Saptadeep Pal

582 total citations
27 papers, 391 citations indexed

About

Saptadeep Pal is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications and Hardware and Architecture. According to data from OpenAlex, Saptadeep Pal has authored 27 papers receiving a total of 391 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 10 papers in Computer Networks and Communications and 9 papers in Hardware and Architecture. Recurrent topics in Saptadeep Pal's work include 3D IC and TSV technologies (15 papers), Interconnection Networks and Systems (7 papers) and Parallel Computing and Optimization Techniques (7 papers). Saptadeep Pal is often cited by papers focused on 3D IC and TSV technologies (15 papers), Interconnection Networks and Systems (7 papers) and Parallel Computing and Optimization Techniques (7 papers). Saptadeep Pal collaborates with scholars based in United States, Japan and India. Saptadeep Pal's co-authors include Puneet Gupta, Subramanian S. Iyer, Adeel Bajwa, Rakesh Kumar, Takafumi Fukushima, Mark S. Goorsky, Sudhakar Pamarti, Tingyu Bai, Szymon Migacz and Victor Zhang and has published in prestigious journals such as IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on Very Large Scale Integration (VLSI) Systems and ACM Transactions on Design Automation of Electronic Systems.

In The Last Decade

Saptadeep Pal

26 papers receiving 366 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Saptadeep Pal United States	12	283	100	97	43	39	27	391
Jinwoo Kim United States	12	443 1.6×	121 1.2×	99 1.0×	23 0.5×	43 1.1×	63	530
Hongjung Kim South Korea	7	274 1.0×	102 1.0×	86 0.9×	19 0.4×	18 0.5×	14	334
Srivatsa Srinivasa United States	13	434 1.5×	90 0.9×	61 0.6×	28 0.7×	42 1.1×	31	515
Xiaole Cui China	12	325 1.1×	102 1.0×	36 0.4×	59 1.4×	45 1.2×	117	465
Mohamed M. Sabry United States	8	278 1.0×	47 0.5×	47 0.5×	70 1.6×	21 0.5×	14	381
Maged Ghoneima Egypt	13	369 1.3×	97 1.0×	128 1.3×	21 0.5×	72 1.8×	66	458
Rujia Wang United States	14	246 0.9×	174 1.7×	211 2.2×	104 2.4×	58 1.5×	46	545
Kyung Whan Kim South Korea	6	263 0.9×	122 1.2×	117 1.2×	23 0.5×	18 0.5×	7	328
Renzhi Liu United States	11	436 1.5×	149 1.5×	32 0.3×	53 1.2×	56 1.4×	29	487
S. Ravi India	11	228 0.8×	268 2.7×	87 0.9×	21 0.5×	64 1.6×	31	466

Countries citing papers authored by Saptadeep Pal

Since Specialization

Citations

This map shows the geographic impact of Saptadeep Pal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Saptadeep Pal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Saptadeep Pal more than expected).

Fields of papers citing papers by Saptadeep Pal

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Saptadeep Pal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Saptadeep Pal. The network helps show where Saptadeep Pal may publish in the future.

Co-authorship network of co-authors of Saptadeep Pal

This figure shows the co-authorship network connecting the top 25 collaborators of Saptadeep Pal. A scholar is included among the top collaborators of Saptadeep Pal based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Saptadeep Pal. Saptadeep Pal is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Pal, Saptadeep, et al.. (2025). CATCH: A Cost Analysis Tool for Co-Optimization of Chiplet-Based Heterogeneous Systems. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 45(3). 1091–1104.

Pal, Saptadeep, et al.. (2024). Waferscale Network Switches. 215–229. 9 indexed citations

Pal, Saptadeep, Arindam Mallik, & Puneet Gupta. (2024). System technology co-optimization for advanced integration. 1(9). 569–580. 1 indexed citations

Pal, Saptadeep, et al.. (2023). Chiplets: How Small is too Small?. 1–6. 13 indexed citations

Ardalani, Newsha, Saptadeep Pal, & Puneet Gupta. (2023). DeepFlow: A Cross-Stack Pathfinding Framework for Distributed AI Systems. ACM Transactions on Design Automation of Electronic Systems. 29(2). 1–20. 7 indexed citations

Pal, Saptadeep, et al.. (2022). TSV-less Power Delivery for Wafer-scale Assemblies and Interposers. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1934–1939. 1 indexed citations

Pal, Saptadeep, et al.. (2021). Flexible Connectors and PCB Segmentation for Signaling and Power Delivery in Wafer-Scale Systems. 507–513. 5 indexed citations

Pal, Saptadeep, et al.. (2020). Design Space Exploration for Chiplet-Assembly-Based Processors. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 28(4). 1062–1073. 23 indexed citations

Pal, Saptadeep, Eiman Ebrahimi, Arslan Zulfiqar, et al.. (2019). Optimizing Multi-GPU Parallelization Strategies for Deep Learning Training. arXiv (Cornell University). 50 indexed citations

10.

Pal, Saptadeep, et al.. (2019). Compression with multi-ECC. 85–100. 6 indexed citations

11.

Pal, Saptadeep, et al.. (2019). Architecting Waferscale Processors - A GPU Case Study. 250–263. 41 indexed citations

12.

Hanna, Amir N., Takafumi Fukushima, Steven L. Moran, et al.. (2018). Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects. 1505–1511. 17 indexed citations

13.

Pal, Saptadeep, et al.. (2018). A Case for Packageless Processors. 466–479. 19 indexed citations

14.

Bajwa, Adeel, et al.. (2018). Demonstration of a Heterogeneously Integrated System-on-Wafer (SoW) Assembly. 1926–1930. 17 indexed citations

15.

Bajwa, Adeel, Saptadeep Pal, Tingyu Bai, et al.. (2017). Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding. 1276–1284. 67 indexed citations

16.

Fukushima, Takafumi, et al.. (2017). “FlexTrate ^TM” — Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP. 649–654. 13 indexed citations

17.

Wang, Shaodi, Saptadeep Pal, Andrew Pan, et al.. (2017). Hybrid VC-MTJ/CMOS non-volatile stochastic logic for efficient computing. 1438–1443. 12 indexed citations

18.

Bajwa, Adeel, et al.. (2016). Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects.. IMAPSource Proceedings. 2016(1). 203–208. 3 indexed citations

19.

Pal, Saptadeep, et al.. (2015). Design and implementation of dynamic key based stream cipher for cryptographic processor. 4329. 1–6. 1 indexed citations

20.

Pal, Saptadeep, et al.. (2014). Cable length minimisation in long-reach-PON planning for sparsely populated areas. 234–239. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact