Boris Vaisband
- Electrical and Electronic Engineering
- Hardware and Architecture top 10%
- Computer Networks and Communications
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Co-authors
- Eby G. FriedmanSubramanian S. IyerIoannis SavidisAdeel BajwaXin LiChong Wei TanGregory SizikovBeng Kang Tay
- Topics
- 3D IC and TSV technologies (26 papers)Electromagnetic Compatibility and Noise Suppression (9 papers)Electronic Packaging and Soldering Technologies (9 papers)
- Cited by
- Hardware and ArchitectureElectrical and Electronic EngineeringComputer Networks and Communications
- Partner nations
- United StatesCanadaSingapore
In The Last Decade
Boris Vaisband
36 papers receiving 258 citations
Peers
Comparison fields: 5 of 29
- Electrical and Electronic Engineering 248
- Hardware and Architecture 46
- Computer Networks and Communications 43
- Materials Chemistry 19
- Electronic, Optical and Magnetic Materials 18
Countries citing papers authored by Boris Vaisband
This map shows the geographic impact of Boris Vaisband's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Boris Vaisband with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Boris Vaisband more than expected).
Fields of papers citing papers by Boris Vaisband
This network shows the impact of papers produced by Boris Vaisband. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Boris Vaisband. The network helps show where Boris Vaisband may publish in the future.
Co-authorship network of co-authors of Boris Vaisband
This figure shows the co-authorship network connecting the top 25 collaborators of Boris Vaisband. A scholar is included among the top collaborators of Boris Vaisband based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Boris Vaisband. Boris Vaisband is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 7 | |
| 7 | 0 | |
| 8 | 0 | |
| 9 | 8 | |
| 10 | 0 | |
| 11 | 4 | |
| 12 | 10 | |
| 13 | 5 | |
| 14 | 1 | |
| 15 | 10 | |
| 16 | 6 | |
| 17 | 8 | |
| 18 | 2 | |
| 19 | 7 | |
| 20 | 10 |
About Boris Vaisband
Boris Vaisband is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Cellular and Molecular Neuroscience, having authored 42 papers that have together received 270 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (26 papers), Electromagnetic Compatibility and Noise Suppression (9 papers) and Electronic Packaging and Soldering Technologies (9 papers). The work is most often cited by research in Hardware and Architecture (46 citations), Electrical and Electronic Engineering (248 citations) and Computer Networks and Communications (43 citations). Boris Vaisband has collaborated with scholars based in United States, Canada and Singapore. Frequent co-authors include Eby G. Friedman, Subramanian S. Iyer, Ioannis Savidis, Adeel Bajwa, Xin Li, Chong Wei Tan, Gregory Sizikov, Beng Kang Tay, Mark S. Goorsky and Timothy S. Fisher. Their work appears in journals such as IEEE Access, IEEE Transactions on Electron Devices and Future Generation Computer Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.