Journal of Microelectronics and Electronic Packaging

About

The 379 papers published in Journal of Microelectronics and Electronic Packaging in the last decades have received a total of 1.7k indexed citations. Papers published in Journal of Microelectronics and Electronic Packaging usually cover Electrical and Electronic Engineering (320 papers), Mechanical Engineering (76 papers) and Materials Chemistry (65 papers) specifically the topics of Electronic Packaging and Soldering Technologies (165 papers), 3D IC and TSV technologies (132 papers) and Electrical and Thermal Properties of Materials (56 papers). The most active scholars publishing in Journal of Microelectronics and Electronic Packaging are John H. Lau, Jianbiao Pan, Peter Rodgers, Liang-Yü Chen, F. Patrick McCluskey, Juan C. Nino, Mira Naftaly, Khalid Z. Rajab, Michael T. Lanagan and R. Mittra.

In The Last Decade

Journal of Microelectronics and Electronic Packaging

334 papers receiving 1.6k citations

Peers

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Engineering Science and Education Journal United Kingdom View profile →

Citations per field, relative to Journal of Microelectronics and Electronic Packaging

Journal of Microelectronics and Electronic Packaging · 1×

×0.7 935

EEE

×1.0 392

BE

×0.8 239

MC

×1.7 516

ME

×0.7 84

AE

Citations per year, relative to Journal of Microelectronics and Electronic Packaging

Journal of Microelectronics and Electronic Packaging · 1×

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Countries where authors publish in Journal of Microelectronics and Electronic Packaging

Since Specialization

Citations

This map shows the geographic impact of research published in Journal of Microelectronics and Electronic Packaging. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in Journal of Microelectronics and Electronic Packaging with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Journal of Microelectronics and Electronic Packaging more than expected).

Fields of papers published in Journal of Microelectronics and Electronic Packaging

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in Journal of Microelectronics and Electronic Packaging. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in Journal of Microelectronics and Electronic Packaging.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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