003 | 12 |
About Wei Sun Leong
Wei Sun Leong is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomaterials, Pathology and Forensic Medicine and Biomedical Engineering, having authored 30 papers that have together received 1.4k indexed citations. Recurring topics across this work include 2D Materials and Applications (13 papers), Graphene research and applications (8 papers), MXene and MAX Phase Materials (5 papers), 3D IC and TSV technologies (4 papers), Perovskite Materials and Applications (4 papers), Electronic Packaging and Soldering Technologies (4 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers) and Semiconductor materials and devices (3 papers). The work is most often cited by research in Materials Chemistry (946 citations), Biomaterials (147 citations), Electrical and Electronic Engineering (535 citations), Biomedical Engineering (360 citations) and Electronic, Optical and Magnetic Materials (116 citations). Wei Sun Leong has collaborated with scholars based in United States, Singapore and China. Frequent co-authors include John T. L. Thong, Jing Kong, Haozhe Wang, Pin‐Chun Shen, Chang Tai Nai, Su Ying Quek, Khoong Hong Khoo, Yida Li, Tomás Palacios and Xin Luo. Their work appears in journals such as ACS Nano, ACS Applied Materials & Interfaces, Microelectronics Reliability, Advanced Functional Materials and Nature Communications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.