Immediate Impact
3 from Science/Nature 12 standout
Citing Papers
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
2022 Standout
Vitrimers: Current research trends and their emerging applications
2021 Standout
Works of R.N. Master being referenced
Void Formation Study of Flip Chip in Package Using No-Flow Underfill
2008
Author Peers
| Author | Last Decade | Papers | Cites | |||||
|---|---|---|---|---|---|---|---|---|
| R.N. Master | 94 | 13 | 15 | 18 | 17 | 11 | 120 | |
| Douglas Yu | 100 | 8 | 20 | 10 | 11 | 8 | 115 | |
| Kuo‐Shu Kao | 118 | 33 | 22 | 9 | 17 | 16 | 134 | |
| Wei-Lan Chiu | 92 | 27 | 21 | 18 | 21 | 18 | 119 | |
| P. Türkes | 157 | 25 | 16 | 18 | 88 | 12 | 207 | |
| Josef Weber | 193 | 26 | 40 | 7 | 14 | 17 | 217 | |
| E. Auerswald | 71 | 42 | 24 | 18 | 26 | 21 | 100 | |
| J. Mitchell | 151 | 15 | 88 | 30 | 29 | 10 | 193 | |
| Hideki Shumiya | 92 | 10 | 45 | 20 | 74 | 11 | 148 | |
| Chau‐Jie Zhan | 85 | 24 | 18 | 6 | 16 | 14 | 103 | |
| Scott Leslie | 110 | 21 | 5 | 10 | 11 | 16 | 138 |
All Works
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