Xiaoning Qi
- Hardware and Architecture top 5%
- Metals and Alloys top 10%
- Polymers and Plastics top 10%
- Bioengineering top 10%
- Analytical Chemistry and Sensors 6
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- Electromagnetic Compatibility and Noise Suppression 10
- Low-power high-performance VLSI design 9
- 3D IC and TSV technologies 5
- Advancements in Semiconductor Devices and Circuit Design 5
-
- Corrosion Behavior and Inhibition 17
- Graphene research and applications 6
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- Tribology and Wear Analysis 5
- Co-authors
- Xingyu WangZhibin LinDante BattocchiFujian TangR.W. DuttonVictoria J. GellingZhiping YuGaofeng Wang
- Partner nations
- United StatesChinaJapan
In The Last Decade
Xiaoning Qi
50 papers receiving 786 citations
Peers
Comparison fields: 5 of 83
- Hardware and Architecture 88
- Metals and Alloys 31
- Polymers and Plastics 155
- Bioengineering 37
- Electrical and Electronic Engineering 360
Countries citing papers authored by Xiaoning Qi
This map shows the geographic impact of Xiaoning Qi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xiaoning Qi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xiaoning Qi more than expected).
Fields of papers citing papers by Xiaoning Qi
This network shows the impact of papers produced by Xiaoning Qi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xiaoning Qi. The network helps show where Xiaoning Qi may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Xiaoning Qi, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 4 | |
| 3 | 2025 | 1 | |
| 4 | 2024 | 14 | |
| 5 | 2024 | 10 | |
| 6 | 2024 | 9 | |
| 7 | 2023 | 8 | |
| 8 | 2023 | 3 | |
| 9 | 2023 | 3 | |
| 10 | 2023 | 4 | |
| 11 | 2021 | 9 | |
| 12 | 2020 | 3 | |
| 13 | 2019 | 3 | |
| 14 | 2019 | 36 | |
| 15 | 2018 | 8 | |
| 16 | 2016 | 6 | |
| 17 | 2015 | 1 | |
| 18 | 2005 | 1 | |
| 19 | 2001 | 12 | |
| 20 | 2000 | 34 |
About Xiaoning Qi
Xiaoning Qi is a scholar working on Metals and Alloys, Bioengineering and Materials Chemistry, having authored 57 papers that have together received 813 indexed citations. Recurring topics across this work include Corrosion Behavior and Inhibition (17 papers), Electromagnetic Compatibility and Noise Suppression (10 papers), Low-power high-performance VLSI design (9 papers), Analytical Chemistry and Sensors (6 papers), Graphene research and applications (6 papers), Tribology and Wear Analysis (5 papers), 3D IC and TSV technologies (5 papers) and Advancements in Semiconductor Devices and Circuit Design (5 papers). The work is most often cited by research in Hardware and Architecture (88 citations), Metals and Alloys (31 citations) and Polymers and Plastics (155 citations). Xiaoning Qi has collaborated with scholars based in United States, China and Japan. Frequent co-authors include Xingyu Wang, Zhibin Lin, Dante Battocchi, Fujian Tang, R.W. Dutton, Victoria J. Gelling, Zhiping Yu, Gaofeng Wang, B. Kleveland and S.S. Wong. Their work appears in journals such as Progress in Organic Coatings, CORROSION, Nanomaterials, Journal of Thermal Spray Technology and Journal of Materials in Civil Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.