Masumi SAKA

1.9k total citations
160 papers, 1.4k citations indexed

About

Masumi SAKA is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Masumi SAKA has authored 160 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 79 papers in Electrical and Electronic Engineering, 67 papers in Mechanics of Materials and 56 papers in Mechanical Engineering. Recurrent topics in Masumi SAKA's work include Copper Interconnects and Reliability (39 papers), Electronic Packaging and Soldering Technologies (39 papers) and Ultrasonics and Acoustic Wave Propagation (33 papers). Masumi SAKA is often cited by papers focused on Copper Interconnects and Reliability (39 papers), Electronic Packaging and Soldering Technologies (39 papers) and Ultrasonics and Acoustic Wave Propagation (33 papers). Masumi SAKA collaborates with scholars based in Japan, China and Bangladesh. Masumi SAKA's co-authors include Yuxin Sun, Hironori Tohmyoh, Hiroyuki Abé, Hitoshi SOYAMA, Kazuhiko SASAGAWA, Yang Ju, Ai Kah Soh, Daining Fang, Kenichi Saitô and Hiroyuki Hayashi and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of the American Ceramic Society.

In The Last Decade

Masumi SAKA

152 papers receiving 1.3k citations

Peers

Masumi SAKA
Comparison fields: 5 of 65
  • Mechanics of Materials 649
  • Electrical and Electronic Engineering 596
  • Materials Chemistry 510
  • Mechanical Engineering 351
  • Electronic, Optical and Magnetic Materials 267
Replace M. Saka with:
M. Saka Japan
Masahiko Yoshino Japan
Jorge Alcalá Spain
Ken Mingard United Kingdom
B.K. Yen United States
Amitava Ghosh India
M. D. Drory United States
Qing Ma United States
Μ. Horstmann Germany
P. Sudharshan Phani India
M. Saka Japan View profile →
Citations per field, relative to Masumi SAKA
Masumi SAKA · 1×
Citations per year, relative to Masumi SAKA
Masumi SAKA · 1×

Countries citing papers authored by Masumi SAKA

Since Specialization
Citations

This map shows the geographic impact of Masumi SAKA's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Masumi SAKA with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Masumi SAKA more than expected).

Fields of papers citing papers by Masumi SAKA

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Masumi SAKA. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Masumi SAKA. The network helps show where Masumi SAKA may publish in the future.

Co-authorship network of co-authors of Masumi SAKA

This figure shows the co-authorship network connecting the top 25 collaborators of Masumi SAKA. A scholar is included among the top collaborators of Masumi SAKA based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Masumi SAKA. Masumi SAKA is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
# Work Indexed citations
1 8
2 5
3 11
4
Enhancement of Al thin wire fabrication by using electromigration in relation to the discharge resistance of the atoms
1
5 1
6
Electrical Characterization of Doped Silicon Using High-Frequency Electromagnetic Waves
3
7 6
8 5
9 125
10
Quantitative testing of small, tight backwall cracks in steel objects using ultrasonic longitudinal waves
3
11 21
12 0
13
Crack length independent evaluation of depth of small surface cracks
1
14
Quantitative nondestructive testing of small, tight cracks using ultrasonic angle beam technique
6
15
Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
2
16 6
17 1
18 2
19 2
20 1

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Rankless by CCL
2026