Immediate Impact
35 standout
Citing Papers
Adhesively bonded joints – A review on design, manufacturing, experiments, modeling and challenges
2024 Standout
Hexagonal boron nitride nanosheets: Preparation, heat transport property and application as thermally conductive fillers
2023 Standout
Works of T.H. Low being referenced
Low cycle fatigue models for lead-free solders
2004
Thermal cycling analysis of flip-chip solder joint reliability
2001
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| T.H. Low | 288 | 183 | 62 | 4 | 305 | |
| A.C.K. So | 254 | 197 | 45 | 6 | 270 | |
| I. Lum | 163 | 235 | 36 | 10 | 311 | |
| T. Shoji | 214 | 257 | 33 | 7 | 322 | |
| H. Y. Chuang | 229 | 170 | 19 | 9 | 299 | |
| Guanghao Gong | 84 | 229 | 42 | 7 | 318 | |
| L. Zavalij | 338 | 247 | 97 | 9 | 363 | |
| Zijian Tang | 94 | 240 | 160 | 9 | 346 | |
| J. W. Jang | 339 | 260 | 68 | 6 | 350 | |
| Hua Ye | 263 | 81 | 17 | 6 | 352 | |
| King-Ning Tu | 232 | 113 | 30 | 4 | 257 |
All Works
Loading papers...