G. Khatibi

2.0k total citations
127 papers, 1.5k citations indexed

About

G. Khatibi is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, G. Khatibi has authored 127 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 78 papers in Electrical and Electronic Engineering, 60 papers in Mechanical Engineering and 56 papers in Mechanics of Materials. Recurrent topics in G. Khatibi's work include Electronic Packaging and Soldering Technologies (64 papers), Metal and Thin Film Mechanics (25 papers) and Aluminum Alloys Composites Properties (21 papers). G. Khatibi is often cited by papers focused on Electronic Packaging and Soldering Technologies (64 papers), Metal and Thin Film Mechanics (25 papers) and Aluminum Alloys Composites Properties (21 papers). G. Khatibi collaborates with scholars based in Austria, Germany and Denmark. G. Khatibi's co-authors include B. Weiß, M. Lederer, V. Gröger, M. Zehetbauer, Martin Klein, Jelena Horky, M. Thoben, Herbert Ipser, F. Khodabakhshi and Herbert Danninger and has published in prestigious journals such as SHILAP Revista de lepidopterología, Materials Science and Engineering A and Journal of Materials Science.

In The Last Decade

G. Khatibi

118 papers receiving 1.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G. Khatibi Austria 22 836 808 509 486 129 127 1.5k
M.O. Alam Hong Kong 22 784 0.9× 1.4k 1.7× 170 0.3× 185 0.4× 109 0.8× 52 1.5k
Dekui Mu China 22 960 1.1× 625 0.8× 246 0.5× 384 0.8× 95 0.7× 49 1.3k
Tae-Kyu Lee United States 22 949 1.1× 1.1k 1.3× 228 0.4× 260 0.5× 243 1.9× 86 1.4k
Sung-Tae Hong South Korea 26 1.7k 2.1× 910 1.1× 294 0.6× 873 1.8× 517 4.0× 115 2.5k
Y.-L. Shen United States 22 1.2k 1.5× 176 0.2× 785 1.5× 736 1.5× 239 1.9× 53 1.7k
Xiuqing Hao China 21 735 0.9× 395 0.5× 320 0.6× 213 0.4× 50 0.4× 71 1.3k
W. J. Plumbridge United Kingdom 21 902 1.1× 642 0.8× 465 0.9× 355 0.7× 226 1.8× 82 1.3k
Frank Goodwin United States 26 1.6k 2.0× 266 0.3× 360 0.7× 852 1.8× 345 2.7× 142 2.2k
Toshihiko Koseki Japan 24 1.7k 2.0× 240 0.3× 463 0.9× 1.0k 2.1× 307 2.4× 96 2.1k

Countries citing papers authored by G. Khatibi

Since Specialization
Citations

This map shows the geographic impact of G. Khatibi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Khatibi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Khatibi more than expected).

Fields of papers citing papers by G. Khatibi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Khatibi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Khatibi. The network helps show where G. Khatibi may publish in the future.

Co-authorship network of co-authors of G. Khatibi

This figure shows the co-authorship network connecting the top 25 collaborators of G. Khatibi. A scholar is included among the top collaborators of G. Khatibi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. Khatibi. G. Khatibi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Géczy, Attila, Olivér Krammer, Balázs Illés, et al.. (2025). Influence of Fe-nanoparticle doped flux on electromigration effects in SAC305 solder joints. Journal of Materials Research and Technology. 38. 5866–5877.
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Khatibi, G., et al.. (2018). Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor Module. 1–7. 5 indexed citations
6.
Walter, Thomas & G. Khatibi. (2018). An advanced method for cyclic delamination studies of thin film multilayers in electronics. 1–6. 2 indexed citations
7.
Khatibi, G., et al.. (2018). Fatigue life time modelling of Cu and Au fine wires. SHILAP Revista de lepidopterología. 165. 6002–6002. 5 indexed citations
8.
Khatibi, G., et al.. (2018). Accelerated mechanical fatigue interconnect testing method for electrical wire bonds. tm - Technisches Messen. 85(4). 213–220. 16 indexed citations
9.
Pedersen, Kristian Bonderup, et al.. (2017). Wire bond degradation under thermo- and pure mechanical loading. Microelectronics Reliability. 76-77. 373–377. 15 indexed citations
10.
Walter, Thomas, M. Lederer, & G. Khatibi. (2016). Delamination of polyimide/Cu films under mixed mode loading. Microelectronics Reliability. 64. 281–286. 11 indexed citations
11.
Lassnig, Alice, et al.. (2015). Role of intermetallics on the mechanical fatigue behavior of Cu–Al ball bond interfaces. Journal of Alloys and Compounds. 646. 803–809. 17 indexed citations
12.
Lederer, M., G. Khatibi, & B. Weiß. (2013). FEM simulation of the size and constraining effect in lead free solder joints. SHILAP Revista de lepidopterología. 1 indexed citations
13.
Lassnig, Alice, et al.. (2013). Accelerated lifetime estimation of thermosonic Cu ball bonds on Al metallization. Microelectronic Engineering. 106. 188–194. 9 indexed citations
14.
Lederer, M., G. Khatibi, & B. Weiß. (2012). Constitutive modeling of pressure dependent plasticity and fracture in solder joints. International Journal of Solids and Structures. 49(23-24). 3453–3460. 11 indexed citations
15.
Danninger, Herbert, et al.. (2012). Gigacycle fatigue of ultra high density sintered alloy steels. Powder Metallurgy. 55(5). 378–387. 18 indexed citations
16.
Lederer, M., et al.. (2012). Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. Microelectronics Reliability. 52(9-10). 2353–2357. 70 indexed citations
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Khatibi, G., et al.. (2011). Influence of titanium surface contamination on the reliability of Al wire bonds. 1–7. 2 indexed citations
18.
Khatibi, G., et al.. (2010). A fast test technique for life time estimation of ultrasonically welded Cu–Cu interconnects. Microelectronics Reliability. 50(9-11). 1641–1644. 1 indexed citations
19.
Khatibi, G., et al.. (2009). A novel accelerated test technique for assessment of mechanical reliability of solder interconnects. Microelectronics Reliability. 49(9-11). 1283–1287. 7 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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