M.A.J. van Gils

945 total citations
28 papers, 671 citations indexed

About

M.A.J. van Gils is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Statistics, Probability and Uncertainty. According to data from OpenAlex, M.A.J. van Gils has authored 28 papers receiving a total of 671 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 16 papers in Mechanics of Materials and 4 papers in Statistics, Probability and Uncertainty. Recurrent topics in M.A.J. van Gils's work include Electronic Packaging and Soldering Technologies (22 papers), Mechanical Behavior of Composites (10 papers) and 3D IC and TSV technologies (9 papers). M.A.J. van Gils is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), Mechanical Behavior of Composites (10 papers) and 3D IC and TSV technologies (9 papers). M.A.J. van Gils collaborates with scholars based in Netherlands, United States and Finland. M.A.J. van Gils's co-authors include W.A.M. Brekelmans, J.H.P. De Vree, W.D. van Driel, J.H.J. Janssen, L.J. Ernst, G.Q. Zhang, O. van der Sluis, H. C. W. Beijerinck, Xuejun Fan and P.J.G. Schreurs and has published in prestigious journals such as Sensors and Actuators A Physical, Computers & Structures and International Journal of Fracture.

In The Last Decade

M.A.J. van Gils

27 papers receiving 618 citations

Peers

Countries citing papers authored by M.A.J. van Gils

Since Specialization

Citations

This map shows the geographic impact of M.A.J. van Gils's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M.A.J. van Gils with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M.A.J. van Gils more than expected).

Fields of papers citing papers by M.A.J. van Gils

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M.A.J. van Gils. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M.A.J. van Gils. The network helps show where M.A.J. van Gils may publish in the future.

Co-authorship network of co-authors of M.A.J. van Gils

This figure shows the co-authorship network connecting the top 25 collaborators of M.A.J. van Gils. A scholar is included among the top collaborators of M.A.J. van Gils based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M.A.J. van Gils. M.A.J. van Gils is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Squeeze film damping in the free molecular flow regime with full thermal accommodation 2009 ·Sensors and Actuators A Physical ·(unknown), (unknown), M.A.J. van Gils, H. C. W. Beijerinck	30
2	Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages 2008 ·IEEE Transactions on Components and Packaging Technologies ·W.D. van Driel, M.A.J. van Gils, Xuejun Fan, (unknown), L.J. Ernst	27
3	Temperature stability of a piezoresistive MEMS resonator including self-heating 2008 ·Microelectronics Reliability ·(unknown), (unknown), (unknown), J.T.M. van Beek, Daming Wu, M.A.J. van Gils, (unknown)	7
4	Hermeticity testing of capacitive RF MEMS switches 2008 ·P.J. van der Wel, (unknown), (unknown), (unknown), Arnold J. den Dekker, M.A.J. van Gils, R.J. Havens	3
5	Characterization of Interface Strength as function of Temperature and Moisture Conditions 2006 ·W.D. van Driel, (unknown), M.A.J. van Gils, (unknown)	10
6	Advanced structural similarity rules for the BGA package family 2006 ·Microelectronics Reliability ·W.D. van Driel, (unknown), M.A.J. van Gils, (unknown)	11
7	Mixed Mode Bending Test for Interfacial Adhesion in Semiconductor Applications 2006 ·TU/e Research Portal ·(unknown), W.D. van Driel, M.A.J. van Gils, O. van der Sluis	1
8	Efficient Damage Sensitivity Analysis of advanced Cu Low-k Bond Pad Structures Using Area Release Energy 2006 ·O. van der Sluis, R.A.B. Engelen, W.D. van Driel, M.A.J. van Gils, (unknown)	8
9	Delamination prediction in stacked back-end structure underneath bond pads 2006 ·TU/e Research Portal ·(unknown), (unknown), M.A.J. van Gils, R.H.J. Peerlings	4
10	Interfacial Adhesion Method for Semiconductor Applications Covering the Full Mode Mixity 2006 ·TU/e Research Portal ·(unknown), W.D. van Driel, M.A.J. van Gils, O. van der Sluis	4
11	Driving mechanisms of delamination related reliability problems in exposed pad packages 2005 ·W.D. van Driel, H.J.L. Bressers, J.H.J. Janssen, (unknown), (unknown), M.A.J. van Gils, (unknown), (unknown), (unknown), L.J. Ernst	12
12	Prediction of Delamination Related IC & Packaging Reliability Problems 2005 ·Microelectronics Reliability ·W.D. van Driel, M.A.J. van Gils, (unknown), G.Q. Zhang	33
13	Multi-Physics Based Structural Similarity Rules for the BGA Package Family 2005 ·W.D. van Driel, (unknown), M.A.J. van Gils, (unknown), Daoguo Yang, L.J. Ernst	2
14	On wire failures in micro-electronic packages 2004 ·W.D. van Driel, J.H.J. Janssen, (unknown), M.A.J. van Gils, (unknown), L.J. Ernst	17
15	Buckling failure of compressive loaded hard layers in flexible devices 2004 ·MRS Proceedings ·Piet Bouten, M.A.J. van Gils	7
16	Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods 2004 ·Microelectronics Reliability ·W.D. van Driel, (unknown), (unknown), J.H.J. Janssen, (unknown), M.A.J. van Gils, L.J. Ernst	25
17	Characterization and Modelling of Moisture Driven Interface Failures 2004 ·Microelectronics Reliability ·M.A.J. van Gils, (unknown), (unknown), W.D. van Driel, P.J.G. Schreurs	26
18	Thermal shock predictions for refractory ceramics 1997 ·M.A.J. van Gils, L.J.M.G. Dortmans	2
19	Size effect predictions by fracture models for a refractory ceramic 1996 ·International Journal of Fracture ·M.A.J. van Gils, L.J.M.G. Dortmans, Gijsbertus de With, W.A.M. Brekelmans, J.H.P. De Vree	7
20	Comparison of nonlocal approaches in continuum damage mechanics 1995 ·Computers & Structures ·J.H.P. De Vree, W.A.M. Brekelmans, M.A.J. van Gils	326

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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