J. J. Clement

1000 total citations
23 papers, 724 citations indexed

About

J. J. Clement is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, J. J. Clement has authored 23 papers receiving a total of 724 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 20 papers in Electronic, Optical and Magnetic Materials and 5 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in J. J. Clement's work include Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (11 papers). J. J. Clement is often cited by papers focused on Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (11 papers). J. J. Clement collaborates with scholars based in United States and Singapore. J. J. Clement's co-authors include J. R. Lloyd, Carl V. Thompson, B. Miner, Gary H. Bernstein, Edward I. Cole, K. L. Pey, Huay Ling Tay, M. Radhakrishnan, Mary Ann Miller and Fanrong Wei and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.

In The Last Decade

J. J. Clement

23 papers receiving 685 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J. J. Clement United States	14	658	620	138	82	76	23	724
H. Kawasaki United States	14	535 0.8×	337 0.5×	86 0.6×	82 1.0×	53 0.7×	72	591
B. Agarwala United States	9	305 0.5×	251 0.4×	63 0.5×	57 0.7×	33 0.4×	15	334
M.S.P. Lucas United States	7	301 0.5×	265 0.4×	81 0.6×	153 1.9×	30 0.4×	19	390
Roberto Lacerda de Orio Austria	9	336 0.5×	219 0.4×	50 0.4×	110 1.3×	25 0.3×	74	392
X. Federspiel France	15	758 1.2×	178 0.3×	33 0.2×	58 0.7×	29 0.4×	109	787
M. Tack Belgium	19	1.2k 1.8×	192 0.3×	25 0.2×	117 1.4×	73 1.0×	79	1.3k
Don Disney United States	12	827 1.3×	244 0.4×	22 0.2×	98 1.2×	91 1.2×	35	943
N. Yokoyama Japan	13	404 0.6×	45 0.1×	70 0.5×	161 2.0×	74 1.0×	32	470
Qihao Song United States	14	583 0.9×	147 0.2×	13 0.1×	69 0.8×	75 1.0×	48	690
Ivan A. Starkov Russia	14	308 0.5×	178 0.3×	60 0.4×	55 0.7×	268 3.5×	77	595

Countries citing papers authored by J. J. Clement

Since Specialization

Citations

This map shows the geographic impact of J. J. Clement's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. J. Clement with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. J. Clement more than expected).

Fields of papers citing papers by J. J. Clement

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. J. Clement. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. J. Clement. The network helps show where J. J. Clement may publish in the future.

Co-authorship network of co-authors of J. J. Clement

This figure shows the co-authorship network connecting the top 25 collaborators of J. J. Clement. A scholar is included among the top collaborators of J. J. Clement based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. J. Clement. J. J. Clement is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Clement, J. J., et al.. (2015). Visible Light LVP on Bulk Silicon Devices. Proceedings - International Symposium for Testing and Failure Analysis. 81030. 6–13. 6 indexed citations

Clement, J. J., et al.. (2014). Visible Light LVP on Ultra-Thinned Substrates. Proceedings - International Symposium for Testing and Failure Analysis. 30927. 110–114. 4 indexed citations

Wei, Fanrong, Chee Lip Gan, Carl V. Thompson, et al.. (2002). Length Effects on the Reliability of Dual-Damascene Cu Interconnects. MRS Proceedings. 716. 8 indexed citations

Clement, J. J., et al.. (2002). Finite element numerical modeling of currents in VLSI interconnects. 149–156. 3 indexed citations

Clement, J. J.. (2001). Electromigration modeling for integrated circuit interconnect reliability analysis. IEEE Transactions on Device and Materials Reliability. 1(1). 33–42. 57 indexed citations

Thompson, Carl V., et al.. (1998). A hierarchical reliability analysis for circuit design evaluation. IEEE Transactions on Electron Devices. 45(10). 2254–2257. 21 indexed citations

Clement, J. J., et al.. (1997). Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects. Journal of Applied Physics. 81(9). 6073–6080. 62 indexed citations

Clement, J. J.. (1997). Reliability analysis for encapsulated interconnect lines under dc and pulsed dc current using a continuum electromigration transport model. Journal of Applied Physics. 82(12). 5991–6000. 59 indexed citations

Bernstein, Gary H., et al.. (1996). Pulsed-current duty cycle dependence of electromigration-induced stress generation in aluminum conductors. IEEE Electron Device Letters. 17(5). 244–246. 12 indexed citations

10.

Lloyd, J. R. & J. J. Clement. (1995). Electromigration in copper conductors. Thin Solid Films. 262(1-2). 135–141. 196 indexed citations

11.

Clement, J. J., et al.. (1995). Coupled Stress Evolution in Polygranular Clusters and Bamboo Segments in Near-Bamboo Interconnects. MRS Proceedings. 391. 20 indexed citations

12.

Clement, J. J., J. R. Lloyd, & Carl V. Thompson. (1995). Failure in Tungsten-Filled Via Structures. MRS Proceedings. 391. 17 indexed citations

13.

Clement, J. J., et al.. (1994). Modeling Electromigration-Induced Stress Buildup Due to Nonuniform Temperature. MRS Proceedings. 338. 3 indexed citations

14.

Clement, J. J., et al.. (1994). Two electromigration failure modes in polycrystalline aluminum interconnects. 213–224. 14 indexed citations

15.

Clement, J. J., et al.. (1993). Characterization of Two Electromigration Failure Modes In Submicron Vlsi. MRS Proceedings. 309. 18 indexed citations

16.

Clement, J. J., et al.. (1992). Electromigration Reliability of VLSI Interconnect.. 4. 114–125. 5 indexed citations

17.

Clement, J. J.. (1992). Vacancy Supersaturation Model for Electromigration Failure Under DC and Pulsed DC Stress. MRS Proceedings. 265(1). 57–63. 3 indexed citations

18.

Clement, J. J.. (1992). Vacancy supersaturation model for electromigration failure under dc and pulsed dc stress. Journal of Applied Physics. 71(9). 4264–4268. 32 indexed citations

19.

Clement, J. J. & J. R. Lloyd. (1992). Numerical investigations of the electromigration boundary value problem. Journal of Applied Physics. 71(4). 1729–1731. 50 indexed citations

20.

Clement, J. J.. (1978). A study of radiation effects in MOS capacitors. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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