Daniel Ernst
- Hardware and Architecture top 0.05%
- Parallel Computing and Optimization Techniques 12
- Embedded Systems Design Techniques 6
- Computer Networks and Communications top 0.5%
- Advanced Data Storage Technologies 4
- Interconnection Networks and Systems 4
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- Electronic Packaging and Soldering Technologies 6
- Low-power high-performance VLSI design 3
- Semiconductor Lasers and Optical Devices 3
- Software top 5%
- Signal Processing top 2%
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- Adhesion, Friction, and Surface Interactions 6
- Co-authors
- Trevor MudgeTodd AustinRichard B. BrownMatthew R. GuthausT. AustinEric D. LarsonKrisztián FlautnerNam Sung Kim
- Cited by
- Hardware and ArchitectureComputer Networks and CommunicationsElectrical and Electronic Engineering
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Journal of Intelligent & Robotic Systems (1 paper)Sensors and Actuators A Physical (1 paper)
- Partner nations
- United StatesGermanyUnited Kingdom
In The Last Decade
Daniel Ernst
30 papers receiving 5.4k citations
Hit Papers
Peers
Comparison fields: 5 of 68
- Hardware and Architecture 4.4k
- Computer Networks and Communications 2.7k
- Electrical and Electronic Engineering 2.7k
- Software 146
- Signal Processing 258
Countries citing papers authored by Daniel Ernst
This map shows the geographic impact of Daniel Ernst's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Ernst with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Ernst more than expected).
Fields of papers citing papers by Daniel Ernst
This network shows the impact of papers produced by Daniel Ernst. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Ernst. The network helps show where Daniel Ernst may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Daniel Ernst, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 2 | |
| 2 | 2019 | 7 | |
| 3 | 2019 | 3 | |
| 4 | 2018 | 10 | |
| 5 | 2018 | 1 | |
| 6 | 2016 | 1 | |
| 7 | Manufacturing of flexible (ultra-)thin magnetic field sensors | 2015 | 4 |
| 8 | 2014 | 5 | |
| 9 | 2011 | 6 | |
| 10 | 2010 | 2 | |
| 11 | 2009 | 8 | |
| 12 | 2009 | 8 | |
| 13 | 2009 | 1 | |
| 14 | 2008 | 36 | |
| 15 | 2008 | 4 | |
| 16 | Development of research platform for unmanned vehicle controller design, evaluation, and implementation system: From MATLAB to hardware based embedded system | 2007 | 2 |
| 17 | 2006 | 2 | |
| 18 | 2004 | 293 | |
| 19 | 2002 | 2 | |
| 20 | MiBench: A free, commercially representative embedded benchmark suitebreakdown → | 2001 | 2282 |
About Daniel Ernst
Daniel Ernst is a scholar working on Hardware and Architecture, Computer Networks and Communications, Bioengineering, Electrical and Electronic Engineering and Mechanics of Materials, having authored 30 papers that have together received 5.6k indexed citations. Recurring topics across this work include Parallel Computing and Optimization Techniques (12 papers), Embedded Systems Design Techniques (6 papers), Electronic Packaging and Soldering Technologies (6 papers), Adhesion, Friction, and Surface Interactions (6 papers), Advanced Data Storage Technologies (4 papers), Interconnection Networks and Systems (4 papers), Low-power high-performance VLSI design (3 papers) and Semiconductor Lasers and Optical Devices (3 papers). The work is most often cited by research in Hardware and Architecture (4.4k citations), Computer Networks and Communications (2.7k citations), Electrical and Electronic Engineering (2.7k citations), Software (146 citations) and Signal Processing (258 citations). Daniel Ernst has collaborated with scholars based in United States, Germany and United Kingdom. Frequent co-authors include Trevor Mudge, Todd Austin, Richard B. Brown, Matthew R. Guthaus, T. Austin, Eric D. Larson, Krisztián Flautner, Nam Sung Kim, David Blaauw and Shidhartha Das. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Intelligent & Robotic Systems, Sensors and Actuators A Physical, IEEE Micro and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.