Jianxin Wang
- Mechanical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Fluid Flow and Transfer Processes top 2%
- Automotive Engineering top 5%
- Co-authors
- Songbai XueJ.M. HerrerosChongming WangRoger CracknellHongming XuChad M. LandisYU Sheng-linHiroshi Nishikawa
- Topics
- Electronic Packaging and Soldering Technologies (29 papers)3D IC and TSV technologies (23 papers)Advanced Welding Techniques Analysis (20 papers)
- Journals
- SHILAP Revista de lepidopterologíaBioresource TechnologyActa Materialia
- Partner nations
- ChinaUnited StatesJapan
In The Last Decade
Jianxin Wang
91 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 80
- Mechanical Engineering 663
- Electrical and Electronic Engineering 577
- Materials Chemistry 232
- Fluid Flow and Transfer Processes 215
- Automotive Engineering 177
Countries citing papers authored by Jianxin Wang
This map shows the geographic impact of Jianxin Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jianxin Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jianxin Wang more than expected).
Fields of papers citing papers by Jianxin Wang
This network shows the impact of papers produced by Jianxin Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jianxin Wang. The network helps show where Jianxin Wang may publish in the future.
Co-authorship network of co-authors of Jianxin Wang
This figure shows the co-authorship network connecting the top 25 collaborators of Jianxin Wang. A scholar is included among the top collaborators of Jianxin Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jianxin Wang. Jianxin Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 9 | |
| 7 | 52 | |
| 8 | 4 | |
| 9 | Sn‐Biはんだの引張特性に及ぼすZn,Zn‐AlおよびZn‐添加の影響 | 4 |
| 10 | Analysis of peeling defect on the surface of 2205 duplex stainless steel | 1 |
| 11 | Compared study on properties of SnZn-based lead free solders | 0 |
| 12 | 9 | |
| 13 | Wettability of Sn-9Zn-xAg lead-free solder and mechanical properties of soldered joints | 1 |
| 14 | Effects of different fluxes on the characteristics of Sn-Zn solders | 2 |
| 15 | Effects of thermal cycling on mechanical property of chip resistor joints soldered with Sn-Cu-Ni-Ce solder | 1 |
| 16 | Influence of current waveform on rail-gun launching efficiency | 3 |
| 17 | Effect of Ag, Al, Ga addition on wettability of Sn-9Zn lead-free solder | 7 |
| 18 | EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE(QFP)SOLDERED JOINTS | 2 |
| 19 | 0 | |
| 20 | Manufaiture of normal tempreture and fast parkerizing fluid | 2 |
About Jianxin Wang
Jianxin Wang is a scholar working on Mechanical Engineering, Fluid Flow and Transfer Processes and Ceramics and Composites, having authored 100 papers that have together received 1.3k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (23 papers) and Advanced Welding Techniques Analysis (20 papers). The work is most often cited by research in Fluid Flow and Transfer Processes (215 citations), Mechanical Engineering (663 citations) and Automotive Engineering (177 citations). Jianxin Wang has collaborated with scholars based in China, United States and Japan. Frequent co-authors include Songbai Xue, J.M. Herreros, Chongming Wang, Roger Cracknell, Hongming Xu, Chad M. Landis, YU Sheng-lin, Hiroshi Nishikawa, Yan Chen and Chuan Liu. Their work appears in journals such as SHILAP Revista de lepidopterología, Bioresource Technology and Acta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.