J. Maiz

2.9k citations

32 papers · 1.4k indexed · h-index 15

Hardware and Architecture top 1%
Electrical and Electronic Engineering top 5%
- Semiconductor materials and devices 21
- Electronic Packaging and Soldering Technologies 9
- Radiation Effects in Electronics 9
- Integrated Circuits and Semiconductor Failure Analysis 7
- Advancements in Semiconductor Devices and Circuit Design 6
Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability 14
Mechanics of Materials top 10%
- Metal and Thin Film Mechanics 5
Safety, Risk, Reliability and Quality top 10%
Atomic and Molecular Physics, and Optics
- Semiconductor materials and interfaces 4

Co-authors: S.A. Hareland Peter R. Armstrong Kedong Zhang John J. Plombon E. Andideh Valery M. Dubin B. Bloechel Shekhar Borkar
Cited by: Hardware and Architecture Electrical and Electronic Engineering Electronic, Optical and Magnetic Materials
Journals: Applied Physics Letters (4 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Journal of materials research/Pratt's guide to venture capital sources (1 paper)
Partner nations: United States Spain Switzerland

In The Last Decade

J. Maiz

30 papers receiving 1.3k citations

Peers

Countries citing papers authored by J. Maiz

Since Specialization

Citations

This map shows the geographic impact of J. Maiz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Maiz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Maiz more than expected).

Fields of papers citing papers by J. Maiz

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Maiz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Maiz. The network helps show where J. Maiz may publish in the future.

Co-authorship network

The 25 scholars most cited alongside J. Maiz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. Maiz Line = papers co-authored together J. Maiz links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Characterization of SILC and its end-of-life reliability assessment on 45NM high-K and metal-gate technology Sangwoo Pae,T. Ghani,M. Hattendorf,J. Hicks,J. Jopling,J. Maiz,K. Mistry,Chi Xinxi,C. Prasad,Jami Wiedemer,Jian Xu	2009	10
2	Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction Applied Physics Letters ·Arief Suriadi Budiman,William D. Nix,Nobumichi Tamura,B. C. Valek,L Rademan,J. Maiz,Ralph Spolenak,J. R. Patel	2006	81
3	Methods for forming a frequency bulk acoustic resonator with uniform frequency utilizing multiple trimming layers and structures formed thereby The Journal of the Acoustical Society of America ·J. Maiz	2006	1
4	Influence of phonon, geometry, impurity, and grain size on Copper line resistivity Applied Physics Letters ·John J. Plombon,E. Andideh,Valery M. Dubin,J. Maiz	2006	126
5	Adhesion studies in integrated circuit interconnect structures Engineering Failure Analysis ·J.M. Molina-Aldareguía,Derrick Mirindi,David González,M.R. Elizalde,J.M. Sánchez,J.M. Martínez–Esnaola,J. Gil Sevillano,T. Scherban,Daniel Pantuso,Benyuan Sun,Guofeng Xu,B. Miner,Jie He,J. Maiz	2006	11
6	Radiation-Induced Soft Error Rates of Advanced CMOS Bulk Devices N. Seifert,Jaisree G,E. P. Starke,Balaji Narasimham,Z. Amiranashvili,Fujio HANYUH,Véronique Millot,Subhasish Mitra,B. Gill,J. Maiz	2006	159
7	Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements Journal of Applied Physics ·І.Ю. Гужва,Paul S. Ho,Rui Huang,Jihperng Leu,J. Maiz,T. Scherban	2005	60
8	Electromigration lifetime and critical void volume Applied Physics Letters ·Jun He,Zhigang Suo,T. Marieb,J. Maiz	2004	28
9	Characterization of multi-bit soft error events in advanced SRAMs J. Maiz,S.A. Hareland,Kedong Zhang,Peter R. Armstrong	2004	186
10	Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration MRS Proceedings ·Arief Suriadi Budiman,Nobumichi Tamura,B. C. Valek,L Rademan,J. Maiz,Ralph Spolenak,W. A. Caldwell,William D. Nix,J. R. Patel	2004	2
11	Characterization of electromigration under bidirectional (BC) and pulsed unidirectional (PDC) currents J. Maiz	2003	33
12	A resistance change methodology for the study of electromigration in Al-Si interconnects J. Maiz,Шамиль Фаритович Фарахутдинов	2003	2
13	A crosstalk sensor implementation for measuring interferences in digital CMOS VLSI circuits R. K. Speransky,M. Roca,R. Muñoz,J. Maiz,H. Górecki	2002	4
14	Alpha-SER modeling and simulation for sub-0.25 /spl mu/m CMOS technology Changhong Dai,照英,S.A. Hareland,J. Maiz,Ariane Girard	1999	12
15	Cross-sectional nanoindentation: a new technique for thin film interfacial adhesion characterization Acta Materialia ·J.M. Sánchez,Regina Küfner Lein,Benyuan Sun,T. Scherban,Nicholas X. Fang,Daniel Pantuso,W. K. Ford,M.R. Elizalde,J.M. Martínez–Esnaola,A. Martín‐Meizoso,J. Gil Sevillano,M. Fuentes,J. Maiz	1999	105
16	Physical analysis of electromigration damage under non-d.c. conditions Microelectronics Reliability ·E. Castaño,J. Maiz	1993	1
17	In situ observations of dc and ac electromigration in passivated Al lines Applied Physics Letters ·E. Castaño,J. Maiz,P. A. Flinn,Michael C. Madden	1991	35
18	Characterization of Electromigration under Bidirectional (BC) and Pulsed Unidirectional (PDC) Currents Reliability physics ·J. Maiz	1989	13
19	A Resistance Change Methodology for the Study of Electromigration in Al-Si Interconnects Reliability physics ·J. Maiz,浩小野道	1988	7
20	Electromigration Testing of Ti/Al-Si Metallization for Integrated Circuits J. Maiz,Karim Mohammed Razaul	1987	14

About J. Maiz

J. Maiz is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Software, Mechanics of Materials and Ceramics and Composites, having authored 32 papers that have together received 1.4k indexed citations. Recurring topics across this work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (14 papers), Electronic Packaging and Soldering Technologies (9 papers), Radiation Effects in Electronics (9 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Advancements in Semiconductor Devices and Circuit Design (6 papers), Metal and Thin Film Mechanics (5 papers) and Semiconductor materials and interfaces (4 papers). The work is most often cited by research in Hardware and Architecture (458 citations), Electrical and Electronic Engineering (1.2k citations), Electronic, Optical and Magnetic Materials (326 citations), Mechanics of Materials (181 citations) and Safety, Risk, Reliability and Quality (49 citations). J. Maiz has collaborated with scholars based in United States, Spain and Switzerland. Frequent co-authors include S.A. Hareland, Peter R. Armstrong, Kedong Zhang, John J. Plombon, E. Andideh, Valery M. Dubin, B. Bloechel, Shekhar Borkar, James Tschanz and P. Hazucha. Their work appears in journals such as Applied Physics Letters, IEEE Transactions on Device and Materials Reliability, Journal of materials research/Pratt's guide to venture capital sources, IEEE Journal of Solid-State Circuits and Engineering Failure Analysis.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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