Frank Roscher

419 total citations
22 papers, 317 citations indexed

About

Frank Roscher is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Frank Roscher has authored 22 papers receiving a total of 317 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 4 papers in Automotive Engineering and 4 papers in Biomedical Engineering. Recurrent topics in Frank Roscher's work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (6 papers) and Nanomaterials and Printing Technologies (4 papers). Frank Roscher is often cited by papers focused on 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (6 papers) and Nanomaterials and Printing Technologies (4 papers). Frank Roscher collaborates with scholars based in Germany, India and South Korea. Frank Roscher's co-authors include Maik Wiemer, Thomas Geßner, Tobias Seifert, Enrico Sowade, Reinhard R. Baumann, Mario Baum, Yvonne Joseph, H. Mildner, Thomas Otto and Harald Kühn and has published in prestigious journals such as Industrial & Engineering Chemistry Research, Polymers and Materials Today Proceedings.

In The Last Decade

Frank Roscher

17 papers receiving 306 citations

Peers

Frank Roscher

EEE

Kurt K. Christenson United States

Mika Suhonen Finland

Min Pack United States

Dong‐Joon Won South Korea

Nitesh Kumbhat United States

Rachel R. Collino United States

Michael F. Mitchell United States

Didier Landru France

Pälvi Kopola Finland

Kurt K. Christenson United States

Frank Roscher

213 ×0.9

EEE

148 ×1.0

113 ×1.3

23 ×0.7

32 ×1.1

Citations per year, relative to Frank Roscher Frank Roscher (= 1×) peers Kurt K. Christenson

Countries citing papers authored by Frank Roscher

Since Specialization

Citations

This map shows the geographic impact of Frank Roscher's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Frank Roscher with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Frank Roscher more than expected).

Fields of papers citing papers by Frank Roscher

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Frank Roscher. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Frank Roscher. The network helps show where Frank Roscher may publish in the future.

Co-authorship network of co-authors of Frank Roscher

This figure shows the co-authorship network connecting the top 25 collaborators of Frank Roscher. A scholar is included among the top collaborators of Frank Roscher based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Frank Roscher. Frank Roscher is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Mishra, Monu, et al.. (2024). Enhanced Defect Detection Using ResNet-Based Neural Networks After Wafer Bonding. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–4. 1 indexed citations

Roscher, Frank, et al.. (2024). Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–7.

Roscher, Frank, et al.. (2023). Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates. Micromachines. 14(2). 415–415. 3 indexed citations

Meinecke, Christoph, et al.. (2023). Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 11706. 1–5.

Roscher, Frank, et al.. (2023). Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 2 indexed citations

Knechtel, Roy, Martin Seyring, Manuela Göbelt, et al.. (2023). Investigation of the Processing Behavior and Stability of Different Glass Frit Materials. ECS Transactions. 112(3). 229–246.

Roscher, Frank, et al.. (2022). Impact of Non-Accelerated Aging on the Properties of Parylene C. Polymers. 14(23). 5246–5246. 6 indexed citations

Seifert, Tobias, et al.. (2022). Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1430–1441. 1 indexed citations

Roscher, Frank, et al.. (2022). Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–4.

10.

Lee, Chun-Kwon, et al.. (2021). Flexible Multi Sensor Monitoring System for Medium Voltage Cable Joints. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 1 indexed citations

11.

Roscher, Frank, et al.. (2021). An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 10 indexed citations

12.

Kurth, Steffen, et al.. (2021). Technologies for biodegradable wireless plant monitoring sensors. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 6 indexed citations

13.

Roscher, Frank, et al.. (2021). Reactive chip level bonding based on CuO/Al reactive multilayer systems. 1–6. 1 indexed citations

14.

Wiemer, Maik, et al.. (2018). (Invited) Low-Temperature Particle- and Printing Based Wafer Level Bonding Processes. ECS Meeting Abstracts. MA2018-02(29). 972–972. 1 indexed citations

15.

Roscher, Frank, et al.. (2016). Ceramic substrate technology for wafer level packaging of MEMS. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). pv 95?7. 144–148. 1 indexed citations

16.

Wiemer, Maik, et al.. (2016). Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers. ECS Transactions. 75(9). 299–310. 1 indexed citations

17.

Schumacher, Axel, et al.. (2015). Assembly and packaging of micro systems by using reactive bonding processes. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 6 indexed citations

18.

Seifert, Tobias, Enrico Sowade, Frank Roscher, et al.. (2015). Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing. Industrial & Engineering Chemistry Research. 54(2). 769–779. 224 indexed citations

19.

Seifert, Tobias, Mario Baum, Frank Roscher, Maik Wiemer, & Thomas Geßner. (2015). Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects. Materials Today Proceedings. 2(8). 4262–4271. 45 indexed citations

20.

Mildner, H., et al.. (2014). Proceedings of the 6th International Workshop on Top-Quark Physics (TOP 2013).. DESY Publication Database (PUBDB) (Deutsches Elektronen-Synchrotron). 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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