S. Haque

436 total citations
25 papers, 332 citations indexed

About

S. Haque is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Materials Chemistry. According to data from OpenAlex, S. Haque has authored 25 papers receiving a total of 332 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 7 papers in Aerospace Engineering and 4 papers in Materials Chemistry. Recurrent topics in S. Haque's work include Electronic Packaging and Soldering Technologies (12 papers), Silicon Carbide Semiconductor Technologies (9 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). S. Haque is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Silicon Carbide Semiconductor Technologies (9 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). S. Haque collaborates with scholars based in United States, India and Finland. S. Haque's co-authors include Guo‐Quan Lu, Xingsheng Liu, Jinggang Wang, Bratin Ghosh, D.J. Nelson, D. Borojevic, Carlos Suchicital, F.C. Lee, Ray‐Lee Lin and Kun Xing and has published in prestigious journals such as ACS Applied Materials & Interfaces, IEEE Antennas and Wireless Propagation Letters and Microelectronics Reliability.

In The Last Decade

S. Haque

21 papers receiving 312 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S. Haque United States 9 292 54 43 37 26 25 332
Cuong Huynh United States 10 278 1.0× 63 1.2× 45 1.0× 18 0.5× 35 1.3× 45 317
Han Cui United States 10 214 0.7× 48 0.9× 30 0.7× 19 0.5× 17 0.7× 39 266
Ho‐Yun Lee South Korea 10 229 0.8× 36 0.7× 13 0.3× 34 0.9× 46 1.8× 30 284
Klas Brinkfeldt Sweden 8 106 0.4× 47 0.9× 11 0.3× 35 0.9× 49 1.9× 28 215
Arie Nawawi Singapore 10 340 1.2× 53 1.0× 19 0.4× 6 0.2× 50 1.9× 19 396
Xuan Li China 14 694 2.4× 42 0.8× 29 0.7× 101 2.7× 43 1.7× 58 767
J. Stanley United States 7 131 0.4× 35 0.6× 20 0.5× 24 0.6× 31 1.2× 16 231
Dong Yun Jung South Korea 10 288 1.0× 9 0.2× 43 1.0× 56 1.5× 59 2.3× 53 346
M. Tecpoyotl‐Torres Mexico 7 135 0.5× 22 0.4× 34 0.8× 13 0.4× 26 1.0× 75 224
Jiahao Niu United States 16 661 2.3× 75 1.4× 10 0.2× 158 4.3× 40 1.5× 39 761

Countries citing papers authored by S. Haque

Since Specialization
Citations

This map shows the geographic impact of S. Haque's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Haque with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Haque more than expected).

Fields of papers citing papers by S. Haque

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Haque. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Haque. The network helps show where S. Haque may publish in the future.

Co-authorship network of co-authors of S. Haque

This figure shows the co-authorship network connecting the top 25 collaborators of S. Haque. A scholar is included among the top collaborators of S. Haque based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Haque. S. Haque is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Silwal, Abhisesh, Xuemei Zhang, S. Haque, et al.. (2024). Towards an AI-Driven Cyber-Physical System for Closed-Loop Control of Plant Diseases. Proceedings of the AAAI Symposium Series. 4(1). 432–435. 1 indexed citations
3.
4.
Haque, S., et al.. (2017). Antenna miniaturization using disc slot and split ring. 4. 137–141.
5.
Ghosh, Bratin, et al.. (2013). Miniaturization of Slot Antennas Using Wire Loading. IEEE Antennas and Wireless Propagation Letters. 12. 488–491. 29 indexed citations
6.
Haque, S., Bratin Ghosh, & Debasis Mitra. (2010). Miniaturized C-slot patch antenna for wireless communication. 1–4. 5 indexed citations
7.
Farkas, Gábor, et al.. (2004). Electric and thermal transient effects in high power optical devices. 168–176. 45 indexed citations
8.
Fan, Xuejun & S. Haque. (2003). Emerging MOSFET packaging technologies and their thermal evaluation. 1102–1108. 15 indexed citations
9.
Haque, S. & Guo‐Quan Lu. (2003). Characterization of interfacial thermal resistance for packaging high-power electronics modules. 17. 1103–1110. 2 indexed citations
10.
Haque, S., Kexin Xing, Gao Qing Lu, et al.. (2002). Packaging for thermal management of power electronics building blocks using metal posts interconnected parallel plate structure. 1. 392–398. 10 indexed citations
11.
Haque, S., et al.. (2002). Thermal management of power electronics modules via acoustic micrography imaging. 1. 299–305. 3 indexed citations
12.
13.
Haque, S. & Guo‐Quan Lu. (2002). Metallization for direct solder interconnection of power devices. 90. 1475–1482.
14.
Liu, Xingsheng, S. Haque, Jinggang Wang, & Guo‐Quan Lu. (2002). Packaging of integrated power electronics modules using flip-chip technology. 1. 290–296. 57 indexed citations
15.
Liu, Xingsheng, S. Haque, & Guo‐Quan Lu. (2001). Three-dimensional flip-chip on flex packaging for power electronics applications. IEEE Transactions on Advanced Packaging. 24(1). 1–9. 44 indexed citations
16.
Haque, S. & Guo‐Quan Lu. (2001). Effects of device passivation materials on solderable metallization of IGBTs. Microelectronics Reliability. 41(5). 639–647. 1 indexed citations
17.
Haque, S., et al.. (2001). Design issues of a three-dimensional packaging scheme for power modules. Microelectronics Reliability. 41(2). 295–305. 7 indexed citations
18.
Haque, S., et al.. (2000). Characterization of interfacial thermal resistance by acoustic micrography imaging. Microelectronics Reliability. 40(3). 465–476. 9 indexed citations
19.
Haque, S., Kun Xing, Ray‐Lee Lin, et al.. (1999). An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures. IEEE Transactions on Advanced Packaging. 22(2). 136–144. 63 indexed citations
20.
Haque, S., et al.. (1999). Thermal management of power electronics modules packaged by a stacked-plate technique. Microelectronics Reliability. 39(9). 1343–1349. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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