Shouxu Wang

2.1k total citations
99 papers, 1.7k citations indexed

About

Shouxu Wang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry. According to data from OpenAlex, Shouxu Wang has authored 99 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 75 papers in Electrical and Electronic Engineering, 30 papers in Biomedical Engineering and 29 papers in Materials Chemistry. Recurrent topics in Shouxu Wang's work include Electrodeposition and Electroless Coatings (35 papers), Electronic Packaging and Soldering Technologies (29 papers) and Conducting polymers and applications (18 papers). Shouxu Wang is often cited by papers focused on Electrodeposition and Electroless Coatings (35 papers), Electronic Packaging and Soldering Technologies (29 papers) and Conducting polymers and applications (18 papers). Shouxu Wang collaborates with scholars based in China, United Kingdom and United States. Shouxu Wang's co-authors include Wei He, Guoyun Zhou, Yuanming Chen, Chong Wang, Yan Hong, Zhihua Tao, Yao Tang, Hong Zhong, Xian‐Wu Bi and Cheng‐Biao Leng and has published in prestigious journals such as Journal of The Electrochemical Society, Chemical Engineering Journal and ACS Applied Materials & Interfaces.

In The Last Decade

Shouxu Wang

96 papers receiving 1.7k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Shouxu Wang China 22 988 585 412 400 280 99 1.7k
Michaël Daenen Belgium 19 727 0.7× 1.0k 1.8× 260 0.6× 41 0.1× 93 0.3× 85 1.7k
Weiyi Lu United States 19 491 0.5× 413 0.7× 379 0.9× 126 0.3× 103 0.4× 79 1.2k
G.J.M. Janssen Netherlands 23 2.3k 2.3× 731 1.2× 252 0.6× 117 0.3× 94 0.3× 68 2.7k
Xiaoyang Cheng China 26 1.7k 1.7× 617 1.1× 788 1.9× 195 0.5× 231 0.8× 87 2.4k
Kazuhisa Sato Japan 31 710 0.7× 2.4k 4.1× 355 0.9× 1.1k 2.6× 35 0.1× 158 3.0k
Quan Zhang China 20 637 0.6× 437 0.7× 132 0.3× 142 0.4× 79 0.3× 76 1.1k
Christian Heiliger Germany 26 1.1k 1.1× 1.9k 3.3× 209 0.5× 566 1.4× 139 0.5× 79 3.1k
O. S. Yakovenko Ukraine 20 719 0.7× 1.5k 2.5× 331 0.8× 1.4k 3.4× 222 0.8× 54 2.3k
Tingting Liu China 27 2.0k 2.1× 565 1.0× 286 0.7× 647 1.6× 107 0.4× 62 2.7k
M.E.H. Maia da Costa Brazil 23 473 0.5× 1.1k 2.0× 244 0.6× 146 0.4× 58 0.2× 90 1.6k

Countries citing papers authored by Shouxu Wang

Since Specialization
Citations

This map shows the geographic impact of Shouxu Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shouxu Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shouxu Wang more than expected).

Fields of papers citing papers by Shouxu Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shouxu Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shouxu Wang. The network helps show where Shouxu Wang may publish in the future.

