Immediate Impact
6 standout
Citing Papers
Flexible Nanocomposite Conductors for Electromagnetic Interference Shielding
2023 Standout
Deep reinforcement learning in smart manufacturing: A review and prospects
2022 Standout
Works of Min-Suk Suh being referenced
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
2011
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
2011
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Min-Suk Suh | 456 | 64 | 52 | 15 | 476 | |
| Kwang-Yoo Byun | 436 | 60 | 25 | 7 | 458 | |
| C.W. Surovic | 517 | 43 | 28 | 20 | 559 | |
| D.L. Blackburn | 390 | 69 | 76 | 20 | 461 | |
| Sri M. Sri-Jayantha | 351 | 51 | 56 | 8 | 413 | |
| B. Dang | 513 | 72 | 64 | 12 | 566 | |
| L. Baud | 294 | 134 | 116 | 20 | 418 | |
| S.C. O’Mathuna | 363 | 70 | 109 | 29 | 445 | |
| H.M. Greenhouse | 512 | 28 | 54 | 9 | 573 | |
| Jiawen Chen | 364 | 24 | 48 | 20 | 443 | |
| Edward Chan | 378 | 216 | 25 | 16 | 451 |
All Works
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