IEEE Transactions on Components and Packaging Technologies

1.2k papers and 24.1k indexed citations i.

About

The 1.2k papers published in IEEE Transactions on Components and Packaging Technologies in the last decades have received a total of 24.1k indexed citations. Papers published in IEEE Transactions on Components and Packaging Technologies usually cover Electrical and Electronic Engineering (775 papers), Mechanical Engineering (515 papers) and Mechanics of Materials (241 papers) specifically the topics of Electronic Packaging and Soldering Technologies (471 papers), 3D IC and TSV technologies (288 papers) and Heat Transfer and Optimization (199 papers). The most active scholars publishing in IEEE Transactions on Components and Packaging Technologies are Issam Mudawar, Michael Pecht, M. M. Yovanovich, Roger A. Dougal, C.P. Wong, R. S. Timsit, Suresh V. Garimella, J. R. Culham, Avram Bar‐Cohen and Shengyi Liu.

In The Last Decade

Fields of papers published in IEEE Transactions on Components and Packaging Technologies

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in IEEE Transactions on Components and Packaging Technologies. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Components and Packaging Technologies.

Countries where authors publish in IEEE Transactions on Components and Packaging Technologies

Since Specialization
Citations

This map shows the geographic impact of research published in IEEE Transactions on Components and Packaging Technologies. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Components and Packaging Technologies with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Components and Packaging Technologies more than expected).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar’s output or impact.

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