Jikai Xu

773 total citations
24 papers, 628 citations indexed

About

Jikai Xu is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Materials Chemistry. According to data from OpenAlex, Jikai Xu has authored 24 papers receiving a total of 628 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 5 papers in Atomic and Molecular Physics, and Optics and 5 papers in Materials Chemistry. Recurrent topics in Jikai Xu's work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Photonic and Optical Devices (5 papers). Jikai Xu is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Photonic and Optical Devices (5 papers). Jikai Xu collaborates with scholars based in China, Singapore and Japan. Jikai Xu's co-authors include Chenxi Wang, Yanhong Tian, Chengkuo Lee, Yanhong Tian, Zhihao Ren, Yannan Liu, Te Wang, Jan Dziuban, Jianxiong Zhu and Zhongda Sun and has published in prestigious journals such as ACS Nano, Journal of The Electrochemical Society and Applied Surface Science.

In The Last Decade

Jikai Xu

24 papers receiving 616 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jikai Xu China 16 439 253 112 110 98 24 628
Khairudin Mohamed Malaysia 10 307 0.7× 343 1.4× 109 1.0× 62 0.6× 197 2.0× 45 674
Takahiro Kozeki Japan 10 256 0.6× 217 0.9× 92 0.8× 52 0.5× 241 2.5× 15 507
N. Orf United States 9 541 1.2× 276 1.1× 144 1.3× 39 0.4× 176 1.8× 10 795
Ankit Kumar Pandey India 16 492 1.1× 508 2.0× 101 0.9× 140 1.3× 109 1.1× 56 854
Shyankay Jou Taiwan 17 328 0.7× 180 0.7× 122 1.1× 89 0.8× 420 4.3× 53 742
Tai‐Hong Chen Taiwan 14 397 0.9× 107 0.4× 40 0.4× 99 0.9× 184 1.9× 59 591
N. Heylen Belgium 16 823 1.9× 158 0.6× 112 1.0× 333 3.0× 124 1.3× 59 917
Ji Shi Japan 15 259 0.6× 132 0.5× 93 0.8× 198 1.8× 213 2.2× 65 576
Jae‐Hoon Lee South Korea 14 378 0.9× 126 0.5× 33 0.3× 64 0.6× 176 1.8× 75 602

Countries citing papers authored by Jikai Xu

Since Specialization
Citations

This map shows the geographic impact of Jikai Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jikai Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jikai Xu more than expected).

Fields of papers citing papers by Jikai Xu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jikai Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jikai Xu. The network helps show where Jikai Xu may publish in the future.

Co-authorship network of co-authors of Jikai Xu

This figure shows the co-authorship network connecting the top 25 collaborators of Jikai Xu. A scholar is included among the top collaborators of Jikai Xu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jikai Xu. Jikai Xu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wang, Chenxi, et al.. (2022). Research Progress on Ultraviolet Activated Low-temperature Bonding. Journal of Mechanical Engineering. 58(2). 122–122. 1 indexed citations
2.
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Xu, Jikai, Zhihao Ren, Xinmiao Liu, et al.. (2021). Heterogeneous LiNbO3/Si Direct Bonding for Wavelength-Dependent Mid-Infrared Imaging. 585–588. 2 indexed citations
4.
Ren, Zhihao, Jikai Xu, Xianhao Le, & Chengkuo Lee. (2021). Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G. Micromachines. 12(8). 946–946. 49 indexed citations
5.
Xu, Jikai, Zhihao Ren, Bowei Dong, et al.. (2020). Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy. ACS Nano. 14(9). 12159–12172. 77 indexed citations
6.
Wang, Chenxi, et al.. (2020). Single-crystalline SiC integrated onto Si-based substrates via plasma-activated direct bonding. Ceramics International. 46(14). 22718–22726. 28 indexed citations
7.
Xu, Jikai, Yu Du, Yanhong Tian, & Chenxi Wang. (2020). Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics. International Journal of Optomechatronics. 14(1). 94–118. 39 indexed citations
8.
Tian, Ruyu, Chunjin Hang, Yanhong Tian, & Jikai Xu. (2019). Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes. Journal of Materials Processing Technology. 268. 1–9. 38 indexed citations
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Xu, Jikai, et al.. (2019). Low-temperature direct bonding of Si and quartz glass using the APTES modification. Ceramics International. 45(13). 16670–16675. 18 indexed citations
12.
Xu, Jikai, et al.. (2019). VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO3-based optical devices. Applied Surface Science. 495. 143576–143576. 15 indexed citations
13.
Xu, Jikai, Chenxi Wang, Te Wang, et al.. (2018). Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation. RSC Advances. 8(21). 11528–11535. 57 indexed citations
14.
Wang, Chenxi, Jikai Xu, Yannan Liu, et al.. (2018). Direct Homo/Heterogeneous Bonding of Silicon and Glass Using Vacuum Ultraviolet Irradiation in Air. Journal of The Electrochemical Society. 165(4). H3093–H3098. 20 indexed citations
15.
Xu, Jikai, Chenxi Wang, Te Wang, Yannan Liu, & Yanhong Tian. (2018). Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process. Applied Surface Science. 453. 416–422. 42 indexed citations
16.
Wang, Chenxi, et al.. (2018). A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation. Applied Surface Science. 471. 196–204. 25 indexed citations
17.
Xu, Jikai, et al.. (2018). Communication—Defect-Free Direct Bonding for High-Performance Glass-On-LiNbO3 Devices. Journal of The Electrochemical Society. 165(14). B727–B729. 9 indexed citations
18.
Wang, Chenxi, et al.. (2017). Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning. Japanese Journal of Applied Physics. 57(2S1). 02BD02–02BD02. 15 indexed citations
19.
Wang, Chenxi, Jikai Xu, Yannan Liu, et al.. (2016). A novel surface humidity controlled bonder for low-temperature wafer bonding. 893–896. 1 indexed citations
20.
Liu, Yang, Yanhong Tian, Baolei Liu, et al.. (2016). Interconnection of Cu wire/Au plating pads using parallel gap resistance microwelding process. 43–46. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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