B. Williams

1.3k citations

25 papers · 1.0k indexed · 1 hit paper · h-index 12

Impact in

Mechanics of Materials top 2%
- Metal and Thin Film Mechanics
Materials Chemistry top 5%
- Diamond and Carbon-based Materials Research

Papers in

Electrical and Electronic Engineering 16
- Semiconductor materials and devices 8
- Integrated Circuits and Semiconductor Failure Analysis 7
- Electronic Packaging and Soldering Technologies 5
Mechanics of Materials 6
- Metal and Thin Film Mechanics 6

Co-authors: Jeffrey T. Glass T. Tachibana Hoyoul Kong Brian R. Stoner R. F. Davis K. M. McNamara Karen K. Gleason Wei Zhu
Journals: Journal of materials research/Pratt's guide to venture capital sources (3 papers)Physical review. B, Condensed matter (2 papers)IEEE Transactions on Semiconductor Manufacturing (2 papers)Journal of Crystal Growth (1 paper)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1 paper)
Partner nations: United States Japan Taiwan

In The Last Decade

B. Williams

22 papers receiving 988 citations

Hit Papers

align trajectories log scale

Critical evaluation of the status of the areas for future research regarding the wide band gap semiconductors diamond, gallium nitride and silicon carbide 1988 · 189 citations

Peers

Countries citing papers authored by B. Williams

Since Specialization

Citations

This map shows the geographic impact of B. Williams's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Williams with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Williams more than expected).

Fields of papers citing papers by B. Williams

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B. Williams. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Williams. The network helps show where B. Williams may publish in the future.

