Xiaoqi He
About
In The Last Decade
Xiaoqi He
44 papers receiving 421 citations
Peers
Comparison fields: 5 of 82
- Electrical and Electronic Engineering 191
- Mechanical Engineering 131
- Biomedical Engineering 65
- Materials Chemistry 62
- Polymers and Plastics 41
Countries citing papers authored by Xiaoqi He
This map shows the geographic impact of Xiaoqi He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xiaoqi He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xiaoqi He more than expected).
Fields of papers citing papers by Xiaoqi He
This network shows the impact of papers produced by Xiaoqi He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xiaoqi He. The network helps show where Xiaoqi He may publish in the future.
Co-authorship network of co-authors of Xiaoqi He
This figure shows the co-authorship network connecting the top 25 collaborators of Xiaoqi He. A scholar is included among the top collaborators of Xiaoqi He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xiaoqi He. Xiaoqi He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 5 | |
| 3 | 0 | |
| 4 | 6 | |
| 5 | 3 | |
| 6 | 16 | |
| 7 | 1 | |
| 8 | 65 | |
| 9 | 48 | |
| 10 | 7 | |
| 11 | 8 | |
| 12 | 4 | |
| 13 | 1 | |
| 14 | 0 | |
| 15 | 20 | |
| 16 | POLARITY GROWTH OF INTERMETALLIC COMPOUND INDUCED BY ELECTROMIGRATION AT THE INTERFACE BETWEEN EUTECTIC SnPb AND Ni(P) FINISHES | 4 |
| 17 | Research trend of degraded mechanisms and control ways of gold and aluminum bonding in hybrid integrated circuit | 1 |
| 18 | 0 | |
| 19 | Thermal Characterization of Multiple Module Using Superposition and FEM | 1 |
| 20 | Wire Bonding for IC Technology Materials Failure Mechanism and Reliability | 0 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.