Claudio Maria Villa

554 total citations
23 papers, 426 citations indexed

About

Claudio Maria Villa is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Computer Networks and Communications. According to data from OpenAlex, Claudio Maria Villa has authored 23 papers receiving a total of 426 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 3 papers in Computer Networks and Communications. Recurrent topics in Claudio Maria Villa's work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Claudio Maria Villa is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Electromagnetic Compatibility and Noise Suppression (6 papers). Claudio Maria Villa collaborates with scholars based in Italy, Switzerland and United States. Claudio Maria Villa's co-authors include L. Gómez, M. Rencz, V. Székely, Lorenzo Codecasa, Vincenzo d’Alessandro, Dirk Schweitzer, J.H.J. Janssen, H. Pape, David Esseni and B. Riccò and has published in prestigious journals such as Construction and Building Materials, IEEE Transactions on Electron Devices and IEEE Electron Device Letters.

In The Last Decade

Claudio Maria Villa

23 papers receiving 399 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Claudio Maria Villa Italy 8 231 163 125 118 52 23 426
Xiao Ren China 16 204 0.9× 136 0.8× 40 0.3× 97 0.8× 284 5.5× 30 694
Jie Shi China 11 80 0.3× 101 0.6× 201 1.6× 15 0.1× 162 3.1× 28 403
Boyi Zhang United States 14 117 0.5× 535 3.3× 99 0.8× 25 0.2× 68 1.3× 33 726
Datong Gao China 12 93 0.4× 66 0.4× 26 0.2× 49 0.4× 131 2.5× 16 334
Yuanyuan Zhou China 11 87 0.4× 18 0.1× 152 1.2× 56 0.5× 246 4.7× 27 389
Qingfeng Liu China 11 98 0.4× 127 0.8× 119 1.0× 22 0.2× 25 0.5× 23 344
Jin-Sup Kim South Korea 11 261 1.1× 72 0.4× 32 0.3× 215 1.8× 7 0.1× 81 374
Xiaoyue Wang China 10 124 0.5× 102 0.6× 41 0.3× 24 0.2× 90 1.7× 33 365
Hartmut Nussbaumer Switzerland 14 46 0.2× 479 2.9× 137 1.1× 33 0.3× 15 0.3× 43 638

Countries citing papers authored by Claudio Maria Villa

Since Specialization
Citations

This map shows the geographic impact of Claudio Maria Villa's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Claudio Maria Villa with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Claudio Maria Villa more than expected).

Fields of papers citing papers by Claudio Maria Villa

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Claudio Maria Villa. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Claudio Maria Villa. The network helps show where Claudio Maria Villa may publish in the future.

Co-authorship network of co-authors of Claudio Maria Villa

This figure shows the co-authorship network connecting the top 25 collaborators of Claudio Maria Villa. A scholar is included among the top collaborators of Claudio Maria Villa based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Claudio Maria Villa. Claudio Maria Villa is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Codecasa, Lorenzo, et al.. (2021). Towards the Extension of TRIC for Thermo-Mechanical Analysis. Virtual Community of Pathological Anatomy (University of Castilla La Mancha). 13. 1–5. 3 indexed citations
2.
Codecasa, Lorenzo, et al.. (2020). Thermal Modeling of BGA Package Families Using the Thermal Resistance and Impedance Calculator (TRIC). Virtual Community of Pathological Anatomy (University of Castilla La Mancha). 299–306. 2 indexed citations
3.
Codecasa, Lorenzo, et al.. (2019). Thermal Resistance and Impedance Calculator (TRIC). Virtual Community of Pathological Anatomy (University of Castilla La Mancha). 1–5. 7 indexed citations
4.
Codecasa, Lorenzo, et al.. (2019). TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages. Energies. 12(6). 1050–1050. 9 indexed citations
5.
Villa, Claudio Maria, et al.. (2019). Novel methodology for real time thermal expansion characterization on ball grid array substrate stack-up materials. Microelectronics Reliability. 100-101. 113478–113478. 5 indexed citations
6.
Villa, Claudio Maria, et al.. (2018). Dynamic Warpage Analysis of QFP Packages During Soldering Reflow Process and Thermal Cycle. 1893–1898. 3 indexed citations
7.
Codecasa, Lorenzo, et al.. (2018). Thermal Resistance Advanced Calculator (TRAC). Virtual Community of Pathological Anatomy (University of Castilla La Mancha). 10. 1–5. 13 indexed citations
8.
Villa, Claudio Maria, et al.. (2018). BGA strip warpage induced by assembly process and the practical prediction methodology. 1–5. 4 indexed citations
9.
10.
Villa, Claudio Maria, et al.. (2014). Ball Grid Array package for automotive application: Strong link between design and 3D modeling. 1–8. 2 indexed citations
11.
Villa, Claudio Maria, et al.. (2010). Geopolymer synthesis using alkaline activation of natural zeolite. Construction and Building Materials. 24(11). 2084–2090. 237 indexed citations
12.
Villa, Claudio Maria, et al.. (2009). Wafer level packaging fan out thermal management: Is smaller always hotter?. European Microelectronics and Packaging Conference. 1–4. 6 indexed citations
13.
Villa, Claudio Maria, et al.. (2004). SMT process robustness and board level solder joint reliability of C/sup 2/BGA. 1869–1874. 5 indexed citations
14.
Pape, H., et al.. (2004). Thermal Transient Modeling and Experimental Validation in the European Project PROFIT. IEEE Transactions on Components and Packaging Technologies. 27(3). 530–538. 24 indexed citations
15.
Villa, Claudio Maria, et al.. (2004). Organic contamination study for adhesion enhancement between final passivation surface and packaging molding compound. Microelectronic Engineering. 76(1-4). 227–234. 8 indexed citations
16.
Pape, H., et al.. (2003). Thermal transient modeling and experimental validation in the European project PROFIT. 6. 247–254. 2 indexed citations
17.
18.
Villa, Claudio Maria, et al.. (2002). A 20 MB/s data rate 2.5 V flash memory with current-controlled field erasing for 1 M cycle endurance. 396–397,. 2 indexed citations
19.
Villa, Claudio Maria, et al.. (2002). Thermal study for flip chip on FR-4 boards. 10 2. 879–884. 8 indexed citations
20.
Bez, R., et al.. (1998). A new erasing method for a single-voltage long-endurance flash memory. IEEE Electron Device Letters. 19(2). 37–39. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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