Co-authorship network

The 25 scholars most cited alongside B. Williams, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with B. Williams Line = papers co-authored together B. Williams links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Source Pad Design Tradeoffs for a Power TrenchFET IEEE Transactions on Semiconductor Manufacturing ·B. Williams, 人見実和, A Meryem, Eslam Abouselima, Margaux Bazire, B. Dinakar	2022	1
2	Analysis and Design Considerations of Low-voltage Trench MOSFET for Inductive Load Switching Applications M Manganaro, Quandong Liang, Takeshi Moritom, Minqiang Liu, P. P., 真粧美朝倉, G. Lara, Jason Wallace, Kasumba Kallon, Efstathia Davouti, Margaux Bazire, M. Thomason, B. Williams	2020	2
3	The genomics of invasion: characterization of red lionfish (Pterois volitans) populations from the native and introduced ranges Biological Invasions ·Martha O. Burford Reiskind, 昴渡辺, Matteo Lacchetti, Narvir S. Chauhan, 江东浦, Rostock, Baekdong Cha, Reade B. Roberts, N. Erench, Zheng Geling, Julia L. Stevens, B. Williams	2019	12
4	Transient Leakages of Gate Oxide Due to Charge Traps and Phosphorus Contaminants Induced During Gate Oxidation Processing IEEE Transactions on Semiconductor Manufacturing ·Tsunemi Akiko, B. Williams, ASTA TVARIJONAVICIUTE, Bruno Paixão	2017	0
5	Transient leakage of point-defects in gate oxide due to spatially transported constant-source of phosphorus contaminants Tsunemi Akiko, B. Williams, ASTA TVARIJONAVICIUTE, Bruno Paixão	2016	1
6	RDL manufacturing for flip chip packaging B. Williams, Handel-crises, Daniel Danninger, Krishna Chaitanya Gunturu, Mark Nelson, Tianrun Zhu	2005	4
7	Novel method of separating probe and wire bond regions without increasing die size 五月山田, Randy R Nielsen, Mandy Deans-Kassies, B. Williams, M Lydin	2004	7
8	Optimizing pattern fill for planarity and parasitic capacitance Matthew D. Nelson, B. Williams, Tianrun Zhu, Elisa Carareto Alves, Paul V. Azzopardi, Jiwen Liu, Scott H. Donaldson, Jagdish Prasad	2004	2
9	Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads Clarence Williams, 大島秀男, B. Williams, C.J. Bleeker, Oliwia Gruszka	2002	31
10	Mechanical and electrical evaluation of a bumped-substrate die-level burn-in carrier IEEE Transactions on Components Packaging and Manufacturing Technology Part B ·Patrick Thompson, 雄康齋藤, Quir oacute s Pelayo, T. Hoashi, Brian A. Vasquez, S Walker, B. Williams	1995	2
11	Correlation of the electrical properties of metal contacts on diamond films with the chemical nature of the metal-diamond interface. I. Gold contacts: A non-carbide-forming metal Physical review. B, Condensed matter ·T. Tachibana, B. Williams, Jeffrey T. Glass	1992	58
12	In situ growth rate measurement and nucleation enhancement for microwave plasma CVD of diamond Journal of materials research/Pratt's guide to venture capital sources ·Brian R. Stoner, B. Williams, Scott D. Wolter, Kazuhito Nishimura, Jeffrey T. Glass	1992	71
13	Analysis via transmission electron microscopy of the quality of diamond films deposited from the vapor phase Diamond and Related Materials ·Wini Afrilia, B. Williams, Jeffrey T. Glass, J. T. Prater	1991	22
14	Growth and characterization of diamond films on nondiamond substrates for electronic applications Proceedings of the IEEE ·Wei Zhu, Brian R. Stoner, B. Williams, Jeffrey T. Glass	1991	78
15	Electron microscopy of vapor phase deposited diamond Journal of materials research/Pratt's guide to venture capital sources ·B. Williams, Hoyoul Kong, Jeffrey T. Glass	1990	54
16	The analysis of defect structures and substrate/film interfaces of diamond thin films Journal of Crystal Growth ·B. Williams, Jeffrey T. Glass, R. F. Davis, Koji Kobashi	1990	31
17	Characterization of diamond thin films: Diamond phase identification, surface morphology, and defect structures Journal of materials research/Pratt's guide to venture capital sources ·B. Williams, Jeffrey T. Glass	1989	215
18	Critical evaluation of the status of the areas for future research regarding the wide band gap semiconductors diamond, gallium nitride and silicon carbide Materials Science and Engineering B ·R. F. Davis, Zlatko Sitar, B. Williams, Hoyoul Kong, M.T. Dova, John W. Palmour, J. A. Edmond, J. Ryu, Jeffrey T. Glass, Fca. Martı́nez-Garcı́a Hit paper breakdown →	1988	189
19	Chemical Vapor Deposition And Characterization Of Diamond Films Grown Via Microwave Plasma Enhanced CVD Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Jeffrey T. Glass, B. Williams, R. F. Davis	1988	9
20	Summary Abstract: Structural and chemical characterization of diamond films and diamond–substrate interfaces Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ·B. Williams, Jeffrey T. Glass, R. F. Davis, Kazufumi Kobashi, Takahiro Horiuchi	1988	3

About B. Williams

B. Williams is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Materials Chemistry, Geophysics and Electronic, Optical and Magnetic Materials, having authored 25 papers that have together received 1.0k indexed citations. Recurring topics across this work include Diamond and Carbon-based Materials Research (11 papers), Semiconductor materials and devices (8 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Metal and Thin Film Mechanics (6 papers), Electronic Packaging and Soldering Technologies (5 papers), Electronic and Structural Properties of Oxides (5 papers), Copper Interconnects and Reliability (4 papers) and Advanced Surface Polishing Techniques (4 papers). The work is most often cited by research in Mechanics of Materials (482 citations), Materials Chemistry (835 citations), Geophysics (153 citations), Electrical and Electronic Engineering (469 citations) and Condensed Matter Physics (75 citations). B. Williams has collaborated with scholars based in United States, Japan and Taiwan. Frequent co-authors include Jeffrey T. Glass, T. Tachibana, Hoyoul Kong, Brian R. Stoner, R. F. Davis, K. M. McNamara, Karen K. Gleason, Wei Zhu, John W. Palmour and J. Ryu. Their work appears in journals such as Journal of materials research/Pratt's guide to venture capital sources, Physical review. B, Condensed matter, IEEE Transactions on Semiconductor Manufacturing, Journal of Crystal Growth and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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