M. McCormack
- Condensed Matter Physics top 0.2%
-
- Magnetic and transport properties of perovskites and related materials 5
- Materials Chemistry top 2%
- Diamond and Carbon-based Materials Research 5
- General Materials Science top 0.5%
- Mechanical Engineering top 2%
- Advanced Welding Techniques Analysis 4
- Aluminum Alloys Composites Properties 4
-
- Electronic Packaging and Soldering Technologies 19
- 3D IC and TSV technologies 9
-
- Aluminum Alloy Microstructure Properties 4
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- Adhesion, Friction, and Surface Interactions 4
- Co-authors
- S. JinT. H. TiefelR. RameshR. A. FastnachtG. W. KammlottH. S. ChenShaowei JinH. M. O’Bryan
- Journals
- Applied Physics Letters (10 papers)Journal of Electronic Materials (6 papers)JOM (2 papers)
- Partner nations
- United StatesGermanyJapan
In The Last Decade
M. McCormack
33 papers receiving 6.4k citations
Hit Papers
Peers
Comparison fields: 5 of 65
- Condensed Matter Physics 4.2k
- Electronic, Optical and Magnetic Materials 5.0k
- Materials Chemistry 2.5k
- General Materials Science 146
- Mechanical Engineering 874
Countries citing papers authored by M. McCormack
This map shows the geographic impact of M. McCormack's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. McCormack with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. McCormack more than expected).
Fields of papers citing papers by M. McCormack
This network shows the impact of papers produced by M. McCormack. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. McCormack. The network helps show where M. McCormack may publish in the future.
Co-authorship network
The 25 scholars most cited alongside M. McCormack, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 36 | |
| 2 | 1999 | 1 | |
| 3 | Significantly Improved of Bi-Sn Solder Alloys Mechanical Properties by Ag-Doping | 1997 | 5 |
| 4 | 1997 | 107 | |
| 5 | 1996 | 15 | |
| 6 | 1996 | 13 | |
| 7 | 1995 | 144 | |
| 8 | 1995 | 244 | |
| 9 | 1994 | 324 | |
| 10 | 1994 | 16 | |
| 11 | 1994 | 140 | |
| 12 | 1994 | 5 | |
| 13 | 1994 | 7 | |
| 14 | Thousandfold Change in Resistivity in Magnetoresistive La-Ca-Mn-O Filmsbreakdown → | 1994 | 4153 |
| 15 | 1993 | 103 | |
| 16 | 1993 | 17 | |
| 17 | 1993 | 168 | |
| 18 | 1993 | 28 | |
| 19 | Fatigue and thermal fatigue of Pb-Sn solder joints | 1987 | 12 |
| 20 | Fatigue and thermal fatigue testing of Pb-Sn solder joints | 1987 | 12 |
About M. McCormack
M. McCormack is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Condensed Matter Physics, having authored 33 papers that have together received 6.6k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (9 papers), Magnetic and transport properties of perovskites and related materials (5 papers), Diamond and Carbon-based Materials Research (5 papers), Aluminum Alloy Microstructure Properties (4 papers), Advanced Welding Techniques Analysis (4 papers), Adhesion, Friction, and Surface Interactions (4 papers) and Aluminum Alloys Composites Properties (4 papers). The work is most often cited by research in Condensed Matter Physics (4.2k citations), Electronic, Optical and Magnetic Materials (5.0k citations) and Materials Chemistry (2.5k citations). M. McCormack has collaborated with scholars based in United States, Germany and Japan. Frequent co-authors include S. Jin, T. H. Tiefel, R. Ramesh, R. A. Fastnacht, G. W. Kammlott, H. S. Chen, Shaowei Jin, H. M. O’Bryan, Julia M. Phillips and R. M. Fleming. Their work appears in journals such as Applied Physics Letters, Journal of Electronic Materials, JOM, Science and Diamond and Related Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.