Hao Pan
Impact in
- Automotive Engineering top 10%
- Advanced Battery Technologies Research
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- Electric Vehicles and Infrastructure
- Smart Grid Energy Management
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 9
- 3D IC and TSV technologies 5
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- Aluminum Alloys Composites Properties 3
- Intermetallics and Advanced Alloy Properties 3
- Additive Manufacturing Materials and Processes 2
- Co-authors
- Hongjun Ji (11 shared papers)Mingyu Li (9 shared papers)Zhao Yang Dong (1 shared paper)Mingyong Lai (1 shared paper)Fengji Luo (1 shared paper)Jing Qiu (1 shared paper)Hongming Yang (1 shared paper)Youjun Deng (1 shared paper)
- Journals
- Journal of Alloys and Compounds (1 paper)MATERIALS TRANSACTIONS (1 paper)IEEE Transactions on Dielectrics and Electrical Insulation (1 paper)Journal of Materials Research and Technology (1 paper)Materials Letters (1 paper)
- Partner nations
- ChinaAustraliaUnited States
In The Last Decade
Hao Pan
23 papers receiving 373 citations
Peers
Comparison fields: 5 of 61
- Automotive Engineering 78
- Electrical and Electronic Engineering 228
- Energy Engineering and Power Technology 10
- Control and Systems Engineering 63
- Mechanical Engineering 81
Countries citing papers authored by Hao Pan
This map shows the geographic impact of Hao Pan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hao Pan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hao Pan more than expected).
Fields of papers citing papers by Hao Pan
This network shows the impact of papers produced by Hao Pan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hao Pan. The network helps show where Hao Pan may publish in the future.
Co-authors
The 25 scholars most cited alongside Hao Pan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 105 | |
| 2 | 2019 | 59 | |
| 3 | 2019 | 41 | |
| 4 | 2020 | 31 | |
| 5 | 2022 | 30 | |
| 6 | 2019 | 24 | |
| 7 | 2002 | 15 | |
| 8 | 2019 | 14 | |
| 9 | 2021 | 12 | |
| 10 | 2022 | 8 | |
| 11 | 2020 | 8 | |
| 12 | 2022 | 7 | |
| 13 | 2024 | 5 | |
| 14 | THE STRESS INTESITY FACTORS OF A SINGLEEDGE CRACKED BAR LOADED BY IN-PLANE TRANSVERSE FORCES | 1977 | 4 |
| 15 | 2024 | 4 | |
| 16 | 2022 | 4 | |
| 17 | 2023 | 2 | |
| 18 | 2023 | 1 | |
| 19 | Investigation on the bond strength between steel and concrete in SRC structures | 2008 | 1 |
| 20 | 2024 | 1 |
About Hao Pan
Hao Pan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Civil and Structural Engineering, Building and Construction and Materials Chemistry, having authored 26 papers that have together received 379 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (5 papers), Structural Behavior of Reinforced Concrete (3 papers), Aluminum Alloys Composites Properties (3 papers), Intermetallics and Advanced Alloy Properties (3 papers), Microgrid Control and Optimization (2 papers), Additive Manufacturing Materials and Processes (2 papers) and Structural Load-Bearing Analysis (2 papers). The work is most often cited by research in Automotive Engineering (78 citations), Electrical and Electronic Engineering (228 citations), Energy Engineering and Power Technology (10 citations), Control and Systems Engineering (63 citations) and Mechanical Engineering (81 citations). Hao Pan has collaborated with scholars based in China, Australia and United States. Frequent co-authors include Hongjun Ji, Mingyu Li, Zhao Yang Dong, Mingyong Lai, Fengji Luo, Jing Qiu, Hongming Yang, Youjun Deng, Jiayi Huang and Jiahui Gu. Their work appears in journals such as Journal of Alloys and Compounds, MATERIALS TRANSACTIONS, IEEE Transactions on Dielectrics and Electrical Insulation, Journal of Materials Research and Technology and Materials Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.