Yiping Wu
About
In The Last Decade
Yiping Wu
75 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 76
- Management, Monitoring, Policy and Law 1.4k
- Civil and Structural Engineering 979
- Safety, Risk, Reliability and Quality 522
- Atmospheric Science 304
- Mechanics of Materials 278
Countries citing papers authored by Yiping Wu
This map shows the geographic impact of Yiping Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yiping Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yiping Wu more than expected).
Fields of papers citing papers by Yiping Wu
This network shows the impact of papers produced by Yiping Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yiping Wu. The network helps show where Yiping Wu may publish in the future.
Co-authorship network of co-authors of Yiping Wu
This figure shows the co-authorship network connecting the top 25 collaborators of Yiping Wu. A scholar is included among the top collaborators of Yiping Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yiping Wu. Yiping Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 4 | |
| 4 | 19 | |
| 5 | 4 | |
| 6 | 1 | |
| 7 | 10 | |
| 8 | 18 | |
| 9 | 20 | |
| 10 | 17 | |
| 11 | 4 | |
| 12 | 2 | |
| 13 | 8 | |
| 14 | 75 | |
| 15 | Review on Reliability of Micro-Solder Joints Subjected to Thermal Cycling | 1 |
| 16 | Reliability of RFID Inlay Flip-Chip Packaging by Anisotropic Conductive Adhesive | 1 |
| 17 | Behavior of whisker growth from the pure Sn coating under the temperature cycling condition | 0 |
| 18 | Application of BP model to landslide hazard risk prediction | 4 |
| 19 | Landslide hazard risk prediction system for the new Badong county seat based on GIS | 3 |
| 20 | APPLICATION OF MATTER-ELEMENT MODEL IN LANDSLIDE HAZARD RISK ASSESSMENT | 3 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.