J. Maiz

2.9k total citations
32 papers, 1.4k citations indexed

About

J. Maiz is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, J. Maiz has authored 32 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 14 papers in Electronic, Optical and Magnetic Materials and 5 papers in Mechanics of Materials. Recurrent topics in J. Maiz's work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (14 papers) and Electronic Packaging and Soldering Technologies (9 papers). J. Maiz is often cited by papers focused on Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (14 papers) and Electronic Packaging and Soldering Technologies (9 papers). J. Maiz collaborates with scholars based in United States, Spain and Switzerland. J. Maiz's co-authors include S.A. Hareland, Peter R. Armstrong, Kedong Zhang, John J. Plombon, E. Andideh, Valery M. Dubin, B. Bloechel, Shekhar Borkar, James Tschanz and P. Hazucha and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

J. Maiz

30 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Maiz United States 15 1.2k 458 326 181 133 32 1.4k
Ernest Y. Wu United States 29 2.4k 2.0× 96 0.2× 358 1.1× 48 0.3× 453 3.4× 138 2.7k
S. Krishnan United States 25 2.7k 2.2× 252 0.6× 114 0.3× 76 0.4× 223 1.7× 133 3.2k
Bucknell C. Webb United States 22 1.7k 1.4× 99 0.2× 258 0.8× 83 0.5× 115 0.9× 52 1.9k
D.J. Pearson United States 13 1.0k 0.8× 224 0.5× 237 0.7× 112 0.6× 236 1.8× 20 1.4k
A. Farcy France 17 834 0.7× 57 0.1× 199 0.6× 44 0.2× 115 0.9× 102 936
Mauro Ciappa Switzerland 20 2.2k 1.8× 45 0.1× 61 0.2× 81 0.4× 141 1.1× 126 2.3k
Yolanda Morilla Spain 13 281 0.2× 112 0.2× 35 0.1× 48 0.3× 110 0.8× 61 517
Bin Su China 19 471 0.4× 85 0.2× 133 0.4× 108 0.6× 1.0k 7.6× 68 1.3k
B.L. Draper United States 21 1.2k 1.0× 159 0.3× 25 0.1× 15 0.1× 121 0.9× 56 1.3k
A. Mercha Belgium 32 3.4k 2.8× 111 0.2× 95 0.3× 18 0.1× 161 1.2× 195 3.5k

Countries citing papers authored by J. Maiz

Since Specialization
Citations

This map shows the geographic impact of J. Maiz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Maiz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Maiz more than expected).

Fields of papers citing papers by J. Maiz

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Maiz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Maiz. The network helps show where J. Maiz may publish in the future.

Co-authorship network of co-authors of J. Maiz

This figure shows the co-authorship network connecting the top 25 collaborators of J. Maiz. A scholar is included among the top collaborators of J. Maiz based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Maiz. J. Maiz is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Pae, Sangwoo, T. Ghani, M. Hattendorf, et al.. (2009). Characterization of SILC and its end-of-life reliability assessment on 45NM high-K and metal-gate technology. 12. 499–504. 10 indexed citations
2.
Budiman, Arief Suriadi, William D. Nix, Nobumichi Tamura, et al.. (2006). Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction. Applied Physics Letters. 88(23). 81 indexed citations
3.
Maiz, J.. (2006). Methods for forming a frequency bulk acoustic resonator with uniform frequency utilizing multiple trimming layers and structures formed thereby. The Journal of the Acoustical Society of America. 119(3). 1305–1305. 1 indexed citations
4.
Plombon, John J., E. Andideh, Valery M. Dubin, & J. Maiz. (2006). Influence of phonon, geometry, impurity, and grain size on Copper line resistivity. Applied Physics Letters. 89(11). 126 indexed citations
5.
Molina-Aldareguía, J.M., David González, M.R. Elizalde, et al.. (2006). Adhesion studies in integrated circuit interconnect structures. Engineering Failure Analysis. 14(2). 349–354. 11 indexed citations
6.
Seifert, N., et al.. (2006). Radiation-Induced Soft Error Rates of Advanced CMOS Bulk Devices. 217–225. 159 indexed citations
7.
Ho, Paul S., et al.. (2005). Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements. Journal of Applied Physics. 97(10). 60 indexed citations
8.
He, Jun, Zhigang Suo, T. Marieb, & J. Maiz. (2004). Electromigration lifetime and critical void volume. Applied Physics Letters. 85(20). 4639–4641. 28 indexed citations
9.
Maiz, J., S.A. Hareland, Kedong Zhang, & Peter R. Armstrong. (2004). Characterization of multi-bit soft error events in advanced SRAMs. 21.4.1–21.4.4. 186 indexed citations
10.
Budiman, Arief Suriadi, Nobumichi Tamura, B. C. Valek, et al.. (2004). Unexpected Mode of Plastic Deformation in Cu Damascene Lines Undergoing Electromigration. MRS Proceedings. 812. 2 indexed citations
11.
12.
Maiz, J., et al.. (2003). A resistance change methodology for the study of electromigration in Al-Si interconnects. 57. 209–215. 2 indexed citations
13.
14.
Dai, Changhong, et al.. (1999). Alpha-SER modeling and simulation for sub-0.25 /spl mu/m CMOS technology. 81–82. 12 indexed citations
15.
Sánchez, J.M., Benyuan Sun, T. Scherban, et al.. (1999). Cross-sectional nanoindentation: a new technique for thin film interfacial adhesion characterization. Acta Materialia. 47(17). 4405–4413. 105 indexed citations
16.
Castaño, E. & J. Maiz. (1993). Physical analysis of electromigration damage under non-d.c. conditions. Microelectronics Reliability. 33(8). 1189–1198. 1 indexed citations
17.
Castaño, E., J. Maiz, P. A. Flinn, & Michael C. Madden. (1991). In situ observations of dc and ac electromigration in passivated Al lines. Applied Physics Letters. 59(1). 129–131. 35 indexed citations
18.
19.
Maiz, J., et al.. (1988). A Resistance Change Methodology for the Study of Electromigration in Al-Si Interconnects. Reliability physics. 209–215. 7 indexed citations
20.
Maiz, J., et al.. (1987). Electromigration Testing of Ti/Al-Si Metallization for Integrated Circuits. 145–153. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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