Rahul Agarwal

858 total citations
33 papers, 382 citations indexed

About

Rahul Agarwal is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Rahul Agarwal has authored 33 papers receiving a total of 382 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 4 papers in Automotive Engineering. Recurrent topics in Rahul Agarwal's work include 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (13 papers) and Advanced MEMS and NEMS Technologies (10 papers). Rahul Agarwal is often cited by papers focused on 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (13 papers) and Advanced MEMS and NEMS Technologies (10 papers). Rahul Agarwal collaborates with scholars based in United States, Belgium and Singapore. Rahul Agarwal's co-authors include Paresh Limaye, Wenqi Zhang, Philippe Soussan, Alain Phommahaxay, Biljana Dimčić, Shekhar Bhansali, Riet Labie, Scott Samson, Wouter Ruythooren and Sukeshwar Kannan and has published in prestigious journals such as Journal of Power Sources, Journal of Microelectromechanical Systems and Journal of Micromechanics and Microengineering.

In The Last Decade

Rahul Agarwal

33 papers receiving 360 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Rahul Agarwal United States 12 328 73 54 48 33 33 382
Víctor M. López Spain 13 421 1.3× 82 1.1× 64 1.2× 54 1.1× 40 1.2× 30 517
Qi Tian China 17 535 1.6× 32 0.4× 35 0.6× 25 0.5× 31 0.9× 46 627
Kaladhar Radhakrishnan United States 17 909 2.8× 125 1.7× 92 1.7× 60 1.3× 45 1.4× 61 1.0k
Gerard McVicker United States 10 290 0.9× 82 1.1× 32 0.6× 122 2.5× 22 0.7× 15 423
Sudarshan R. Nelatury United States 11 217 0.7× 84 1.2× 79 1.5× 14 0.3× 42 1.3× 50 360
Klaus Krüger Germany 8 116 0.4× 59 0.8× 27 0.5× 57 1.2× 18 0.5× 34 325
Marian Kampik Poland 12 427 1.3× 102 1.4× 16 0.3× 52 1.1× 42 1.3× 115 521

Countries citing papers authored by Rahul Agarwal

Since Specialization
Citations

This map shows the geographic impact of Rahul Agarwal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rahul Agarwal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rahul Agarwal more than expected).

Fields of papers citing papers by Rahul Agarwal

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Rahul Agarwal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rahul Agarwal. The network helps show where Rahul Agarwal may publish in the future.

Co-authorship network of co-authors of Rahul Agarwal

This figure shows the co-authorship network connecting the top 25 collaborators of Rahul Agarwal. A scholar is included among the top collaborators of Rahul Agarwal based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Rahul Agarwal. Rahul Agarwal is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Agarwal, Rahul, Vinay Kumar, Nitin Garg, et al.. (2024). Multi-modal medical image fusion using improved dual-channel PCNN. Medical & Biological Engineering & Computing. 62(9). 2629–2651. 13 indexed citations
2.
Agarwal, Rahul, et al.. (2020). Substrate integrated waveguide based cavity‐backed self‐triplexing slot antenna for X‐Ku band applications. International Journal of RF and Microwave Computer-Aided Engineering. 30(4). 15 indexed citations
3.
Agarwal, Rahul, et al.. (2017). A CRLH leaky wave antenna on SIW with continuous scan using novel S-slots. International Journal of Electronics Letters. 6(4). 459–467. 1 indexed citations
4.
Kannan, Sukeshwar, C.S. Premachandran, Daniel M. Smith, et al.. (2017). Impact of TSV process on 14nm FEOL and BEOL reliability. 4A–2.1. 6 indexed citations
5.
Kushwaha, Pragya, Rahul Agarwal, Harshit Agarwal, et al.. (2016). Modeling of threshold voltage for operating point using industry standard BSIM-IMG model. 216–219. 5 indexed citations
6.
Premachandran, C.S., et al.. (2015). Wafer level high temperature reliability study by backside probing f or a 50um thin TSV wafer. 2144–2148. 4 indexed citations
7.
Kannan, Sukeshwar, et al.. (2015). TSV integration with 20nm CMOS technology for 3D-IC enablement. 1–5. 4 indexed citations
8.
Agarwal, Rahul, et al.. (2014). TSV integration on 20nm logic Si: 3D assembly and reliability results. 590–595. 4 indexed citations
9.
10.
Xie, Jin, et al.. (2011). Three-Axis Capacitive SOI Accelerometer Using Combination of In-Plane and Vertical Comb Electrodes. Advanced materials research. 254. 203–206. 1 indexed citations
11.
Xie, Jin, et al.. (2011). Compact electrode design for an in-plane accelerometer on SOI with refilled isolation trench. Journal of Micromechanics and Microengineering. 21(9). 95005–95005. 9 indexed citations
12.
Tang, Min, et al.. (2011). AlN Actuator for Tunable RFMEMS Capacitor. Advanced materials research. 254. 29–33. 2 indexed citations
13.
Agarwal, Rahul, et al.. (2011). Challenges and Solutions for Fabricating Isolation Trenches for High Aspect Ratio Sensors. Advanced materials research. 254. 1–4. 1 indexed citations
14.
Agarwal, Rahul, Wenqi Zhang, Paresh Limaye, et al.. (2010). Cu/Sn microbumps interconnect for 3D TSV chip stacking. 858–863. 87 indexed citations
15.
Civale, Yann, Deniz Sabuncuoglu Tezcan, Harold Philipsen, et al.. (2009). Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 1–4. 20 indexed citations
16.
Agarwal, Rahul, Wenqi Zhang, Paresh Limaye, & Wouter Ruythooren. (2009). High density Cu-Sn TLP bonding for 3D integration. 21. 345–349. 31 indexed citations
17.
Wang, Weidong, et al.. (2007). Small form factor microsensor system using optical MEMS for passive optical digital communications (PODC). Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6556. 65560N–65560N. 2 indexed citations
18.
Samson, Scott, et al.. (2006). Fabrication Processes for Packaged Optical MEMS Devices. 12. 113–120. 5 indexed citations
19.
Agarwal, Rahul, Scott Samson, & Shekhar Bhansali. (2006). Fabrication of vertical mirrors using plasma etch and KOH:IPA polishing. Journal of Micromechanics and Microengineering. 17(1). 26–35. 18 indexed citations
20.
Agarwal, Rahul. (1980). Number theory in digital signal processing. IEEE Transactions on Acoustics Speech and Signal Processing. 28(2). 265–266. 30 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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