Immediate Impact
3 standout
Citing Papers
Roadmapping the next generation of silicon photonics
2024 Standout
Monolithic three-dimensional integration of complementary two-dimensional field-effect transistors
2024 Standout
Works of V. Balan being referenced
A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors
2020
1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy
2017
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| V. Balan | 50 | 9 | 15 | 26 | 10 | 65 | |
| Bongsub Lee | 69 | 17 | 26 | 63 | 7 | 91 | |
| Douglas Yu | 100 | 10 | 20 | 11 | 8 | 115 | |
| R.N. Master | 94 | 5 | 15 | 17 | 11 | 120 | |
| J.J. Schoeman | 85 | 17 | 32 | 47 | 14 | 109 | |
| E. Deloffre | 66 | 18 | 7 | 11 | 12 | 69 | |
| Chau‐Jie Zhan | 85 | 6 | 18 | 16 | 14 | 103 | |
| Ming-Ji Dai | 84 | 7 | 18 | 65 | 12 | 143 | |
| Jie Sun | 31 | 8 | 8 | 16 | 12 | 71 | |
| Isabelle Savin de Larclause | 37 | 10 | 9 | 17 | 9 | 61 | |
| D. Bouchu | 84 | 43 | 16 | 20 | 14 | 100 |
All Works
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