D. Josell

6.2k total citations
160 papers, 5.1k citations indexed

About

D. Josell is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, D. Josell has authored 160 papers receiving a total of 5.1k indexed citations (citations by other indexed papers that have themselves been cited), including 99 papers in Electrical and Electronic Engineering, 57 papers in Materials Chemistry and 42 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in D. Josell's work include Electrodeposition and Electroless Coatings (71 papers), Copper Interconnects and Reliability (36 papers) and Semiconductor materials and interfaces (27 papers). D. Josell is often cited by papers focused on Electrodeposition and Electroless Coatings (71 papers), Copper Interconnects and Reliability (36 papers) and Semiconductor materials and interfaces (27 papers). D. Josell collaborates with scholars based in United States, Egypt and Switzerland. D. Josell's co-authors include Thomas P. Moffat, Daniel Wheeler, William Huber, T. P. Moffat, John E. Bonevich, S.-K. Kim, T. P. Moffat, F. Spaepen, Monica D. Edelstein and D. Van Heerden and has published in prestigious journals such as Physical Review Letters, Journal of Geophysical Research Atmospheres and Accounts of Chemical Research.

In The Last Decade

D. Josell

153 papers receiving 4.9k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
D. Josell United States 40 3.8k 2.2k 1.5k 1.0k 794 160 5.1k
Dawn A. Bonnell United States 45 2.5k 0.6× 4.1k 1.9× 1.2k 0.8× 2.3k 2.3× 249 0.3× 175 6.5k
Richard Beanland United Kingdom 37 2.5k 0.7× 2.5k 1.1× 652 0.4× 1.6k 1.6× 148 0.2× 199 5.0k
Bai Cui United States 32 1.0k 0.3× 2.3k 1.0× 1.1k 0.7× 505 0.5× 158 0.2× 143 4.8k
Ping Lu United States 41 2.4k 0.6× 4.3k 2.0× 1.8k 1.2× 695 0.7× 67 0.1× 249 6.6k
Hyungjun Kim South Korea 41 4.2k 1.1× 5.0k 2.3× 743 0.5× 393 0.4× 100 0.1× 194 6.5k
Jim P. Zheng United States 47 7.3k 1.9× 1.7k 0.8× 4.9k 3.3× 326 0.3× 137 0.2× 221 9.1k
Jong‐Lam Lee South Korea 44 4.9k 1.3× 3.2k 1.5× 1.6k 1.1× 1.4k 1.4× 68 0.1× 333 8.1k
Stephen A. Campbell United States 36 3.6k 0.9× 3.0k 1.4× 336 0.2× 456 0.5× 181 0.2× 171 4.9k
E. A. Irene United States 41 4.6k 1.2× 2.7k 1.2× 540 0.4× 1.3k 1.3× 179 0.2× 215 5.8k
Ming Yang Singapore 44 3.2k 0.8× 5.1k 2.3× 1.2k 0.8× 1.2k 1.2× 131 0.2× 226 7.2k

Countries citing papers authored by D. Josell

Since Specialization
Citations

This map shows the geographic impact of D. Josell's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Josell with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Josell more than expected).

Fields of papers citing papers by D. Josell

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Josell. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Josell. The network helps show where D. Josell may publish in the future.

