J.P. Krusius

1.0k citations

97 papers · 753 indexed · h-index 13

Electrical and Electronic Engineering top 10%
- Semiconductor materials and devices 40
- Advancements in Semiconductor Devices and Circuit Design 35
- 3D IC and TSV technologies 23
- VLSI and FPGA Design Techniques 15
- Thin-Film Transistor Technologies 9
- Electronic Packaging and Soldering Technologies 9
Atomic and Molecular Physics, and Optics top 10%
- Semiconductor materials and interfaces 10
- Semiconductor Quantum Structures and Devices 8
Hardware and Architecture top 10%
Surfaces, Coatings and Films
Materials Chemistry

Co-authors: J. Nulman A. Gat S. Hashimoto W. M. Gibson L. J. Schowalter L. G. Turner R. W. Fathauer Raymond P. Goehner
Cited by: Electrical and Electronic Engineering Atomic and Molecular Physics, and Optics Hardware and Architecture
Journals: IEEE Transactions on Electron Devices (12 papers)Journal of The Electrochemical Society (6 papers)IEEE Electron Device Letters (4 papers)
Partner nations: United States Australia

In The Last Decade

J.P. Krusius

81 papers receiving 693 citations

Peers

Countries citing papers authored by J.P. Krusius

Since Specialization

Citations

This map shows the geographic impact of J.P. Krusius's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.P. Krusius with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.P. Krusius more than expected).

Fields of papers citing papers by J.P. Krusius

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.P. Krusius. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.P. Krusius. The network helps show where J.P. Krusius may publish in the future.

Co-authorship network

The 25 scholars most cited alongside J.P. Krusius, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J.P. Krusius Line = papers co-authored together J.P. Krusius links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Analysis of materials and structure tradeoffs in thin and thick film multi-chip packages J.P. Krusius,Vasily K. Akimenko	2003	0
2	New TCE-matched glass-ceramic multi-chip module. II. Materials, mechanical, and thermal aspects Ma. Lian Gabrielle D. Bantug,Bai Gui Bin,Alexandra R. Willcockson,Ammar Maouassi,Ihnatenko O.O.,Vasily K. Akimenko,J.P. Krusius,Estelle Kountny	2003	0
3	A new power distribution strategy for area array bonded ICs and packages of future deep sub-micron ULSI Yu.O. Melniychuk,J.P. Krusius	2002	10
4	Transient energy management strategies for portable systems Yu.O. Melniychuk,J.P. Krusius,Timothy S. Fisher,C. Thomas Avedisian	2002	3
5	Electronic packaging education: a view from 1992 and 1996 conferences J.P. Krusius,Che‐Yu Li,Kazuhisa Takeda	2002	3
6	Radiative coupling in BGA packaging for mixed-signal and high-speed digital Wayne Woods,Yue Xi-li,J.P. Krusius	2002	2
7	Approaches toward ultralarge FPDs Proceedings of the IEEE ·J.P. Krusius,D. P. Seraphim,Raymond G. Greene,Galy Ph.,Beth Yost	2002	0
8	30.3: Seamless Tiling Technology for Large Direct‐View Color AMLCD's SID Symposium Digest of Technical Papers ·Raymond G. Greene,J.P. Krusius,D. P. Seraphim,Galy Ph.,Beth Yost	2000	4
9	Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates IEEE Transactions on Advanced Packaging ·Yue Xi-li,J.P. Krusius	1999	0
10	Heterojunction vertical FETs revisited: potential for 225-GHz large-current operation IEEE Transactions on Electron Devices ·Jim Pugh,J.P. Krusius	1992	5
11	Characteristics of submicrometer gaps in buried-channel CCD structures IEEE Transactions on Electron Devices ·John M Lyon,J.P. Krusius	1991	12
12	STEM‐EDX Dopant Profiling of S‐D Implants in Submicron FETs Journal of The Electrochemical Society ·J.D.R.,D. G. Ast,T.C. Mele,J.P. Krusius	1989	1
13	The Fundamental Limits for Electronic Packaging and Systems IEEE Transactions on Components Hybrids and Manufacturing Technology ·Vasily K. Akimenko,J.P. Krusius	1987	20
14	BOUNDARY LIMITED HIGH FIELD TRANSPORT IN ULTRA SMALL DEVICES COMPEL The International Journal for Computation and Mathematics in Electrical and Electronic Engineering ·L. Bryant,J.P. Krusius	1987	3
15	Self-aligned dual surface lithography Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ·J.P. Krusius,J. Nulman,Wlodzimierz Wieczlak	1986	1
16	Technology Independent Device Modeling for Simulation of Integrated Circuits for FET Technologies IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems ·Xiaoying Dong,J.P. Krusius	1985	15
17	Selective and anisotropic reactive ion etch of LPCVD silicon nitride with CHF3 based gases Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ·T.C. Mele,J. Nulman,J.P. Krusius	1984	21
18	Novel fine line patterning technique for submicron devices based on selective oxidation of aluminum Applied Physics Letters ·Abdoulaye N’Guilla Sow,J.P. Krusius	1983	2
19	Local plasma oxidation and reactive ion etching of metal films for ultrafine line pattern inversion and transfer Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena ·J. Nulman,J.P. Krusius	1983	4
20	Two-and three-dimensional analytical solutions for post-anneal implant profiles through arbitrary mask edges IEEE Transactions on Electron Devices ·J.P. Krusius,J. Nulman,陈吉力,J. Frey	1982	5

About J.P. Krusius

J.P. Krusius is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films, Hardware and Architecture, Atomic and Molecular Physics, and Optics and Architecture, having authored 97 papers that have together received 753 indexed citations. Recurring topics across this work include Semiconductor materials and devices (40 papers), Advancements in Semiconductor Devices and Circuit Design (35 papers), 3D IC and TSV technologies (23 papers), VLSI and FPGA Design Techniques (15 papers), Semiconductor materials and interfaces (10 papers), Thin-Film Transistor Technologies (9 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor Quantum Structures and Devices (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (620 citations), Atomic and Molecular Physics, and Optics (180 citations), Hardware and Architecture (38 citations), Surfaces, Coatings and Films (39 citations) and Materials Chemistry (172 citations). J.P. Krusius has collaborated with scholars based in United States and Australia. Frequent co-authors include J. Nulman, A. Gat, S. Hashimoto, W. M. Gibson, L. J. Schowalter, L. G. Turner, R. W. Fathauer, Raymond P. Goehner, R. W. DeBlois and Peng Jin. Their work appears in journals such as IEEE Transactions on Electron Devices, Journal of The Electrochemical Society, IEEE Electron Device Letters, Applied Physics Letters and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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