Immediate Impact
6 standout
Citing Papers
Recent Advances and Trends in Advanced Packaging
2022 Standout
Review of Hydrogen Embrittlement in Metals: Hydrogen Diffusion, Hydrogen Characterization, Hydrogen Embrittlement Mechanism and Prevention
2020 Standout
Works of Kuan-Hsun Lu being referenced
Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints
2006
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
2006
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| Kuan-Hsun Lu | 305 | 56 | 60 | 59 | 4 | 309 | |
| Jang‐Hi Im | 281 | 74 | 21 | 47 | 11 | 305 | |
| H. Gan | 317 | 21 | 90 | 132 | 7 | 335 | |
| Suk-Kyu Ryu | 293 | 87 | 21 | 35 | 6 | 314 | |
| Jiaxiu Han | 272 | 29 | 39 | 42 | 9 | 354 | |
| Changyoul Moon | 165 | 118 | 99 | 29 | 7 | 309 | |
| David Loder | 188 | 203 | 29 | 49 | 3 | 341 | |
| Steve Sprague | 100 | 14 | 157 | 147 | 4 | 264 | |
| I. Suni | 209 | 68 | 30 | 57 | 8 | 279 | |
| M. J. Interrante | 233 | 45 | 14 | 31 | 2 | 252 | |
| Kazuya Okada | 183 | 59 | 15 | 83 | 9 | 277 |
All Works
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