Panju Shang
- Electrical and Electronic Engineering top 10%
- Electronic, Optical and Magnetic Materials top 5%
- Materials Chemistry top 10%
- Aerospace Engineering top 5%
- Mechanical Engineering top 5%
- Co-authors
- Zhi‐Quan LiuDawei GengH. MengJin ShangXueyong PangWenjie ShenXiaowei XieYong Li
- Topics
- Electronic Packaging and Soldering Technologies (17 papers)3D IC and TSV technologies (10 papers)Intermetallics and Advanced Alloy Properties (9 papers)
- Partner nations
- ChinaUnited StatesHong Kong
In The Last Decade
Panju Shang
28 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 518
- Electronic, Optical and Magnetic Materials 515
- Materials Chemistry 437
- Aerospace Engineering 392
- Mechanical Engineering 367
Countries citing papers authored by Panju Shang
This map shows the geographic impact of Panju Shang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Panju Shang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Panju Shang more than expected).
Fields of papers citing papers by Panju Shang
This network shows the impact of papers produced by Panju Shang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Panju Shang. The network helps show where Panju Shang may publish in the future.
Co-authorship network of co-authors of Panju Shang
This figure shows the co-authorship network connecting the top 25 collaborators of Panju Shang. A scholar is included among the top collaborators of Panju Shang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Panju Shang. Panju Shang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 5 | |
| 2 | 0 | |
| 3 | 9 | |
| 4 | 52 | |
| 5 | 2 | |
| 6 | 2 | |
| 7 | 25 | |
| 8 | 26 | |
| 9 | 3 | |
| 10 | 7 | |
| 11 | 117 | |
| 12 | 51 | |
| 13 | 31 | |
| 14 | 2 | |
| 15 | 28 | |
| 16 | 52 | |
| 17 | 1 | |
| 18 | 87 | |
| 19 | 375 | |
| 20 | 50 |
About Panju Shang
Panju Shang is a scholar working on General Materials Science, Mechanical Engineering and Electrical and Electronic Engineering, having authored 29 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (10 papers) and Intermetallics and Advanced Alloy Properties (9 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (515 citations), Aerospace Engineering (392 citations) and General Materials Science (38 citations). Panju Shang has collaborated with scholars based in China, United States and Hong Kong. Frequent co-authors include Zhi‐Quan Liu, Dawei Geng, H. Meng, Jin Shang, Xueyong Pang, Wenjie Shen, Xiaowei Xie, Yong Li, Ruijuan Shi and Fei Wang. Their work appears in journals such as Applied Physics Letters, Chemistry of Materials and Acta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.