Adrian Lis

515 total citations
24 papers, 426 citations indexed

About

Adrian Lis is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Civil and Structural Engineering. According to data from OpenAlex, Adrian Lis has authored 24 papers receiving a total of 426 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Mechanical Engineering, 16 papers in Electrical and Electronic Engineering and 4 papers in Civil and Structural Engineering. Recurrent topics in Adrian Lis's work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (7 papers). Adrian Lis is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (7 papers). Adrian Lis collaborates with scholars based in Japan, Switzerland and Germany. Adrian Lis's co-authors include Christian Leinenbach, Wookjin Lee, Christoph Kenel, A. Arabi-Hashemi, Min Soo Park, Akio Hirose, Raymundo Arróyave, T. Matsuda, Tomokazu Sano and Benedikt Weber and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Journal of Materials Processing Technology.

In The Last Decade

Adrian Lis

23 papers receiving 417 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Adrian Lis Japan 12 320 189 132 61 51 24 426
Jifa Mei China 15 333 1.0× 78 0.4× 166 1.3× 382 6.3× 118 2.3× 28 520
T. Beck Germany 9 268 0.8× 68 0.4× 266 2.0× 147 2.4× 41 0.8× 17 463
Zachary C. Cordero United States 8 196 0.6× 31 0.2× 108 0.8× 43 0.7× 17 0.3× 29 311
Terryl A. Wallace United States 8 222 0.7× 37 0.2× 198 1.5× 82 1.3× 13 0.3× 19 327
Jens Gunnars Sweden 8 167 0.5× 52 0.3× 215 1.6× 296 4.9× 21 0.4× 18 393
G.A. Henshall United States 13 289 0.9× 57 0.3× 228 1.7× 171 2.8× 19 0.4× 36 400
Thierry Baffie France 10 265 0.8× 70 0.4× 145 1.1× 42 0.7× 54 1.1× 19 388
Kexing Song China 11 256 0.8× 74 0.4× 191 1.4× 122 2.0× 8 0.2× 39 339
T. A. Cruse United States 9 136 0.4× 54 0.3× 259 2.0× 65 1.1× 14 0.3× 17 378

Countries citing papers authored by Adrian Lis

Since Specialization
Citations

This map shows the geographic impact of Adrian Lis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Adrian Lis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Adrian Lis more than expected).

Fields of papers citing papers by Adrian Lis

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Adrian Lis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Adrian Lis. The network helps show where Adrian Lis may publish in the future.

Co-authorship network of co-authors of Adrian Lis

This figure shows the co-authorship network connecting the top 25 collaborators of Adrian Lis. A scholar is included among the top collaborators of Adrian Lis based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Adrian Lis. Adrian Lis is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hegazy, Omar, et al.. (2023). Wide bandgap semiconductors enabling highly efficient electrified vehicles. Transportation research procedia. 72. 17–23.
2.
3.
Ibarra, Edorta, et al.. (2020). Novel Thermal Management Strategy for Improved Inverter Reliability in Electric Vehicles. Applied Sciences. 10(22). 8024–8024. 1 indexed citations
4.
Moeller, Sebastian, et al.. (2020). Application considerations for Double Sided Cooled Modules in Automotive Environment. 1–7. 5 indexed citations
5.
Tatsumi, Hiroaki, et al.. (2019). Evaluation of Stiffness-Reduced Joints by Transient Liquid-Phase Sintering of Copper-Solder-Resin Composite for SiC Die-Attach Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(10). 2111–2121. 11 indexed citations
6.
Lis, Adrian, et al.. (2018). Bonding through novel solder-metallic mesh composite design. Materials & Design. 160. 475–485. 5 indexed citations
7.
8.
Lis, Adrian, et al.. (2018). Hardening and softening effects in aluminium alloys during high-frequency linear friction welding. Journal of Materials Processing Technology. 255. 547–558. 28 indexed citations
9.
Kenel, Christoph, Adrian Lis, Karl Dawson, et al.. (2017). Mechanical performance and oxidation resistance of an ODS γ-TiAl alloy processed by spark plasma sintering and laser additive manufacturing. Intermetallics. 91. 169–180. 41 indexed citations
10.
Leinenbach, Christian, A. Arabi-Hashemi, Wookjin Lee, et al.. (2017). Characterization of the deformation and phase transformation behavior of VC-free and VC-containing FeMnSi-based shape memory alloys by in situ neutron diffraction. Materials Science and Engineering A. 703. 314–323. 44 indexed citations
11.
Lis, Adrian, et al.. (2017). Finite Element-Assisted Assessment of the Thermo-cyclic Characteristics of Leads Soldered with SnAgCu(+Bi,In) Alloys. Journal of Electronic Materials. 46(7). 4326–4343. 5 indexed citations
12.
Lis, Adrian, et al.. (2017). Structural Understanding of Direct-Sintered Al2O3-to-Cu Joints Through Damage Modeling. Journal of Electronic Materials. 46(11). 6488–6501. 1 indexed citations
13.
Lis, Adrian, et al.. (2016). Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods. Journal of Electronic Materials. 46(2). 729–741. 18 indexed citations
14.
Lis, Adrian, Christoph Kenel, & Christian Leinenbach. (2016). Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems. Metallurgical and Materials Transactions A. 47(6). 2596–2608. 18 indexed citations
15.
Lis, Adrian, et al.. (2015). Influence of elastic–plastic base material properties on the fatigue and cyclic deformation behavior of brazed steel joints. International Journal of Fatigue. 82. 49–59. 18 indexed citations
16.
Lis, Adrian & Christian Leinenbach. (2015). Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations. Journal of Electronic Materials. 44(11). 4576–4588. 53 indexed citations
17.
Lis, Adrian, Min Soo Park, Raymundo Arróyave, & Christian Leinenbach. (2014). Early stage growth characteristics of Ag 3 Sn intermetallic compounds during solid–solid and solid–liquid reactions in the Ag–Sn interlayer system: Experiments and simulations. Journal of Alloys and Compounds. 617. 763–773. 52 indexed citations
18.
Kenel, Christoph, et al.. (2013). Fatigue and cyclic deformation behavior of brazed steel joints. Materials Science and Engineering A. 581. 90–97. 20 indexed citations
19.
Leinenbach, Christian, et al.. (2012). Defect assessment of brazed steel components. Welding Journal. 91(7). 42. 4 indexed citations
20.
Lis, Adrian, et al.. (2012). Numerical and Experimental Investigations on the Defect Tolerance of Brazed Steel Joints. Materials Testing. 54(9). 605–611. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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