Andrew E Hollowell

517 total citations
24 papers, 420 citations indexed

About

Andrew E Hollowell is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Biomedical Engineering. According to data from OpenAlex, Andrew E Hollowell has authored 24 papers receiving a total of 420 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 13 papers in Atomic and Molecular Physics, and Optics and 8 papers in Biomedical Engineering. Recurrent topics in Andrew E Hollowell's work include Electrodeposition and Electroless Coatings (8 papers), Semiconductor materials and interfaces (6 papers) and Electronic Packaging and Soldering Technologies (5 papers). Andrew E Hollowell is often cited by papers focused on Electrodeposition and Electroless Coatings (8 papers), Semiconductor materials and interfaces (6 papers) and Electronic Packaging and Soldering Technologies (5 papers). Andrew E Hollowell collaborates with scholars based in United States and Canada. Andrew E Hollowell's co-authors include L. Jay Guo, Yi-Kuei Wu, Cheng Zhang, Matthew G. Blain, Thomas P. Moffat, D. Josell, Ehren Baca, Patrick Sean Finnegan, J. Domínguez and S. L. Burkett and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Scientific Reports.

In The Last Decade

Andrew E Hollowell

23 papers receiving 400 citations

Peers

Countries citing papers authored by Andrew E Hollowell

Since Specialization

Citations

This map shows the geographic impact of Andrew E Hollowell's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andrew E Hollowell with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andrew E Hollowell more than expected).

Fields of papers citing papers by Andrew E Hollowell

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Andrew E Hollowell. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andrew E Hollowell. The network helps show where Andrew E Hollowell may publish in the future.

Co-authorship network of co-authors of Andrew E Hollowell

This figure shows the co-authorship network connecting the top 25 collaborators of Andrew E Hollowell. A scholar is included among the top collaborators of Andrew E Hollowell based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Andrew E Hollowell. Andrew E Hollowell is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating 2020 ·ECS Meeting Abstracts ·(unknown), (unknown), (unknown), Jason Christopher, Ehren Baca, (unknown), Nathan Jackson, Andrew E Hollowell	0
2	Tutorial on forming through-silicon vias 2020 ·Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ·S. L. Burkett, (unknown), (unknown), (unknown), Andrew E Hollowell	27
3	Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies 2020 ·MRS Advances ·(unknown), Andrew E Hollowell, G. Bahar Basim	2
4	Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings 2019 ·Journal of The Electrochemical Society ·D. Josell, (unknown), Maureen Williams, Andrew E Hollowell, (unknown), Shin Muramoto, Thomas P. Moffat	16
5	Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias 2019 ·Journal of The Electrochemical Society ·D. Josell, (unknown), Andrew E Hollowell, Matthew G. Blain, Thomas P. Moffat	23
6	High aspect ratio anisotropic silicon etching for x-ray phase contrast imaging grating fabrication 2018 ·Materials Science in Semiconductor Processing ·Patrick Sean Finnegan, Andrew E Hollowell, (unknown), (unknown)	20
7	Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs 2018 ·Journal of The Electrochemical Society ·(unknown), Ehren Baca, Matthew G. Blain, (unknown), J. Domínguez, (unknown), Andrew E Hollowell	19
8	Frequency Noise of Silicon Nitride Optomechanical Oscillators with Integrated Waveguides 2018 ·OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·(unknown), Darwin K. Serkland, Michael G. Wood, (unknown), Andrew E Hollowell, (unknown), C.P. Hains, Aleem Siddiqui, Matt Eichenfield, Daryl Dagel, (unknown), (unknown)	1
9	Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology 2018 ·Journal of The Electrochemical Society ·(unknown), D. Josell, Thomas P. Moffat, Ehren Baca, Matthew G. Blain, (unknown), J. Domínguez, (unknown), (unknown), Andrew E Hollowell	26
10	Copper Electrodeposition in Blind Mesoscale through-Silicon-Vias 2018 ·ECS Meeting Abstracts ·(unknown), Ehren Baca, Andrew E Hollowell	1
11	ALD Platinum Substrate Preparation and Electrodeposition of Copper into Extremely Deep through-Silicon-Vias 2016 ·ECS Meeting Abstracts ·(unknown), (unknown), (unknown), Matthew G. Blain, Jason Dominguez, Ronald S. Goeke, Edwin J. Heller, Andrew E Hollowell, Robert Jarecki, (unknown), (unknown), (unknown), Paul Resnick, (unknown)	1
12	Characterization of a High-Optical-Access surface trap optimized for quantum information processing. 2015 ·OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·Peter Maunz, (unknown), (unknown), Andrew E Hollowell, (unknown), Paul Resnick, Jonathan David Sterk, Daniel Stick, (unknown), Matthew G. Blain	1
13	Extensively Long High Aspect Ratio Gold Analyzer Gratings. 2015 ·OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·Andrew E Hollowell, (unknown), (unknown), Patrick Sean Finnegan, (unknown), (unknown)	2
14	Wafer-level packaging of aluminum nitride RF MEMS filters 2015 ·Zenodo (CERN European Organization for Nuclear Research) ·Michael David Henry, (unknown), Andrew E Hollowell, Matt Eichenfield, Roy H. Olsson	2
15	Angle-Insensitive Structural Colours based on Metallic Nanocavities and Coloured Pixels beyond the Diffraction Limit 2013 ·Scientific Reports ·Yi-Kuei Wu, Andrew E Hollowell, Cheng Zhang, L. Jay Guo	203
16	Nanowire Grid Polarizers Integrated into Flexible, Gas Permeable, Biocompatible Materials and Contact Lenses 2013 ·Advanced Optical Materials ·Andrew E Hollowell, L. Jay Guo	16
17	Angle-Insensitive Structural Colours based on metallic nanocavities and Coloured Pixels beyond the Diffraction Limit. 2012 ·OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·Andrew E Hollowell, (unknown), Cheng Zhang, Lijun Guo	1
18	Intrinsic localized modes in two-dimensional vibrations of crystalline pillars and their application for sensing 2012 ·Journal of Applied Physics ·(unknown), (unknown), Andrew E Hollowell, Ganesh Balakrishnan, (unknown), Mario C. Marconi, Vakhtang Putkaradze	7
19	Flexible solar cells for micro-autonomous systems technology 2010 ·Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·L. F. Lester, Kai Yang, Mohamed A. El-Emawy, (unknown), (unknown), Andrew E Hollowell, Olga Lavrova	1
20	Optimizing galvanic pulse plating parameters to improve indium bump to bump bonding 2010 ·Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·(unknown), (unknown), (unknown), W. Graham Yelton, (unknown), (unknown), Andrew E Hollowell, (unknown), Adrian M. Ionescu	4

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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