H. Qin
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering top 10%
- Mechanical Engineering top 10%
- Polymers and Plastics top 10%
- Materials Chemistry
- Co-authors
- Yan LiuMin ZhangWei ZhaoHai WangYiu‐Wing MaiX.P. ZhangMin-Bo ZhouXin‐Ping Zhang
- Topics
- Electronic Packaging and Soldering Technologies (23 papers)3D IC and TSV technologies (15 papers)Advanced Sensor and Energy Harvesting Materials (7 papers)
- Journals
- SHILAP Revista de lepidopterologíaMaterials Science and Engineering ASensors
- Partner nations
- ChinaUnited StatesAustralia
In The Last Decade
H. Qin
49 papers receiving 699 citations
Peers
Comparison fields: 5 of 87
- Electrical and Electronic Engineering 407
- Biomedical Engineering 334
- Mechanical Engineering 180
- Polymers and Plastics 108
- Materials Chemistry 67
Countries citing papers authored by H. Qin
This map shows the geographic impact of H. Qin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Qin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Qin more than expected).
Fields of papers citing papers by H. Qin
This network shows the impact of papers produced by H. Qin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Qin. The network helps show where H. Qin may publish in the future.
Co-authorship network of co-authors of H. Qin
This figure shows the co-authorship network connecting the top 25 collaborators of H. Qin. A scholar is included among the top collaborators of H. Qin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Qin. H. Qin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 4 | |
| 5 | 7 | |
| 6 | 4 | |
| 7 | 1 | |
| 8 | 15 | |
| 9 | 2 | |
| 10 | 16 | |
| 11 | 10 | |
| 12 | 56 | |
| 13 | 12 | |
| 14 | 6 | |
| 15 | 2 | |
| 16 | 12 | |
| 17 | 6 | |
| 18 | 24 | |
| 19 | 3 | |
| 20 | 1 |
About H. Qin
H. Qin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials, having authored 55 papers that have together received 725 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (15 papers) and Advanced Sensor and Energy Harvesting Materials (7 papers). The work is most often cited by research in Polymers and Plastics (108 citations), Biomedical Engineering (334 citations) and Electrical and Electronic Engineering (407 citations). H. Qin has collaborated with scholars based in China, United States and Australia. Frequent co-authors include Yan Liu, Min Zhang, Wei Zhao, Hai Wang, Yiu‐Wing Mai, X.P. Zhang, Min-Bo Zhou, Xin‐Ping Zhang, Wei Zhao and Yan Liu. Their work appears in journals such as SHILAP Revista de lepidopterología, Materials Science and Engineering A and Sensors.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.