Glenn Ross

497 total citations
41 papers, 366 citations indexed

About

Glenn Ross is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Glenn Ross has authored 41 papers receiving a total of 366 indexed citations (citations by other indexed papers that have themselves been cited), including 35 papers in Electrical and Electronic Engineering, 14 papers in Biomedical Engineering and 10 papers in Mechanical Engineering. Recurrent topics in Glenn Ross's work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Acoustic Wave Resonator Technologies (10 papers). Glenn Ross is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (21 papers) and Acoustic Wave Resonator Technologies (10 papers). Glenn Ross collaborates with scholars based in Finland, Germany and Austria. Glenn Ross's co-authors include Mervi Paulasto‐Kröckel, Vesa Vuorinen, Tuomas Pensala, Per Malmberg, Agnė Žukauskaitė, Harri Lipsanen, A. Miguel, Sami Suihkonen, Sami Franssila and Joseph H. Hotchkiss and has published in prestigious journals such as Applied Physics Letters, Analytical Chemistry and ACS Applied Materials & Interfaces.

In The Last Decade

Glenn Ross

39 papers receiving 353 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Glenn Ross Finland 12 270 121 103 66 65 41 366
Ryszard Kisiel Poland 11 404 1.5× 221 1.8× 21 0.2× 42 0.6× 30 0.5× 67 456
Dominique Bergogne France 12 571 2.1× 180 1.5× 52 0.5× 61 0.9× 13 0.2× 43 685
Charles Joubert France 5 270 1.0× 135 1.1× 52 0.5× 19 0.3× 12 0.2× 10 371
Vemal Raja Manikam Malaysia 7 433 1.6× 225 1.9× 41 0.4× 12 0.2× 26 0.4× 12 508
Zhenghao Gan Singapore 12 195 0.7× 50 0.4× 47 0.5× 20 0.3× 126 1.9× 35 345
Xiangang Xu China 10 215 0.8× 51 0.4× 42 0.4× 33 0.5× 32 0.5× 29 356
Dominique Tournier France 15 830 3.1× 150 1.2× 77 0.7× 75 1.1× 23 0.4× 79 956
H. Hirshy United Kingdom 12 138 0.5× 56 0.5× 89 0.9× 156 2.4× 36 0.6× 26 308
W.W. So United States 8 195 0.7× 78 0.6× 16 0.2× 49 0.7× 26 0.4× 16 338

Countries citing papers authored by Glenn Ross

Since Specialization
Citations

This map shows the geographic impact of Glenn Ross's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Glenn Ross with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Glenn Ross more than expected).

Fields of papers citing papers by Glenn Ross

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Glenn Ross. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Glenn Ross. The network helps show where Glenn Ross may publish in the future.

Co-authorship network of co-authors of Glenn Ross

This figure shows the co-authorship network connecting the top 25 collaborators of Glenn Ross. A scholar is included among the top collaborators of Glenn Ross based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Glenn Ross. Glenn Ross is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Große, Christian U., et al.. (2024). Electromigration Reliability of Cu3Sn Microbumps for 3D Heterogeneous Integration. Aaltodoc (Aalto University). 1–7.
2.
Ross, Glenn, et al.. (2024). Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication. Advanced Electronic Materials. 10(4). 2 indexed citations
3.
Miikkulainen, Ville, et al.. (2024). Scaling of piezoelectric in-plane NEMS: Towards nanoscale integration of AlN-based transducer on vertical sidewalls. Materials & Design. 244. 113116–113116. 3 indexed citations
4.
Vuorinen, Vesa, et al.. (2024). Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects. Materials Characterization. 209. 113772–113772. 1 indexed citations
5.
Ross, Glenn, et al.. (2023). In‐Plane AlN‐based Actuator: Toward a New Generation of Piezoelectric MEMS. Advanced Electronic Materials. 9(8). 5 indexed citations
6.
Ross, Glenn, et al.. (2023). Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope. Micromachines. 14(3). 698–698. 3 indexed citations
7.
Ross, Glenn, et al.. (2023). In‐Plane AlN‐Based Actuator: Toward a New Generation of Piezoelectric MEMS. Advanced Electronic Materials. 9(12). 2 indexed citations
8.
Vuorinen, Vesa, et al.. (2023). Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics. Materials Science and Engineering A. 881. 145398–145398. 16 indexed citations
9.
Vuorinen, Vesa, et al.. (2022). Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(5). 847–856. 8 indexed citations
10.
Vuorinen, Vesa, et al.. (2022). Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C. Scripta Materialia. 222. 114998–114998. 17 indexed citations
11.
Ross, Glenn, et al.. (2022). Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs. IEEE Transactions on Electron Devices. 70(1). 222–229. 13 indexed citations
12.
Ross, R., et al.. (2022). Aluminium corrosion in power semiconductor devices. Microelectronics Reliability. 137. 114766–114766. 7 indexed citations
13.
Ross, Glenn, et al.. (2022). Unlocking the potential of piezoelectric films grown on vertical surfaces for inertial MEMS. Materials Today Communications. 33. 104522–104522. 4 indexed citations
14.
Ross, Glenn, A. Miguel, Mervi Paulasto‐Kröckel, et al.. (2021). Stability and residual stresses of sputtered wurtzite AlScN thin films. Physical Review Materials. 5(3). 31 indexed citations
15.
Vuorinen, Vesa, et al.. (2021). Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding. Journal of Alloys and Compounds. 890. 161852–161852. 5 indexed citations
16.
Ross, Glenn. (2019). Intermetallic Void Formation in Cu-Sn Micro-Connects. Aaltodoc (Aalto University). 1 indexed citations
17.
Ross, Glenn, et al.. (2018). The effect of platinum contact metallization on Cu/Sn bonding. Journal of Materials Science Materials in Electronics. 29(17). 15212–15222. 4 indexed citations
18.
Ross, Glenn, et al.. (2018). Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 36(2). 24 indexed citations
19.
Ross, Glenn, et al.. (2017). XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. Microelectronics Reliability. 76-77. 390–394. 2 indexed citations
20.
Ross, Glenn, Xiaoma Tao, Vesa Vuorinen, et al.. (2017). Interfacial void segregation of Cl in Cu-Sn micro-connects. Electronic Materials Letters. 13(4). 307–312. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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