Co-authorship network of co-authors of Shouxu Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Shouxu Wang. A scholar is included among the top collaborators of Shouxu Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shouxu Wang. Shouxu Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
He, Wei, Hong Yan, Shouxu Wang, et al.. (2024). Investigation of the effect of electrodeposited Cu from graphite wrapped in polypyrrole film formed by chemical oxidation. Materials Today Communications. 41. 110322–110322. 1 indexed citations
2.
Chen, Yuanming, Qingyuan Li, Hong Zeng, et al.. (2024). Correction: Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging. Journal of Materials Science Materials in Electronics. 35(9). 1 indexed citations
3.
Wang, Chong, Liang Li, Zhiqiang Lai, et al.. (2024). Bromine-enhanced polarization for strengthening ultra-thin copper foil in lithium-ion battery. Journal of Materials Research and Technology. 30. 3831–3839. 9 indexed citations
4.
Zhou, Guoyun, Yan Hong, Wei He, et al.. (2023). Co-deposition of C and Ni P to fabricate high-ohmic resistor for board-level integration with on-line monitoring method. Microelectronics Reliability. 142. 114906–114906. 2 indexed citations
5.
Chen, Yuanming, et al.. (2023). UV-induced graft polymerization of polyamide-6 for electroless copper deposition. Applied Surface Science. 639. 158178–158178. 5 indexed citations
6.
Chen, Yuanming, Wei He, Yao Tang, et al.. (2023). Fabrication and characterization of nano-ZnO/CNTs/PDMS flexible pressure sensor. Journal of Materials Science Materials in Electronics. 34(21). 12 indexed citations
7.
Zhang, Yating, Zehua Wang, Wei He, et al.. (2023). Surface-enhanced Raman imaging through sprayed probes for the application in chemical visualization of methamphetamine within fingerprints. Analytical and Bioanalytical Chemistry. 415(19). 4713–4723. 2 indexed citations
8.
Zhou, Guoyun, Yan Hong, Wei He, et al.. (2022). Direct additive copper plating on polyimide surface with silver ammonia via plasma modification. Applied Surface Science. 587. 152848–152848. 11 indexed citations
9.
Wang, Chong, Yuanzhang Su, Yilin Ye, et al.. (2022). Effect of 3-mercapto-1-propane sulfonate sulfonic acid and polyvinylpyrrolidone on the growth of cobalt pillar by electrodeposition. Nanotechnology Reviews. 11(1). 1209–1218. 12 indexed citations
10.
Hong, Yan, Minli Li, Zehua Wang, et al.. (2022). Engineered optoplasmonic core-satellite microspheres for SERS determination of methamphetamine derivative and its precursors. Sensors and Actuators B Chemical. 358. 131437–131437. 16 indexed citations
11.
Yang, Chao, Xiang Tan, Zhenhai Zhang, et al.. (2022). Benzaldehyde derivatives on tin electroplating as corrosion resistance for fabricating copper circuit. Nanotechnology Reviews. 11(1). 3125–3137. 4 indexed citations
12.
Wang, Shouxu, Meng Zhang, Yan Hong, et al.. (2022). Enhanced Activity of Oxygen Reduction Reaction on Pr6O11-Assisted PtPr Alloy Electrocatalysts. ACS Applied Materials & Interfaces. 14(37). 41861–41869. 11 indexed citations
13.
Hong, Yan, Guoyun Zhou, Huaiwu Zhang, et al.. (2021). Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns. Journal of the Taiwan Institute of Chemical Engineers. 123. 254–260. 7 indexed citations
14.
Zhou, Guoyun, Jinzhong Wang, Yan Hong, et al.. (2019). Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes. Journal of the Taiwan Institute of Chemical Engineers. 100. 262–268. 15 indexed citations
15.
Chen, Yuanming, Yongqiang Li, Shouxu Wang, et al.. (2016). Bottom-up copper plating to form stacked interconnection of HDI printed circuit board for optical module application. 1 indexed citations
16.
Tao, Zhihua, et al.. (2016). Synergistic Effect of Different Additives on Microvia Filling in an Acidic Copper Plating Solution. Journal of The Electrochemical Society. 163(8). D379–D384. 21 indexed citations
17.
Tang, Yao, Wei He, Shouxu Wang, Zhihua Tao, & Lijuan Cheng. (2014). One step synthesis of silver nanowires used in preparation of conductive silver paste. Journal of Materials Science Materials in Electronics. 25(7). 2929–2933. 20 indexed citations
18.
Wang, Shouxu, et al.. (2014). UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB. Circuit World. 40(3). 85–91.
19.
Yang, Xiaojian, Wei He, Shouxu Wang, Guoyun Zhou, & Yao Tang. (2011). Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin. Journal of Materials Science Materials in Electronics. 23(1). 108–114. 30 indexed citations
20.
Wang, Shouxu. (2001). Optimization of multiobjective resource leveling using genetic algorithms.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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