Dong Hu
- Electrical and Electronic Engineering
- Materials Chemistry
- Mechanical Engineering
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Topics
- Electronic Packaging and Soldering Technologies (12 papers)Aluminum Alloys Composites Properties (11 papers)3D IC and TSV technologies (4 papers)
- Cited by
- Materials ChemistryRenewable Energy, Sustainability and the EnvironmentElectronic, Optical and Magnetic Materials
- Journals
- SHILAP Revista de lepidopterologíaApplied Physics LettersActa Materialia
- Partner nations
- ChinaNetherlandsUnited States
In The Last Decade
Dong Hu
41 papers receiving 517 citations
Peers
Comparison fields: 5 of 78
- Electrical and Electronic Engineering 221
- Materials Chemistry 210
- Mechanical Engineering 106
- Biomedical Engineering 105
- Electronic, Optical and Magnetic Materials 72
Countries citing papers authored by Dong Hu
This map shows the geographic impact of Dong Hu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dong Hu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dong Hu more than expected).
Fields of papers citing papers by Dong Hu
This network shows the impact of papers produced by Dong Hu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dong Hu. The network helps show where Dong Hu may publish in the future.
Co-authorship network of co-authors of Dong Hu
This figure shows the co-authorship network connecting the top 25 collaborators of Dong Hu. A scholar is included among the top collaborators of Dong Hu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dong Hu. Dong Hu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 3 | |
| 3 | 1 | |
| 4 | 2 | |
| 5 | 10 | |
| 6 | 12 | |
| 7 | 7 | |
| 8 | 0 | |
| 9 | 1 | |
| 10 | 1 | |
| 11 | 0 | |
| 12 | 17 | |
| 13 | 0 | |
| 14 | 9 | |
| 15 | 8 | |
| 16 | 12 | |
| 17 | 4 | |
| 18 | 14 | |
| 19 | 23 | |
| 20 | 2 |
About Dong Hu
Dong Hu is a scholar working on Ceramics and Composites, Mechanical Engineering and Electrical and Electronic Engineering, having authored 46 papers that have together received 532 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), Aluminum Alloys Composites Properties (11 papers) and 3D IC and TSV technologies (4 papers). The work is most often cited by research in Materials Chemistry (210 citations), Renewable Energy, Sustainability and the Environment (67 citations) and Electronic, Optical and Magnetic Materials (72 citations). Dong Hu has collaborated with scholars based in China, Netherlands and United States. Frequent co-authors include Guoqi Zhang, Yuhong Jin, Jiajie Fan, Mengqiu Jia, Mei Zhang, Shuo Huang, Xuejun Fan, Chao Tang, Zhen Cui and Renwu Ruan. Their work appears in journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Acta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.