Co-authorship network of co-authors of D. Josell

This figure shows the co-authorship network connecting the top 25 collaborators of D. Josell. A scholar is included among the top collaborators of D. Josell based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Josell. D. Josell is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Shi, Zhitian, Konstantins Jefimovs, Joan Vila‐Comamala, et al.. (2025). Deep-reactive-ion-etching in X-ray grating fabrication: a review. Materials Science in Semiconductor Processing. 201. 110041–110041.
2.
Buchanan, Ian, Alberto Astolfo, Martyna Michalska, et al.. (2025). Fabrication of Ultra‐Thick Masks for X‐Ray Phase Contrast Imaging at Higher Energy. Advanced Materials Interfaces. 12(8). 2 indexed citations
3.
Shi, Zhitian, Lucia Romano, M. Rawlik, et al.. (2025). Quantifying grating defects in X-ray Talbot-Lau interferometry through a comparative study of two fabrication techniques. Scientific Reports. 15(1). 14223–14223. 1 indexed citations
4.
Coakley, Kevin J., Huaiyu H. Chen‐Mayer, Bruce Ravel, et al.. (2024). Emission ghost imaging: Reconstruction with data augmentation. Physical review. A. 109(2). 1 indexed citations
5.
Shi, Zhitian, D. Josell, Konstantins Jefimovs, et al.. (2022). Fabrication of a fractal pattern device for focus characterizations ofX-ray imaging systems by Si deep reactive ion etching and bottom-up Auelectroplating. Applied Optics. 61(13). 3850–3850. 10 indexed citations
6.
Josell, D., William Osborn, Maureen Williams, & Houxun Miao. (2022). Robust Bottom-Up Gold Filling of Deep Trenches and Gratings. Journal of The Electrochemical Society. 169(3). 32509–32509. 10 indexed citations
7.
Josell, D., Trevor Michael Braun, & Thomas P. Moffat. (2022). Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling. Journal of The Electrochemical Society. 169(12). 122507–122507. 8 indexed citations
8.
Josell, D., Zhitian Shi, Konstantins Jefimovs, et al.. (2021). Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-ray Interferometry. Journal of The Electrochemical Society. 168(8). 82508–82508. 12 indexed citations
9.
Braun, Trevor Michael, et al.. (2021). Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias. Journal of The Electrochemical Society. 168(11). 112501–112501. 6 indexed citations
10.
Josell, D. & Thomas P. Moffat. (2021). Additives for Superconformal Gold Feature Filling. Journal of The Electrochemical Society. 168(5). 52502–52502. 2 indexed citations
11.
Josell, D., Zhitian Shi, Konstantins Jefimovs, et al.. (2020). Pushing the Limits of Bottom-Up Gold Filling for X-ray Grating Interferometry. Journal of The Electrochemical Society. 167(13). 132504–132504. 24 indexed citations
12.
Kim, Sang‐Hyeok, et al.. (2020). Bottom-up Cu filling of annular through silicon vias: Microstructure and texture. Electrochimica Acta. 335. 135612–135612. 21 indexed citations
13.
Josell, D. & Thomas P. Moffat. (2017). Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias. Journal of The Electrochemical Society. 164(6). D327–D334. 31 indexed citations
14.
Josell, D. & Thomas P. Moffat. (2016). Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias. Journal of The Electrochemical Society. 163(7). D322–D331. 47 indexed citations
15.
Josell, D., Manoj Silva, & Thomas P. Moffat. (2016). Superconformal Bottom-up Cobalt Deposition in High Aspect Ratio through Silicon Vias. ECS Transactions. 75(2). 25–30. 5 indexed citations
16.
Josell, D., Christian Witt, & Thomas P. Moffat. (2006). Copper Electrodeposition on Osmium: A Potential Barrier for Damascene Processing. ECS Transactions. 1(11). 69–75. 1 indexed citations
17.
Josell, D., et al.. (2003). Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor. Journal of The Electrochemical Society. 150(5). 1 indexed citations
18.
Josell, D., Thomas P. Moffat, & Daniel Wheeler. (2002). Numerical Simulation of Superconformal Electrodeposition Using the Level Set Method. TechConnect Briefs. 2(2002). 348–351. 3 indexed citations
19.
Josell, D. & F. Spaepen. (1999). Surfaces, Interfaces, and Changing Shapes in Multilayered Films. MRS Bulletin. 24(2). 39–43. 39 indexed citations
20.
Wang, Zhong Lin, D. Van Heerden, D. Josell, & A. J. Shapiro. (1997). Energy-filtered high-resolution electron microscopy for quantitative solid state structure determination. Journal of Research of the National Institute of Standards and Technology. 102(1). 1–1. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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