Meredith Wetzel
Impact in
- Condensed Matter Physics top 5%
- GaN-based semiconductor devices and materials
-
- Radio Frequency Integrated Circuit Design
- Advanced Power Amplifier Design
- Microwave Engineering and Waveguides
- Silicon Carbide Semiconductor Technologies
Papers in
-
- Radio Frequency Integrated Circuit Design 15
- Advanced Power Amplifier Design 4
- 3D IC and TSV technologies 2
-
- GaN-based semiconductor devices and materials 12
- Co-authors
- Jan Czarnecki (4 shared papers)Jens Holtmannspötter (4 shared papers)M. Micovic (13 shared papers)D. H. Chow (9 shared papers)A. Kurdoghlian (11 shared papers)P. Hashimoto (9 shared papers)H.‐J. Gudladt (4 shared papers)P. J. Willadsen (9 shared papers)
- Journals
- The Journal of Adhesion (2 papers)IEEE Electron Device Letters (1 paper)Applied Surface Science (1 paper)IEEE Transactions on Advanced Packaging (1 paper)International Journal of Adhesion and Adhesives (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
Meredith Wetzel
23 papers receiving 506 citations
Peers
Comparison fields: 5 of 41
- Condensed Matter Physics 240
- Electrical and Electronic Engineering 361
- Mechanics of Materials 126
- Surfaces, Coatings and Films 24
- Electronic, Optical and Magnetic Materials 50
Countries citing papers authored by Meredith Wetzel
This map shows the geographic impact of Meredith Wetzel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Meredith Wetzel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Meredith Wetzel more than expected).
Fields of papers citing papers by Meredith Wetzel
This network shows the impact of papers produced by Meredith Wetzel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Meredith Wetzel. The network helps show where Meredith Wetzel may publish in the future.
Co-authors
The 25 scholars most cited alongside Meredith Wetzel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 80 | |
| 2 | 2006 | 75 | |
| 3 | 2012 | 53 | |
| 4 | 2006 | 47 | |
| 5 | 2007 | 43 | |
| 6 | 2008 | 38 | |
| 7 | 2014 | 32 | |
| 8 | 2013 | 27 | |
| 9 | 2011 | 18 | |
| 10 | 2012 | 17 | |
| 11 | 2012 | 16 | |
| 12 | 2008 | 14 | |
| 13 | 2008 | 13 | |
| 14 | 2013 | 10 | |
| 15 | 2006 | 8 | |
| 16 | 2002 | 8 | |
| 17 | 2008 | 7 | |
| 18 | 2002 | 6 | |
| 19 | 2012 | 5 | |
| 20 | 2003 | 4 |
About Meredith Wetzel
Meredith Wetzel is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics, Mechanics of Materials, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics, having authored 23 papers that have together received 528 indexed citations. Recurring topics across this work include Radio Frequency Integrated Circuit Design (15 papers), GaN-based semiconductor devices and materials (12 papers), Ga2O3 and related materials (4 papers), Advanced Power Amplifier Design (4 papers), Semiconductor Quantum Structures and Devices (3 papers), Mechanical Behavior of Composites (3 papers), Acoustic Wave Resonator Technologies (2 papers) and 3D IC and TSV technologies (2 papers). The work is most often cited by research in Condensed Matter Physics (240 citations), Electrical and Electronic Engineering (361 citations), Mechanics of Materials (126 citations), Surfaces, Coatings and Films (24 citations) and Electronic, Optical and Magnetic Materials (50 citations). Meredith Wetzel has collaborated with scholars based in United States and Germany. Frequent co-authors include Jan Czarnecki, Jens Holtmannspötter, M. Micovic, D. H. Chow, A. Kurdoghlian, P. Hashimoto, H.‐J. Gudladt, P. J. Willadsen, Ming Hu and A. Schmitz. Their work appears in journals such as The Journal of Adhesion, IEEE Electron Device Letters, Applied Surface Science, IEEE Transactions on Advanced Packaging and International Journal of Adhesion and Adhesives.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.