Byoung‐Joon Kim
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering top 10%
- Mechanical Engineering top 10%
- Polymers and Plastics top 10%
- Electronic, Optical and Magnetic Materials
- Co-authors
- Young‐Chang JooIn‐Suk ChoiYoung-Bae ParkKiwook LeeJae-Dong KimJihoon LeeKihyon HongOliver Kraft
- Topics
- Electronic Packaging and Soldering Technologies (24 papers)Advanced Sensor and Energy Harvesting Materials (19 papers)3D IC and TSV technologies (13 papers)
- Partner nations
- South KoreaUnited StatesGermany
In The Last Decade
Byoung‐Joon Kim
36 papers receiving 802 citations
Peers
Comparison fields: 5 of 49
- Electrical and Electronic Engineering 584
- Biomedical Engineering 410
- Mechanical Engineering 193
- Polymers and Plastics 176
- Electronic, Optical and Magnetic Materials 156
Countries citing papers authored by Byoung‐Joon Kim
This map shows the geographic impact of Byoung‐Joon Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Byoung‐Joon Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Byoung‐Joon Kim more than expected).
Fields of papers citing papers by Byoung‐Joon Kim
This network shows the impact of papers produced by Byoung‐Joon Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Byoung‐Joon Kim. The network helps show where Byoung‐Joon Kim may publish in the future.
Co-authorship network of co-authors of Byoung‐Joon Kim
This figure shows the co-authorship network connecting the top 25 collaborators of Byoung‐Joon Kim. A scholar is included among the top collaborators of Byoung‐Joon Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Byoung‐Joon Kim. Byoung‐Joon Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 1 | |
| 3 | 2 | |
| 4 | 5 | |
| 5 | 8 | |
| 6 | 1 | |
| 7 | 6 | |
| 8 | 46 | |
| 9 | Mechanical and Electrical Failure of ITO Film with Different Shape during Twisting Deformation | 1 |
| 10 | 24 | |
| 11 | 87 | |
| 12 | 47 | |
| 13 | 30 | |
| 14 | 48 | |
| 15 | 62 | |
| 16 | 3 | |
| 17 | 36 | |
| 18 | Thermo-Mechanical Analysis of Though-silicon-via in 3D Packaging | 1 |
| 19 | 5 | |
| 20 | Vasculitic Neuropathy in Ulcerative Colitis | 0 |
About Byoung‐Joon Kim
Byoung‐Joon Kim is a scholar working on Electrical and Electronic Engineering, Polymers and Plastics and Electronic, Optical and Magnetic Materials, having authored 41 papers that have together received 832 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (24 papers), Advanced Sensor and Energy Harvesting Materials (19 papers) and 3D IC and TSV technologies (13 papers). The work is most often cited by research in Polymers and Plastics (176 citations), Electrical and Electronic Engineering (584 citations) and Biomedical Engineering (410 citations). Byoung‐Joon Kim has collaborated with scholars based in South Korea, United States and Germany. Frequent co-authors include Young‐Chang Joo, In‐Suk Choi, Young-Bae Park, Kiwook Lee, Jae-Dong Kim, Jihoon Lee, Kihyon Hong, Oliver Kraft, Joo Yul Lee and Jeong Min Baik. Their work appears in journals such as Acta Materialia, Carbon and ACS Applied Materials & Interfaces.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.